Uyilo lwe-PCBA ludla ngokuqala ngo Ukubanjwa kweSchematic, ilandelwe ngu Ukubekwa kwePCB, Indlela, I-DRC (Ukuhlolwa kweMithetho yoYilo)kunye Uvavanyo lwe-DFM, emva koko iziphumo Iifayile zeGerber, Iifayile ze-NC Drill, I-BOM (uMqulu weZixhobo)kunye Umzobo weNdibano. Kwimizobo enzima, I-HDI PCB iteknoloji kunye ii-microvias ezigrunjwe nge-laser kwaye i-lamination elandelelanayo kunokufuneka.

Iifayile zokufaka eziphambili ziquka:

• Uluhlu lweNet
• Umzobo woomatshini
• Iphepha ledatha leCandelo
• Uxwebhu lokukwazi ukusebenza kwenkqubo (ubuncinane bobubanzi/isithuba somkhondo, ubungakanani obuncinci bomngxuma, ububanzi bedama lemaski yesolder, iimfuno zolawulo lwe-impedance)

Iifayile zemveliso eziphambili ziquka:

• I-Gerber RS-274X okanye I-ODB++
• Ifayile ye-NC Drill
• Khetha & Beka Ifayile
• I-Stencil Gerber
• Ingxelo yeNqaku loVavanyo
• Umzobo weNdibano kunye neFayile yeSilkscreen

2.1 Imigaqo yokubekwa

Ukubekwa sisiseko soyilo lwe-PCBA kwaye kuchaphazela ngokuthe ngqo Umgangatho wokuhambisa imiqondiso, Ukusebenza kobushushukunye Ukwenziwa kwezintoUkubekwa kwindawo efanelekileyo kubalulekile i-PCB yolawulo lwe-impedance uyilo kunye neesekethe zedijithali ezikhawulezayo.

• Ukwahlulahlula okuSebenzayo: Yahlula iindawo zonxibelelwano ze-analog, zedijithali, zamandla, kunye nesantya esiphezulu ukuze uphephe ukuphazamiseka.
• Ukuhamba kweSignali: Beka izinto kwicala lokuhamba kwesignali ukuze unciphise indawo yokunqumla kunye nendawo yokujikeleza.
• Eyona nto ibalulekileyo kwiCandelo eliPhambili: Beka iimodyuli ze-MCU/FPGA/SoC, DDR, clock, kunye ne-power kuqala.
• Ukubekwa komda: Izihlanganisi, amaqhosha, kunye nee-LED ezikufutshane nemiphetho yebhodi ukuze kuhlangatyezwane neemfuno zoomatshini.
• Uyilo lweThermal: Izixhobo ezinamandla aphezulu kufutshane nemijelo yokusasaza ubushushu okanye ii-thermal pads; yongeza ubushushu ngokusebenzisa ii-arrays phantsi kwezinto ezishushu.

2.2 Izinto ezibalulekileyo zokuhambisa umzila

• Ububanzi beTrace kunye noBuchule bangoku: Ububanzi bomkhondo obuyi-0.5 mm kwi-1 oz yobhedu ithwala malunga ne-1 A. Ukuze ufumane amandla aphezulu, sebenzisa ubhedu okanye ubunzima bobhedu obunzima.
• Isibini esahlukileyoI-USB, i-HDMI, i-LVDS, i-Ethernet iyafuneka Ukulinganisa Ubude, Izithuba Ezilinganayokunye Ukudibanisa Okuqinileyo ukugcina ukuthembeka kwesignali kwaye unciphise ukulahleka kokufakwa kwaye ilahleko yokubuyisela.
• Ukuphazamiseka okuLawulwayo: Imiqondiso yesantya esiphezulu ifuna i-impedance ephawulekayo ebalwe ukusuka kwi-stack-up; amaxabiso aqhelekileyo yi-50 Ω enesiphelo esinye kunye ne-100 Ω umahluko. Uphononongo lobunjineli kufuneka lubandakanye ulawulo lwe-impedance ukuqinisekiswa.
• Indlela Yokubuya: Qinisekisa ukuba iplane epheleleyo yesalathiso iyasebenza ukuze uphephe iingxaki ze-EMI eziqhekekileyo; yongeza ii-vias zokuthunga kufutshane notshintsho lwemaleko.
• Nge: Nciphisa ii-vias ezikhawulezayo; sebenzisa Ukubhola Umva okanye IiVias ezingaboniyo/ezingcwatywe xa kuyimfuneko. Kwimizobo ye-HDI, sebenzisa ii-vias ezipakishiweyo okanye ii-vias ezixineneyo kunye ukuzaliswa kobhedu.

I-DFM embi ikhokelela ekubeni Ukudibanisa iSolder, Ukubethelwa ngamatye engcwaba, Amalungu eCold Solder, Utshintsho lweCandelokunye Iibhola zeSolderUhlalutyo lwe-DFM ngaphambi kokuveliswa ngobuninzi lunceda ekukhuseleni isivuno sokuqala.

3.1 Uyilo lwePateni yoMhlaba

Iipateni zomhlaba kufuneka zihambelane IPC-7351Uyilo olufanelekileyo lwephedi lubalulekile ukuze uthembeke Indibano yePCB kwaye Indibano ye-PCBA.

• Iinxalenye ze-CHIP (0402, 0603, 0805)Ubungakanani bephedi kufuneka buhambelane nokuvulwa kwestencil kunye neprofayili yokuphinda iphume ukuze kuthintelwe ukubethelwa ngamatye.
• QFN (I-Quad Flat No-lead): Ezantsi Iphedi yobushushu kufuneka yahlulwe ukuze kuncitshiswe ukuvaleka kwamalungu kunye nokubanda; sebenzisa imaski yesolder echaziweyo (i-SMD) okanye imaski engathengiswayo echazwe (NSMD) iipads ngokufanelekileyo.
• I-BGA (i-Ball Grid Array)Ububanzi bephedi buhlala buyi-80–85% yobubanzi bebhola; ukuvuleka kwemaski yesolder kufuneka kube ngqo ukuze kuthintelwe imaski yesolder kwiphedi. Kwi-BGA ebukhali, sebenzisa idama lemaski yesolder ububanzi ≤0.1 mm okanye ususe idama ukuba kuyimfuneko.
• I-SOT/SOP/QFP: Ipitshi encinci ifuna ububanzi obaneleyo bedama lemaski yesolder ukuthintela ukubhidlika.

3.2 Isithuba kunye noQwalaselo lweCandelo

• Isithuba seendawo ezikufutshane kufuneka sihlangabezane neemfuno zokukhetha nokubeka umlomo kunye nokulungiswa kwakhona (≥0.3 mm).
• Lungelelanisa izinto ezifanayo kwicala elinye ukuze kube lula ukujonga i-AOI.
• Gcina umgama owaneleyo phakathi kwezinto ezinde nezimfutshane ukuze uphephe impembelelo yomthunzi ngexesha lokuphinda kusetyenziswe izinto.

3.3 Imaski yeSolder kunye neSilkscreen

• Idama leSolder Mask ububanzi ≥0.1 mm ukuthintela ukubhidlika.
• Isikrini sesilika Akufuneki zigqunywe ii-pads; gcina indawo engaphezulu kwe-0.2 mm.
• Ukumakishwa kwePolarity, Isalathisi sePin 1kunye Umyili weeReferensi kufuneka icace.
• Khetha umbala wemaski yesolder (oluhlaza, oluhlaza okwesibhakabhaka, omnyama, obomvu, omhlophe) ngokusekelwe kukhetho lwabathengi; qinisekisa ukuba ukuprinta kwentsomi kuyafundeka.

4.1 DFT

I-DFT ivumela uvavanyo lwe-PCBA olusebenzayo nolungabizi kakhulu kwaye ixhasa uphuhliso lweenkqubo zovavanyo kunye noyilo lwezixhobo.

• Uvavanyo lweFlying ProbeAkukho mfuneko yesixhobo; ilungele iiprototypes kunye neebhetshi ezincinci.
• I-ICT (Uvavanyo oluSekethe): Ifuna amanqaku ovavanyo kunye nezixhobo; ifanelekile kwivolumu ephezulu. Siyila iipateni zamanqaku ovavanyo ngenkuthalo eyaneleyo.
• I-FCT (Uvavanyo lweSekethe eSebenzayo): Iqinisekisa ukusebenza kwe-PCBA yokwenyani.
• Ukuskena kweMida (JTAG): Isebenzisa i-logic yovavanyo lwe-chip eyakhelwe ngaphakathi ukunciphisa amanqaku ovavanyo olubonakalayo.

Iimfuno ze-DFT:

• Ububanzi bendawo yovavanyo ≥0.8 mm, isithuba ≥1.27 mm.
• Sabalalisa amanqaku ovavanyo kwelinye icala xa kunokwenzeka.
• Gcina amanqaku ovavanyo engaphazanyiswa kwaye kude nezinto ezinde.
• Gcina iindawo zokuvavanya iinethiwekhi zombane kunye nomhlaba ukuze ukwazi ukusebenza uvavanyo olufutshane lokucima umbane kwaye umlinganiselo wevolthi yamandla.

4.2 I-DFA

I-DFA igxile ekusebenzeni kakuhle kwendibano kunye nokuthintela iimpazamo.

• Ukwenziwa kweephaneliSebenzisa Ukusika i-V (Ukufumana amanqaku e-V) okanye Ukuluma kweMpuku/Umngxuma weSitampuNgokuba indibano ye-pcb kunye nezixhobo ezixhonywe emaphethelweni, sebenzisa indlela yethebhu ngokulunywa ziimpuku.
• Isitimela sezixhobo: 3–5 mm ububanzi bokudlulisela kunye nokubeka umthuthi.
• Uphawu lweFiducial: Ubuncinane ii-fiducials zehlabathi ezi-2–3; ii-fiducials zasekuhlaleni zezixhobo ezithambileyo ezifana ne-BGA kunye ne-QFN.
• I-Poka-Yoke: Qinisekisa ukuba izihlanganisi zinendlela eyahlukileyo yokuthintela ukufakwa ngasemva.

5.1 Ukunyaniseka kweSignali (SI)

Imiba ye-SI ibandakanya Ukucamngca, Ingxoxo enqamlezileyo, Ukudubula okugqithisileyo, I-Undershootkunye I-Timeing Skew. Isantya esiphezulu Uyilo lwePCB angasebenzisa ukulinganisa kwangaphambili koyilo kwaye ukuqinisekiswa emva koyilo ukuvavanya umzobo wamehlo.

• Ukuthelekiswa kwe-Impedance: Ukupheliswa kothotho lwemvelaphi, ukupheliswa okulinganayo, okanye ukupheliswa kwe-AC.
• Ukulinganisa Ubude: Ukuhambisa idatha yeSerpentine kumaqela edatha/iidilesi zeDDR kunye neepayi ezahlukeneyo.
• Ukucinezelwa kweCrosstalk: Umthetho we-3W (isithuba ≥3× ububanzi betrace); yongeza i-guard traces kwimiqondiso ebalulekileyo.
• Buyela nge: Yongeza ii-vias zokuthunga kufutshane notshintsho lwemaleko ukuze unciphise i-loop inductance.

5.2 Ukunyaniseka kwamandla (PI)

Imiba ye-PI ibandakanya Ingxolo Yamandla, Ukuhla kweVolthikunye Ukutsiba Emhlabeni. Yenziwe kakuhle Inethiwekhi yoSasazo lwaMandla (i-PDN) ibalulekile ekusebenzeni okuzinzileyo.

• I-Decoupling Capacitor: Beka iindibaniselwano ze-0.1 µF + 10 µF kufutshane nephini nganye yombane; sebenzisa ii-capacitors ze-ESL eziphantsi ukwahlulahlula rhoqo.
• Ukwahlulahlula iPlane yamandla: Yahlula iindiza zamandla ze-analog nezedijithali; kuphephe ukunqumla iindawo eziqhekekileyo ezinemiqondiso yesantya esiphezulu.
• Indlela ye-Impedance ephantsi: Iiplani zamandla kunye nomhlaba ezikufutshane zenza i-plane capacitance; zigcina i-dielectric encinci phakathi kwamandla kunye neengqimba zomhlaba.
• Nge-Count: Ii-via ezininzi ezihambelanayo kwiindlela zamandla aphezulu; sebenzisa ii-vias ezizaliswe yikopolo kwii-vias ezinombane ophezulu.

5.3 EMC (Ukuhambelana kwe-Electromagnetic)

Izigqubuthelo ze-EMC I-EMI (Ukuphazamiseka kwe-Electromagnetic) kwaye I-EMS (Ukuchaphazeleka yi-Electromagnetic)Uphononongo lwangaphambi kokuthobela i-EMC lunokuchonga iingozi zoyilo ngaphambi kovavanyo olusesikweni.

• Umthetho we-20H: Imiphetho yeplani yamandla okubuyela umva ngesithuba se-20× somaleko ukunciphisa amasimi okuqubha.
• Ukucoca ujongano: Yongeza iiTVS, ii-common mode chokes, ii-ferrite beads, kunye nee-capacitors kwii-I/O connectors.
• UkukhuselaSebenzisa izigqubuthelo zokukhusela kwiindawo ezibuthathaka; bonelela iiphedi zokumisa umhlaba yokuncamathisela ikhaka.
• Ikristale kunye newotshiAkukho ndlela yokuhambisa izinto phantsi kweekristale; sebenzisa iindlela zokukhusela kwaye ugcine iindlela zewotshi zimfutshane.

5.4 Uyilo lwe-HDI PCB

Kwimizobo enoxinano olukhulu, I-HDI PCB iteknoloji kunye ii-microvias ezigrunjwe nge-laser, ii-vias ezingaboniyokunye ii-vias ezingcwatyiweyo ivumela izinto ezincinci zesimo kunye noxinano oluphezulu lwendlela. Izinto eziphambili ekufuneka ziqwalaselwe:

• Umlinganiselo wobungakanani beMicrovia ngesiqhelo ≤1:1.
• Sebenzisa ii-microvias ezihlanganisiweyo kwiinguqu zemaleko kwiindawo ezinoxinano olukhulu.
• I-lamination elandelelanayo Inkqubo ivumela iileya ezininzi ze-microvia.
• Nge-in-pad kunye ukuzaliswa kobhedu kwaye ucwangciso kwi-BGA fanout.

6.1 Uyilo lwe-BGA

Uyilo lwephedi ye-BGA luchaphazela ngokuthe ngqo isivuno se-soldering kwi Indibano yePCB kwaye Indibano ye-PCBA, ingakumbi kwizicelo ze-BGA ezicwangcisiweyo.

• Ububanzi bephedi ≈0.8–0.85× ububanzi bebhola (umz., iphedi ye-0.25 mm yebhola ye-0.3 mm).
• Ukuvulwa kwemaski eyongezwayo kukhulu kunephedi ngo-0.025–0.05 mm kwicala ngalinye.
• I-NSMD (iMask engeyiyo eSolder echazwe) okanye I-SMD (iMask yeSolder ichazwe); I-NSMD ixhaphakile kwi-BGA ethambileyo.
• IiFanout vias eziyi-0.2 mm/0.1 mm okanye ngaphantsi; sebenzisa Nge-Via-in-Pad kunye I-Copper Ezaliswe / Ezaliswe yiResin ukuthintela ukutshixa kwe-solder.
• Yongeza iimpawu zokuthembeka zasekuhlaleni kufutshane ne-BGA ukuze kubekwe ngokuchanekileyo.

6.2 Uyilo lwe-QFN

Iipakethe ze-QFN (Quad Flat No-lead) zifuna uyilo olucokisekileyo lwephedi yobushushu.

• Yahlula i-thermal pad ibe zii-pads ezincinci ezininzi okanye sebenzisa i-pad enye ene-stencil apertures ezihlukeneyo ukuze unciphise ukuvaleka kwe-void.
• Yandisa ii-pin pads zibe yi-0.2–0.3 mm ngaphaya komphetho wephakheji ukuze uhlolwe yi-AOI.
• Sebenzisa Ukufaka iResin okanye Ukuzaliswa kweCopper kwii-thermal pad vias ukuthintela ukutshixiza kwe-solder.
• Kwi-QFN enamandla aphezulu, yongeza ubushushu nge-array ukuxhuma kwiiplani zobhedu zangaphakathi.

6.3 0402 / 0201 / 01005 Iinxalenye ezincinci

• 0402 isithuba sephedi: 0.4–0.5 mm; 0201: 0.25–0.3 mm; 01005: 0.15–0.2 mm.
• Sebenzisa izivalo zestencil zebhola ezichasene ne-solder (ezinongiweyo okanye ezincitshisiweyo).
• Nika amanqaku afanelekileyo okuqinisekisa ukuchaneka kwendawo ebekwe kuyo.
• Cinga ukukhupha iglu ukuhlanganiswa okumacala amabini okunezixhobo ezinzima.

7.1 Uyilo lwe-Stencil Aperture

Uyilo lwe-stencil aperture lugqiba ngokuthe ngqo ukuprinta ipaste yesolder umgangatho kwaye kufuneka ulungiselelwe i-PCBA nganye.

• Ubukhulu beStencil: 0.1–0.15 mm eqhelekileyo; 0.08 mm kwiinxalenye ezincinci; 0.2 mm zamandla aphezulu.
• Umlinganiselo wendawo: Indawo yokuvula/indawo yodonga evulekileyo > 0.66.
• Umgangatho wento: Ububanzi bembobo / ubukhulu bestencil > 1.5.
• Ii-Apertures ezikhethekileyo: Iphedi yobushushu ye-QFN iifestile ezincinci ezininzi; i-BGA ejikelezayo okanye enesikwere; iimbobo ezineembobo zebhola ezichasene ne-solder zezixhobo ze-chip.
• Cinga istencil yenyathelo kwiisayizi ezixutyiweyo zezixhobo (umz., istencil etyebileyo kwiindawo ezinombane ophezulu, ebhityileyo kwiindawo ezinomphezulu ocolekileyo).

7.2 Ukujika kwakhona kunye nokutywina amaza

• Ukunyibilika kwakhona kweSoldering: Kwizinto ze-SMT; ifuna i-SMT efanelekileyo iprofayili yobushushu (fudumeza, faka amanzi, phinda uwagcwalise, upholise). Sebenzisa ukuphinda kuphume initrogen ukuphucula ukumanzisa nokunciphisa i-oxidation.
• Ukutywina kwamaza: Kwizinto ezisebenzisa umngxuma odlulayo (i-DIP) kunye nenkqubo yeglu ebomvu ye-SMT.
• Ukunyibilikisa Amaza Okukhethayo: Ukutshixa okulungiselelwe iindawo ezingaphakathi; kulungele iibhodi zobuchwepheshe obuxutyiweyo.
• Inkqubo Engenalo IlotheI-SAC305 solder paste; ubushushu bokuphinda ubuye kwincopho yi-235–250 °C. Ukugqitywa komphezulu okuqhelekileyo kubandakanya i-HASL engenalo ilothe, VUMELANA, ISebe loMlilo lamavolontiya, isilivere yokuntywiliselwakunye itini yokuntywilisela.

7.3 Indibano Exutyiweyo

Hlanganisa i-SMT reflow kunye ne-DIP wave soldering, okanye sebenzisa I-Pin-in-Cola (i-PIP) kwiinxalenye eziphuma kwimingxunya ephinda iphume.

8.1 Iindlela zokudibanisa iiphaneli

• Ukusika i-V (Ukufumana amanqaku e-V): Ixabiso eliphantsi; kwiibhodi eziziingxande ezingenazo izinto ezisemacaleni.
• Ukuluma kweMpuku/Umngxuma weSitampu: Kwiibhodi ezingaqhelekanga okanye izinto ezisemaphethelweni; sebenzisa indlela yethebhu kunye ukulunywa ziimpuku.
• Ibhuloho + Ukuluma Kwegundane: Idibanisa amandla kunye nokukhululeka kokuhlukana.

8.2 Izixhobo zoRail kunye noPhawu lweFiducial

• Ububanzi bereli yezixhobo: 3–5 mm.
• Uphawu oluyi-fiducial: 1 mm ububanzi, ukuvulwa kwemaski yesolder eyi-2–3 mm, ukugqitywa kwetini yegolide okanye yokuntywila.
• Iingxelo zasekuhlaleni zezixhobo ze-BGA/QFN fine-pitch.

8.3 Ubungakanani bePaneli kunye nobungakanani

• Ubungakanani bephaneli ngaphakathi kwemida ye-oven yokuthatha nokubeka kunye nokuphinda uyifake (≤400 mm × 400 mm).
• Lungelelanisa ukusebenza kakuhle kunye nokusetyenziswa kwezinto; thintela ukuqhekeka.
• Sebenzisa iithebhu eziqhekekayo okanye iindawo zokubeka ezihanjisiweyo ukunciphisa uxinzelelo ngexesha lokususa iipaneli.

9.1 Ukuhlolwa koMbane

• I-DRC ayinazo iimpazamo ezibulalayo.
• Ukuhambelana kobude besignali ebalulekileyo, ukuthintela, isithuba.
• Inethi yamandla ngokusebenzisa inani kunye nomthamo wangoku.
• Ukulinganisa ukuthembeka kwesignali Iziphumo ziyahlangabezana neemfuno zedayagram yamehlo.

9.2 Uvavanyo lwe-DFM

• Ubungakanani bephedi ngokwe-IPC-7351.
• Umgama phakathi kweendawo uhlangabezana neemfuno eziphantsi zokukhetha nokubeka.
• Idama lemaski yesolder, isikrini sesilika, uphawu lwe-polarity lucacile.
• Ukuvulwa kwestensile kuhambelana nomlinganiselo wendawo.
• Ukwenziwa kweephaneli kwaye umzila wezixhobo ekhoyo.

9.3 Ukuhlolwa kwe-DFT

• Uvavanyo olugubungela iinethiwekhi ezibalulekileyo.
• Amanqaku ovavanyo akaphazanyiswa.
• Ukwenzeka kwezixhobo ze-ICT.

9.4 Ukujonga Ukudibanisa

• Kukho ireyila yezixhobo kunye neempawu zobungqina.
• Indlela yokwenza iiphaneli ifanelekile.
• Umgama wecandelo ukusuka kwi-V-cut ≥0.5 mm.

9.5 Ukugqibelela kwamaxwebhu

• Amagama e-Gerber layer asemgangathweni.
• Amanani eenxalenye zeBOM, iipakeji, ubungakanani obuchanekileyo.
• Khetha kwaye ubeke ifayile efana neBOM.
• Ifayile yestencil ihambelana noyilo lwePCB.

Kwiimveliso ezindala okanye eziphelelwe lixesha Iibhodi zesekethe ze-PCBA, Ubunjineli obubuyela umva be-PCBA ingenza kwakhona iifayile ze-schematics, i-BOM, kunye ne-Gerber kwiibhodi ezibonakalayo kwaye iqhagamshele idatha efunyenweyo kwi-new Uyilo lwePCB kwaye Indibano ye-PCBA indlela yokusebenza.

Inkqubo yethu yobunjineli obubuyela umva ibandakanya:

• Ukuhlolwa kwemifanekiso yebhodi kunye ne-X-ray ukwenza imephu yeeleya zangaphakathi.
• Ukuchongwa kwecandelo kunye nokukhutshwa kweBOM kuquka nokutshintshwa kwamalungu aphelelwe lixesha.
• Ukubanjwa kwesicwangciso ukusuka kwi-netlist reconstruction.
• Uyilo lwePCB ngokuphuculwa kwe-DFM.
• Indibano yePCBA yomzekelo kunye novavanyo olusebenzayo.

Iinkonzo ezongezelelweyo ezinexabiso elongezelelekileyo:

• Ukwaleka okucwangcisiweyo kwiindawo ezinobungozi.
• Ukubumba imbiza kunye nokufaka i-capsulation ukumelana nokungcangcazela.
• Ukuzalisa ngaphantsi kwiiphakheji ze-BGA kunye ne-CSP.
• Ukulungiswa kwakhona kusetyenziswa isikhululo sokuhlaziya i-BGA.
• Uphuhliso lovavanyo olusebenzayo yePCBA eyenziwe ngokwezifiso.