PCBA dilanni bɛ daminɛ cogoya la ni Skema minɛcogo, o kɔfɛ PCB Ladonni, . Sira-sira-ko, . RDC (Design sariya sɛgɛsɛgɛli) ., ani DFM Sɛgɛsɛgɛli, o kɔfɛ bɔliw Gerber ka Filenw, . NC Drill Filɛw, . BOM (Bill of Materials) ., ani Jamalajɛ Ja min bɛ kɛ. Walasa ka dilancogo gɛlɛnw sɔrɔ, . HDI PCB ye fɛɛrɛ kuraw ni microvias minnu bɛ kɛ ni laser ye ani lamination (lamini) min bɛ tugu ɲɔgɔn kɔ bɛ se ka kɛ wajibi ye.

Core input files ye ninnu ye:

• Netlist (Netlist) ye
• Ja min bɛ kɛ ni masinw ye
• Component Datasheet (Dɔnniyasɛbɛn) min bɛ sɔrɔ
• Taabolo Seko ni dɔnko Sɛbɛn (trace bonya/yɔrɔ hakɛ fitinin, dingɛ hakɛ fitinin, solder mask barazi bonya, impedance control wajibiyalenw)

Koro bɔli dosiyew ye ninnu ye:

• Gerber RS-274X ye baara kɛ walima ODB++ ye
• NC Drill File ye
• Pick & Place Dosiyɛri
• Stencil Gerber ye baara kɛ
• Kɔrɔbɔli Point Rapport
• Assemblage Dessin & Sikscreen File

2.1 Yɔrɔw bilali sariyakolow

Yɔrɔ bilali ye PCBA dilanni jusigilan ye wa a bɛ nɔ bila a yɛrɛ la Siginidenw ka sirako ɲumanya, . Baarakɛcogo min bɛ kɛ ni funteni ye, ani Dilancogo ɲuman. A bilali cogo bɛnnen na, o nafa ka bon kosɛbɛ impedansi kɔlɔsili PCB dilancogo ani ciriw nizɛri teliyaba.

• Baarakɛcogo Tilacogo: Aw bɛ analozi, nizɛri, fanga ani teliyaba ɲɔgɔndan yɔrɔw fara ɲɔgɔn kan walasa aw kana fɛnw tiɲɛ.
• Siginidenw ka Flow: Aw bɛ yɔrɔw bila taamasiyɛn bolicogo siratigɛ la walasa ka tɛmɛsira ni jiribolo yɔrɔ dɔgɔya.
• Kɔrɔlen Component Priorité (Yɔrɔ kɔrɔlen).: Aw bɛ MCU/FPGA/SoC, DDR, wagati, ani fanga moduluw bila fɔlɔ.
• Edge Placement (dakunw bilali).: Jɛɲɔgɔnya, butɔni ani LED minnu bɛ pankurun dakunw kɛrɛfɛ walasa ka masinw ka ɲininiw dafa.
• Layout (Layout) min bɛ kɛ ni funteni ye: Fanga-yɔrɔ minnu bɛ funteni-bɔyɔrɔw walima funteni-minɛnw kɛrɛfɛ; ka fara kan thermal via arrays (sɛnɛfɛnw) fɛ fɛnw jukɔrɔ minnu ka timi.

2.2 Siracogo nafamaw

• Trace Width & Sisan Seko ni dɔnko: 0,5 mm trace width on 1 oz copper bɛ 1 A ɲɔgɔn ta. Walasa ka kuran caman sɔrɔ, aw bɛ a kɛ kuran min bɛ kɛ walima nɛgɛ girinya minnu ka bon.
• Diferential Pair (Pair) min bɛ danfara don: USB, HDMI, LVDS, Etɛrinɛti wajibiyalen don Janya bɛnkan, . Yɔrɔ kelen-kelenw ni ɲɔgɔn cɛ, ani Couplage sirilen ka mara taamasiɲɛw dafalen ani ka dɔgɔya doncogo bɔnɛ ani segin bɔnɛ.
• Impedansi min bɛ kɔrɔsi: Teliyaba taamasiɲɛw bɛ jogo impedansi de wajibiya min jatebɔlen don ka bɔ stack-up la ; nafa minnu bɛ sɔrɔ ɲɔgɔn fɛ olu ye 50 Ω dakun kelen ye ani 100 Ω danfara. Ɛntɛrinɛti seginnkanni ka kan ka kɛ impedansi kɔlɔsili sɛgɛsɛgɛli.
• Segin-ka-bɔnye sira: Ka sɛgɛsɛgɛli kɛ awiyɔn dafalen dɔ la walasa ka pankurun tilalen EMI koɲɛw bali ; ka fara kan stitching vias (sɔgɔli vias) ye kɛrɛfɛ layɛrɛ jiginniw.
• Fɛ: Ka teliyaba viaw dɔgɔya ; k'a nafa bɔ a la Back Drilling (Kɔ̀rɔbalen). walima Fiyentɔw/Suturalenw Vias ni a mago bɛ a la. Ni HDI dilancogo don, aw bɛ baara kɛ ni a ye vias (vias) minnu bɛ ɲɔgɔn kan walima vias (vias) minnu bɛ sɛgɛn ani nɛgɛ fasa.

DFM jugu bɛ na ni... Solder Bridging (Blant Solder) ye, . Kaburuw kabakurunw, . Joints de Solder nɛnɛma, . Component Shift (Yɛlɛma) min bɛ kɛ, ani Solder Balls (Bolo minnu bɛ solder).. DFM sɛgɛsɛgɛli sani a ka kɛ jamaba ye, o bɛ dɛmɛ ka tɛmɛsira fɔlɔ sɔrɔta lakana.

3.1 Dugukolo cogoya dilanni

Dugukolo cogoyaw ka kan ka bɛn o ma IPC-7351 ye. Pad dilancogo ɲuman nafa ka bon walasa ka da a kan PCB ka lajɛba ani PCBA ka lajɛba.

• CHIP ka fɛnw (0402, 0603, 0805) .: Pad hakɛ ka kan ka bɛn stencil aperture ni reflow profile ma walasa kaburu kabakurunw kana kɛ.
• QFN (Quad Flat No-plomb) .: Jiginni Pad Thermique (Pad) ye ka kan ka tila tila walasa ka dɔ bɔ joli bɔli ni nɛnɛ na; k'a nafa bɔ a la masque de soudure ɲɛfɔlen (SMD) . walima mask min tɛ solder ye min ɲɛfɔlen don (NSMD) . pads (pads) bɛ kɛ cogo bɛnnen na.
• BGA (Bolo Gris Array) .: A ka c’a la, pad cɛmancɛ bɛ kɛ 80–85% ye bolo cɛmancɛ la; solder mask da wulicogo ka kan ka kɛ tigitigi walasa ka solder mask bali pad kan. Ni aw bɛ BGA fin-pitch, aw bɛ baara kɛ ni a ye solder mask barazi a bonya ye milimɛtɛrɛ ≤0,1 ye walima ka barazi bɔ ni a mago bɛ a la.
• SOT/SOP/QFP ye baara kɛ: Fine pitch bɛ solder mask barazi bonya bɛnnen de wajibiya walasa ka bridging bali.

3.2 Kɔnɔnafiliw ni ɲɔgɔn cɛ danfara ani u ɲɛsincogo

• Fɛn minnu bɛ kɛ kɛrɛfɛ, olu ni ɲɔgɔn cɛ ka kan ka bɛn pick-and-place nozzle ni rework wajibiyalenw ma (≥0,3 mm).
• Aw bɛ yɔrɔ kelenw labɛn sira kelen fɛ walasa AOI sɛgɛsɛgɛli ka nɔgɔya.
• Aw bɛ yɔrɔ janyalen to yɔrɔ janw ni yɔrɔ surunw cɛ walasa aw kana biɲɛ nɔ bila ji seginni waati.

3.3 Solder Mask & Siliki

• Solder Mask Barazi a bonya ye milimɛtɛrɛ ≥0,1 ye walasa ka bɔrɔw bali.
• Siliki min bɛ kɛ ni siliki ye man kan ka padw da ɲɔgɔn kan; aw bɛ a to ≥0,2 mm yɔrɔ la.
• Polarite (polarite) taamasiyɛn, . Pin 1 Taamaʃyɛn, ani Reference Designator (Dɔgɔtɔrɔso) tɔgɔla ka kan ka jɛya.
• Aw bɛ solder mask kulɛri sugandi (green, blue, black, red, white) ka kɛɲɛ ni kiliyanw ka fɛɛrɛ ye; ka a lajɛ ni nsiirin sɛbɛnni kalanni ye.

4.1 DFT (DFT) ye

DFT bɛ se ka PCBA sɛgɛsɛgɛli kɛcogo ɲuman, musaka dɔgɔman, ani ka dɛmɛ don sɛgɛsɛgɛli porogaramuw labɛnni na ani fɛnw labɛnni na.

• Flying Probe Test (Sɛgɛsɛgɛli min bɛ kɛ ni sonda ye).: Fixture si tɛ wajibiya; a ka ɲi kosɛbɛ prototypes ni batch misɛnninw na.
• TIC (Kɔrɔbɔli in-Circuit) .: A bɛ sɛgɛsɛgɛli yɔrɔw ni fixture de wajibiya ; min bɛnnen don fɔlikanba ma. An bɛ dilan sɛgɛsɛgɛli yɔrɔw misaliw ni datugulan bɛrɛbɛrɛ ye.
• FCT (Sɛgɛsɛgɛli min bɛ kɛ ni sɛrɛkili baarakɛcogo ye) .: A bɛ PCBA baarakɛcogo lakika sɛgɛsɛgɛ.
• Dancɛ sɛgɛsɛgɛli (JTAG) .: A bɛ baara kɛ ni puce test logic (puce test logique) ye min bɛ a kɔnɔ walasa ka farikolo sɛgɛsɛgɛli yɔrɔw dɔgɔya.

DFT ka wajibiw:

• Kɔrɔbɔli yɔrɔ janya ye milimɛtɛrɛ ≥0,8 ye, a ni ɲɔgɔn cɛ janya ye milimɛtɛrɛ ≥1,27 ye.
• Aw bɛ sɛgɛsɛgɛli yɔrɔw tila-tila fan kelen fɛ ni aw bɛ se.
• Aw bɛ sɛgɛsɛgɛli yɔrɔw to u kana bali ani ka u yɔrɔ janya yɔrɔ janw na.
• Kɔrɔbɔli yɔrɔw mara fanga ni dugukolo kan nɛgɛw kama walasa ka se power-off sɛgɛsɛgɛli surun ani kuran-sɛnɛ-yɔrɔ sumanikɛlan.

4.2 DFA ka baarakɛcogo

DFA bɛ sinsin fɛnw lajɛcogo ɲuman kan ani filiw kunbɛnni kan.

• Panɛli ye: K'a nafa bɔ a la V-cut (V-Scoring) . walima Sogo kinni / Timbre dingɛ. Kosɔn pcb lajɛba ni dakunw ye minnu bɛ jɛngɛ, baara kɛ ni u ye tabw ka siratigɛ la ni sosow ka kinni ye.
• Baarakɛminɛnw Rail: a bonya ye milimɛtɛrɛ 3–5 ye walasa ka fɛnw lasegin ani ka u bila yɔrɔ la.
• Fiducial Mark (Marka min bɛ dannaya la).: Diɲɛ fidusi 2–3 ni kɔ ; sigida fidusiw ka ɲɛsin minɛn finmanw ma i n’a fɔ BGA ani QFN.
• Poka-Yoke ye: Aw ye aw jija ka a lajɛ ni ɲɔgɔndanw ɲɛsincogo kɛrɛnkɛrɛnnen don walasa ka kɔsegin doncogo bali.

5.1 Siginidenw ka dafalenya (SI) .

SI koɲɛw dɔw ye Hakilijakabɔ, . Crosstalk (kɛrɛnkɛrɛnnenya la)., . Overshoot (ka tɛmɛn a dankan)., . Undershoot (sɔgɔsɔgɔninjɛ)., ani Waati Skew (Skew) ye. Teliyaba PCB dilancogo bɛ se ka baara kɛ ni a ye simulation ka kɔn layidu ɲɛ ani layidu talen kɔfɛ sɛgɛsɛgɛli ka jateminɛ kɛ ɲɛw ja jiracogo.

• Impedance (Impedance) bɛnkan: Source series termination, parallel termination, walima AC laban.
• Janya bɛnkan: Serpentine routing ka ɲɛsin DDR data/address kuluw ma ani differential pairs ma.
• Crosstalk (kɛrɛnkɛrɛnnenya la) Suppression: 3W sariya (yɔrɔ ≥3× taamasiyɛn bonya); garadi taamasiyɛnw fara a kan taamasiyɛn kɔrɔw kama.
• Segin ka na Via: Aw bɛ stitching vias fara layer transitions kɛrɛfɛ walasa ka loop inductance dɔgɔya.

5.2 Seko ni dɔnko dafalen (PI) .

PI koɲɛw dɔw ye Setigiya Mankan, . Voltage Drop (Bɔli) Drop, ani Dugukolo kan Bounce. A dabɔra ka ɲɛ Seko ni dɔnko siratigɛ la (PDN) . nafa ka bon kosɛbɛ baarakɛcogo sabatili la.

• Kondensatɛri min bɛ decouplage: Aw bɛ 0,1 μF + 10 μF faralenw bila fanga pini kelen-kelen bɛɛ kɛrɛfɛ; k'a nafa bɔ a la kondansɛri minnu ka ESL dɔgɔya ka ɲɛsin decoupling (decoupling) ma min bɛ kɛ ni frequence (fɔkan)ba ye.
• Power Plane Tilalen don: Analozi ni numérique fanga-aviyɔnw danfaralenw ; aw kana tilayɔrɔw tigɛ ni teliyaba taamasiɲɛw ye.
• Impedansi dɔgɔman sira: Se ni dugukolo-aviyɔn minnu bɛ kɛrɛfɛ, olu bɛ awiyɔn seko ni dɔnko dilan ; dielektriki finman mara fanga ni dugukolo layiniw cɛ.
• Via Count (Jateminɛ) fɛ: Via caman paralɛli ka ɲɛsin siraw ma minnu bɛ kɛ ni sisan sanfɛ; k'a nafa bɔ a la vias minnu falen bɛ nɛgɛ la ka ɲɛsin viaw ma minnu bɛ kɛ ni sisan caman ye.

5.3 EMC (Kunnafoni-falen-falen) .

EMC ka dakunw EMI (Interférence électromagnétique) . ani EMS (Electromagnétique Susceptibilité) .. EMC ka kɔn ka sariya labatoli lajɛ, o bɛ se ka dilancogo faratiw dɔn sani sɛgɛsɛgɛli ka kɛ cogo la min bɛ kɛ cogo la.

• 20H Sariya: Aw bɛ fanga pankurun dakunw don ni 20× layɛrɛ janya ye walasa ka dɔ bɔ fringing forow la.
• Filɛri min bɛ kɛ ni interface (interface) ye: Aw bɛ telewisɔnw, common mode chokes, ferrite beads, ani condensateurs fara I/O connecteurs kan.
• Lakanali: Aw bɛ finimuguw kɛ yɔrɔw la minnu ka gɛlɛn; k'a di dugukolo kan fɛnw ka ɲɛsin kalali nɔrɔli ma.
• Kristali & Waati: Sira tɛ kɛ kristalɛw jukɔrɔ; baara kɛ ni garadi taamasiyɛnw ye ani ka waati taamasiyɛnw kɛ ka surunya.

5.4 HDI PCB dilanni

Walasa ka dilanw kɛ minnu ka bon kosɛbɛ, . HDI PCB ye fɛɛrɛ kuraw ni microvias minnu bɛ kɛ ni laser ye, . fiyentɔw ka vias, ani suturalenw ka vias bɛ se ka kɛ sababu ye ka foroko misɛnninw kɛ ani ka sirako density caman sɔrɔ. Jateminɛ jɔnjɔnw:

• Microvia ɲɛda cogoya a ka ca a la ≤1:1.
• K'a nafa bɔ a la microvias (microvias) minnu bɛ ɲɔgɔn kan ka ɲɛsin layɛrɛ jiginniw ma yɔrɔw la minnu ka ca kosɛbɛ.
• Lamination (lamini) min bɛ tugu ɲɔgɔn kɔ taabolo bɛ sira di microvia layers caman ma.
• Via-in-pad ye ani nɛgɛ fasa ani planarizasiyɔn (planarisation) ye ka ɲɛsin BGA fanout ma.

6.1 BGA ka baarakɛcogo

BGA pad dilancogo bɛ nɔ bila soldering yield la k’a ɲɛsin PCB ka lajɛba ani PCBA ka lajɛba, kɛrɛnkɛrɛnnenya la BGA baarakɛcogo ɲumanw na.

• Padi cɛmancɛ ≈0,8–0,85× bololanɛgɛ cɛmancɛ (misali la, 0,25 mm pad for 0,3 mm bolo).
• Solder mask da wulilen ka bon ni pad ye ni milimɛtɛrɛ 0,025–0,05 ye kɛrɛ kelen na.
• NSMD (Maskɛ min tɛ solder ye, o ɲɛfɔlen don) . walima SMD (Masque de soudure défini) .; NSMD min ka ca ni BGA finman ye.
• Fanout vias 0,2 mm/0,1 mm walima a ka dɔgɔn; k'a nafa bɔ a la Via-in-Pad ye ani Kupu Falen / Resin Falen walasa ka solder wicking bali.
• Ka fara kan sigida fidusi taamasiyɛnw BGA kɛrɛfɛ walasa ka a bilali tigitigi.

6.2 QFN ka baarakɛcogo

QFN (Quad Flat No-lead) pakew bɛ thermal pad dilancogo ɲuman de wajibiya.

• Aw bɛ thermal pad tila ka kɛ pad misɛnnin caman ye walima aw bɛ pad kelen kɛ ni stencil dakunw tilalen don ɲɔgɔn na walasa ka dɔ bɔ bɔgɔdaga la.
• Aw bɛ pinɛw janya milimɛtɛrɛ 0,2–0,3 ka tɛmɛ pake da kan walasa ka AOI sɛgɛsɛgɛ.
• K'a nafa bɔ a la Resin Plugging (Fɔcogo min bɛ kɛ ni Resine) ye walima Kupu Falen ka ɲɛsin thermal pad vias ma walasa ka solder wicking bali.
• Ni QFN fanga ka bon, aw bɛ fara a kan thermal via array (sɛnɛfɛnw) fɛ ka jɛɲɔgɔnya kɛ ni kɔnɔna nɛgɛberew ye.

6.3 0402 / 0201 / 01005 Mikoro fɛnw

• 0402 pad janya : milimɛtɛrɛ 0,4–0,5; 0201 : milimɛtɛrɛ 0,25–0,3; 01005 : milimɛtɛrɛ 0,15–0,2.
• Aw bɛ baara kɛ ni anti-solder ball stencil dakunw ye (notched walima reduced).
• Aw bɛ fiducial marks bɛrɛbɛrɛw di walasa ka a bilali kɛ ka ɲɛ.
• Ka jate kola dicogo walasa ka ɲɔgɔn lajɛ fan fila fɛ ni fɛn girinmanw ye.

7.1 Stencil dakunw dilanni

Stencil aperture design bɛ a dantigɛ solder paste sɛbɛnni jogo ɲuman ye ani a ka kan ka kɛ cogo ɲuman na PCBA kelen-kelen bɛɛ kama.

• Stencil (Stencil) ka bonya: milimɛtɛrɛ 0,1–0,15 bɛ kɛ cogoya la; 0,08 mm ye mikro yɔrɔw ye; 0,2 mm ka ɲɛsin kuran caman ma.
• Yɔrɔ hakɛ: Dakun yɔrɔ / dawolo kogo yɔrɔ > 0,66.
• Aspect Ratio (Aspect Ratio) ye: Dakun bonya / stensili janya > 1,5.
• Apertures Kɛrɛnkɛrɛnnenw: QFN thermal pad finɛtiri misɛnnin caman ; BGA sɛrɛkili walima sɛrɛkili dɔgɔyali; anti-solder ball notched apertures ka ɲɛsin puce yɔrɔw ma.
• Ka jate senfɛ stensili ka ɲɛsin fɛnw hakɛ ɲagaminenw ma (misali la, stensili belebele min bɛ kɛ yɔrɔw la minnu ka ji ka bon, minnu ka fin ni u ka fin ye).

7.2 Reflow & Wave Soldering (Sɔrɔdasi seginni & Wave).

• Soldering (Soldering) min bɛ wele ko Reflow: Ka ɲɛsin SMT yɔrɔw ma ; bɛ ɲini cogo bɛnnen na funteni hakɛ cogoya (aw bɛ a sumaya ka kɔn, ka a su, ka a lasegin, ka a nɛnɛ). K'a nafa bɔ a la azote (azote) seginni walasa ka jisigicogo ɲɛ ani ka oksidan dɔgɔya.
• Solder (Solder) min bɛ Kɛ ni Wave ye: Ka ɲɛsin through-hole (DIP) yɔrɔw ma ani SMT kola bilenman taabolo.
• Soldering (Soldering) min bɛ kɛ ni Wave Selective ye: Sigidala soldering ka ɲɛsin through-hole components ma; a ka ɲi kosɛbɛ fɛɛrɛ ɲagaminenw ka pankurunw kama.
• Taabolo min tɛ ni plɔmu ye: SAC305 solder paste (sɔgɔdaga sɔgɔlen); ji seginni funteni hakɛ min bɛ se ka kɛ 235–250 °C ye. Surface fini minnu bɛ kɛ tuma caman na olu dɔw ye HASL min tɛ plɔmu ye, . KA BƐN, . Tasuma-fanga-jɛkulu min bɛ u yɛrɛ di, . immersion warijɛ, ani jiginɛ tintin.

7.3 Lajɛ ɲagaminen

Aw bɛ SMT reflow ni DIP wave soldering fara ɲɔgɔn kan, walima ka baara kɛ ni a ye Pin-in-Paste (PIP) ye . ka ɲɛsin through-hole yɔrɔw ma reflow kɔnɔ.

8.1 Panɛli kɛcogo

• V-cut (V-Scoring) .: Musow ka musaka ka dɔgɔ; ka ɲɛsin pankurun kɛrɛnkɛrɛnnenw ma minnu tɛ dakun yɔrɔw ye.
• Sogo kinni / Timbre dingɛ: Ka ɲɛsin pankurunw walima dakunw yɔrɔw ma minnu tɛ sabati; k'a nafa bɔ a la tabw ka siratigɛ la ani sosow ka kinni.
• Pont + Soso Bite: A bɛ fanga ni faranfasi nɔgɔya fara ɲɔgɔn kan.

8.2 Baarakɛminɛnw Rail & Fiducial Mark

• Baarakɛminɛnw nɛgɛsira bonya: milimɛtɛrɛ 3–5.
• Fidusi taamasiɲɛ : a cɛmancɛ ye milimɛtɛrɛ 1 ye, milimɛtɛrɛ 2–3 solder mask da, sanu walima jisuma tintin fini.
• Sigida fidusiw ka ɲɛsin BGA/QFN fine-pitch minɛnw ma.

8.3 Panɛli bonya & Hakɛ

• Panɛli hakɛ min bɛ pick-and-place ni reflow foro dan kɔnɔ (≤400 mm × 400 mm).
• Balannako ɲuman ni fɛnw baaracogo; aw bɛ aw yɛrɛ tanga warpage ma.
• K'a nafa bɔ a la tab minnu bɛ bɔ ɲɔgɔn na walima siraw (slots) minnu bɛ sirataama walasa ka dɔ bɔ degun na depanɛli bɔli waati.

9.1 Kuranko sɛgɛsɛgɛli

• RDC fili fagalen si tɛ yen.
• Siginiden janya kɔrɔlenw bɛnkan, impedansi, yɔrɔjan.
• Power net via jate ni sisan seko.
• Siginidenw dafalen simulation jaabiw bɛ ɲɛ jateminɛ wajibiyalenw dafa.

9.2 DFM sɛgɛsɛgɛli

• Pad hakɛ ka kɛɲɛ ni IPC-7351 ye.
• Components spacing bɛ pick-and-place wajibiyalenw dafa.
• Solder mask barazi, siliki, polarite taamasiyɛn jɛlen.
• Stencil aperture bɛ bɛn yɔrɔ hakɛ ma.
• Panɛli ye ani baarakɛminɛnw nɛgɛsira sisan.

9.3 DFT sɛgɛsɛgɛli

• Kɔrɔbɔli yɔrɔ datugucogo min bɛ kɛ nɛgɛ kɔrɔlenw kan.
• Kɔrɔbɔli yɔrɔw tɛ bali.
• TIC fixture kɛcogo.

9.4 Lajɛba sɛgɛsɛgɛli

• Tooling rail ani fiducial taamasiyɛnw bɛ yen.
• Panelization fɛɛrɛ bɛnnen don.
• Kɔnɔbara ni V-cut cɛ janya ye ≥0,5 mm ye.

9.5 Sɛbɛnw dafalenw

• Gerber layɛrɛ tɔgɔladonni sariyalen.
• BOM yɔrɔ nimɔrɔw, pakew, hakɛw bɛ tiɲɛ.
• Pick & place file bɛ bɛn BOM ma.
• Stencil file bɛ bɛn PCB dilancogo ma.

Ka ɲɛsin fɛn kɔrɔw ma walima minnu tɛ baara kɛ PCBA kafoda kafow, . PCBA ka kɔsegin injiniyɛri bɛ se ka schematics, BOM ani Gerber filew da kokura ka bɔ physique boards kɔnɔ ani ka data sɔrɔlenw siri kura la PCB dilancogo ani PCBA ka lajɛba baarakɛcogo.

An ka reverse engineering taabolo dɔw ye:

• Board ja lajɛ ani X-ray sɛgɛsɛgɛli ka kɔnɔna layɛrɛw karti.
• Kɔnɔnafiliw dɔnni ani BOM bɔli o la, yɔrɔ kɔrɔw caman cili fana sen bɛ o la.
• Skema minɛcogo ka bɔ netlist jɔli la kokura.
• PCB layidu ɲɛnajɛ ni DFM ɲɛtaa ye.
• Prototype PCBA lajɛba ani baarakɛcogo sɛgɛsɛgɛli.

Nafa wɛrɛw baara wɛrɛw:

• Datugulan min bɛ kɛ cogo la min bɛ kɛ cogo la sigida gɛlɛnw kama.
• Potting ani encapsulation (dakunw dabɔli). walasa ka yɛrɛyɛrɛli kunbɛn.
• Underfill (ka fara a kan). ka ɲɛsin BGA ni CSP pakew ma.
• Aw bɛ baara kɛ kokura ani ka a dilan baara kɛ ni BGA rework station ye.
• Baarakɛcogo sɛgɛsɛgɛli yiriwali ka ɲɛsin PCBA ladamu ma.