PCBA he mfonirifeemɔ jeɔ shishi kɛ Skematik Mɔmɔ, ni nyiɛɔ sɛɛ PCB He ni Akɛwoɔ, Gbɛtsɔɔmɔ, DRC (Kwɛmɔ Mla Mlai), kɛ DFM Kwɛmɔ, no sɛɛ lɛ, ejeɔ kpo Gerber woji, NC Drill faili, BOM (Nibii ahe nyɔmɔwoo), kɛ Kpee He Mfoniri. Kɛha ŋaa ni mli wa, HDI PCB tɛknɔlɔji kɛ laser ni akɛfoɔ nibii bibii amli kɛ lamination ni nyiɛɔ sɛɛ ekolɛ ehe baahia.

Faili ni akɛwoɔ mli lɛ ekomɛi ji:

• Nɛtlist
• Mɛkanikal Mfonirifeemɔ
• Nibii ni yɔɔ mli lɛ ahe wolo
• Nitsumɔ Hewalɛ Wolo (gbɛ ni baa shi fe fɛɛ, bu lɛ dalɛ bibioo, solder mask dam lɛɛmɔ, impedance nɔkwɛmɔ taomɔ nii)

Faili ni jɛɔ mli baa lɛ ekomɛi ji:

• Gerbɛr RS-274X aloo ODB++
• NC Dril faili
• Tsɔɔmɔ ni okɛ faili lɛ awo he
• Stɛnsil Gerber
• Kaa He Amaniɛbɔɔ
• Kpee Mfoniri kɛ Silkscreen Fail

2.1 Shishitoo Mlai ni kɔɔ He ni Akɛwoɔ Mli

Nibii ni akɛwoɔ mli lɛ ji PCBA lɛ shishitoo nɔ ni enaa mɔ nɔ hewalɛ tɛ̃ɛ Okadi Gbɛtsɔɔmɔ He Hiamɔ, Thermal Nitsumɔ, kɛ Nifeemɔ. He ni akɛwoɔ mli jogbaŋŋ lɛ he miihia waa kɛha impedansi kudɔmɔ PCB tsɔnei kɛ dijitaal kpokpai ni yaa oya.

• Nitsumɔ Mligbalamɔ: Gbalamɔ analog, digital, hewalɛ, kɛ oyaiyeli ni akɛtsuɔ nii yɛ mli lɛ mli koni nɔ ko akatsi ohe kɛjɛ he.
• Okadi Flu: Okɛ nibii awo okadi lɛ gbɛtsɔɔmɔ lɛ mli koni ekɛba crossing kɛ loop he lɛ shi.
• Nɔ ni He Hiaa ni He Hiaa: Okɛ MCU/FPGA/SoC, DDR, ŋmɛlɛtswaa, kɛ hewalɛ nibii awo mli klɛŋklɛŋ.
• Edge He ni Akɛwoɔ: Nibii ni akɛtsaa, buttons, kɛ LEDs ni bɛŋkɛɔ board lɛ naa koni akɛtsu tsɔne he taomɔ nii ahe nii.
• Tɛmal He Gbɛjianɔtoo: Nibii ni yɔɔ hewalɛ waa ni bɛŋkɛɔ hulutsoo gbɛi loo thermal pads; kɛtsa thermal kɛtsɔ gbɛjianɔtoi anɔ yɛ nibii ni mli edɔ lɛ ashishi.

2.2 Gbɛtsɔɔmɔ He Nibii ni He Hiaa

• Trace Width kɛ Amrɔ nɛɛ Hewalɛ: 0.5 mm trace width yɛ 1 oz akɔɔble nɔ hiɛɔ aaafee 1 A. Kɛha ŋmɛnɛŋmɛnɛ hewalɛ ni nɔ kwɔ lɛ, kɛ . akɔɔble kɛha loo akɔɔble tsɔnei ni tsii fe no.
• Srɔtofeemɔ ni yɔɔ Pair: USB, HDMI, LVDS, Etɛrnɛt he miihia Kɛlɛ ni kɛ ehe kpãa gbee, He ni Yeɔ Egbɔ, kɛ Kpãamɔ ni mli wa koni akɛkwɛ nɔ okadi lɛ emuuyeli ni okɛba shi ni akɛwoɔ mli lɛ laajemɔ kɛ sɛɛkuu ni elaaje.
• Impedans ni Akudɔɔ: Okadii ni yaa oya lɛ biɔ su ni ji impedance ni abuɔ he akɔntaa kɛjɛɔ stack-up mli; sɛɛnamɔi ni afɔɔ namɔ ji 50 Ω naagbee kome kɛ 100 Ω srɔtofeemɔ. Esa akɛ tsɔne he nilee mlikwɛmɔ lɛ afata he impedansi nɔkwɛmɔ nɔmimaa.
• Gbɛ ni Akuɔ Sɛɛ: Kwɛmɔ akɛ tsɔne ni akɛtaoɔ saji amli lɛ yeɔ emuu koni akafee tsɔne ni mli eja EMI saji; kɛtsa tsɔnei ni akɛkpɛɔ nii ni bɛŋkɛ layer tsakemɔi.
• Kɛtsɔ: Ha vias ni yaa oya lɛ aba shi; kɛ feeɔ Sɛɛ Driling aloo Shwilafoi/Afu Vias kɛ ehe miihia. Kɛha HDI he mfonirii lɛ, kɛtsu nii vias ni ato aloo vias ni shwieɔ shi kɛ akɔɔble ni awo mli.

DFM ni ehiii lɛ kɛ mɔ yaa Solda Gbɛjianɔtoo, Gbohiiajeŋ tɛi, Solder ni mli ejɔ, Shift ni yɔɔ mli, kɛ Solda Bɔɔlu. DFM mlipɛimɔ dani afee nibii babaoo lɛ yeɔ ebuaa ni ebuɔ yibiiwoo ni baa klɛŋklɛŋ lɛ he.

3.1 Shikpɔŋ He Mfonirifeemɔ

Esa akɛ shikpɔŋ nɔ gbɛjianɔtoi lɛ kɛ IPC-7351. Pad he mfonirifeemɔ ni sa he miihia koni anyɛ akɛ he afɔ̃ nɔ PCB kpee kɛ PCBA kpee.

• CHIP nibii (0402, 0603, 0805): Esa akɛ pad lɛ dalɛ kɛ stencil lɛ naa kɛ reflow lɛ akpã gbee koni akatswa gbonyobu.
• QFN (Kwad Flɛt ni hiɛnyiɛlɔ bɛ mli): Shishigbɛ lɛ Tɛmal Pad esa akɛ aja mli koni voiding kɛ cold joints lɛ aba shi; kɛ feeɔ soda mask shishitsɔɔmɔ (SMD) aloo mask ni jeee solda shishitsɔɔmɔ (NSMD) pads lɛ bɔ ni sa.
• BGA (bɔɔlu he gbɛjianɔtoo): Pad ŋwɛi ŋta lɛ ji 80–85% yɛ bɔɔlu lɛ ŋta lɛ mli; esa akɛ solder mask lɛ gbelemɔ lɛ afee pɛpɛɛpɛ koni akafee solder mask ni yɔɔ pad lɛ nɔ lɛ. Kɛha BGA ni yɔɔ gbee kpakpa lɛ, kɛtsu nii solda mask dam lɛlɛ ≤0.1 mm loo ajie dam lɛ kɛ ehe miihia.
• SOT/SOP/QFP: Pitch kpakpa biɔ solder mask dam lɛ mlilɛɛmɔ ni fa bɔ ni sa koni ekɛtsi bridging naa.

3.2 Nibii ni yɔɔ mli lɛ ateŋ jɛkɛmɔ kɛ gbɛtsɔɔmɔ

• Esa akɛ nibii ni bɛŋkɛ amɛhe lɛ ateŋ jɛkɛmɔ lɛ ashɛ pick-and-place nozzle kɛ nitsumɔ ekoŋŋ he taomɔ nii lɛ ahe (≥0.3 mm).
• Kɛ nibii ni tamɔ nakai lɛ ato gbɛ kome nɔ koni AOI kwɛmɔ afee mlɛo.
• Ha gbɛ ni fa bɔ ni sa yɛ nibii ni kwɔlɔ kɛ kukuji ateŋ koni akafee shadow effect yɛ reflow be mli.

3.3 Solda Mask kɛ Silkskriin

• Solda Mask Dam lɛlɛ ≥0.1 mm koni ekɛtsi blɔfofeemɔ naa.
• Silkskriin esaaa akɛ pads lɛ feɔ ekome; kwɛ ≥0.2 mm mli.
• Polarity Kadimɔ, Pin 1 Nɔtsɔɔmɔ, kɛ Nɔ ni Akɛtsuɔ Nii esa akɛ efee faŋŋ.
• Halamɔ solda mask su (eŋɔli, bluu, ediŋŋ, etsuru, eyɛŋ) yɛ nɔ ni jarayelɔ lɛ sumɔɔ; kwɛmɔ akɛ legend kalamɔ lɛ kaneɔ.

4.1 DFT

DFT haa PCBA kaa lɛ tsuɔ nii jogbaŋŋ, ni ejara waaa, ni eyeɔ ebuaa kaa gbɛjianɔtoo lɛ he nitsumɔ kɛ nibii ni akɛwoɔ mli lɛ ahe mfonirifeemɔ.

• Flying Probe Kaamɔ: Fixture ko he ehiaaa; ni hi jogbaŋŋ kɛha prototypes kɛ batch bibii.
• ICT (Kpokpaa nɔ Kaa): Ebiɔ kaa hei kɛ fixture; ni sa kɛha gbee ni naa wa waa. Wɔfeɔ mfoniri kaa he mfonirifeemɔi kɛ nɔ ni fa bɔ ni sa.
• FCT (Nitsumɔ Kpokpaa Kaa): Etsɔɔ PCBA nitsumɔ diɛŋtsɛ lɛ mli.
• Husu Skan (JTAG): Ekɛ chip test logic ni yɔɔ mli lɛ tsuɔ nii koni ekɛba gbɔmɔtsoŋ kaa hei lɛ shi.

DFT taomɔi:

• Kaa he lɛ mlijaa ≥0.8 mm, teŋ jɛkɛmɔ ≥1.27 mm.
• Jaa kaa he otii lɛ yɛ fa kome kɛji ebaahi.
• Ha kaa hei lɛ akafee nɔ ko ni tsiimɔ ko akatsi amɛ kɛjɛ nibii ni kwɔlɔ lɛ ahe.
• Reserve kaa hei kɛha hewalɛ kɛ shikpɔŋ nɔ ŋshɔŋlooi koni etsu nii hewalɛ-gbemɔ kaa kuku kɛ hewalɛ-nɔ voltaji susumɔ.

4.2 DFA

DFA lɛ kɛ ejwɛŋmɔ maa kpee nitsumɔ jogbaŋŋ kɛ tɔmɔi atsimɔ nɔ.

• Panelfeemɔ: Kɛ feeɔ V-fomɔ (V-Skoring) aloo Mous Bite / Stamp Bu. Kɛya pcb kpee kɛ edge-hanging nibii, kɛtsu nii tab gbɛtsɔɔmɔ kɛ ŋmɔtɔ ni ŋmɔɔ.
• Oketeke ni akɛtsuɔ nii: 3–5 mm lɛɛmɔ kɛha tsɔne ni akɛyaa he kroko kɛ he ni akɛwoɔ mli.
• Hekɛnɔfɔɔ Okadi: Kɛ hoo lɛ, jeŋ muu fɛɛ fiducials 2–3; akutsoŋ fiducials kɛha tsɔnei ni hi jogbaŋŋ tamɔ BGA kɛ QFN.
• Poka-Kpãa: Kwɛmɔ akɛ tsɔnei ni kɛ amɛhe kpaa gbee lɛ yɛ gbɛ krɛdɛɛ ko ni baatsi sɛɛkuu ni akɛwoɔ mli lɛ naa.

5.1 Okadi Emuuyeli (SI)

SI saji lɛ fata he Ajie, Krɔstalk, Tsɔɔmɔ fe nine, Tu shishi, kɛ Be Skew. Oyaiyeli ni nɔ kwɔ PCB he mfonirifeemɔ lɛ baanyɛ atsu nii dani ato he gbɛjianɔ lɛ he nɔkwɛmɔnɔ kɛ sɛɛ-gbɛjianɔtoo nɔmimaa koni akɛpɛi mli hiŋmɛi mfoniri.

• Impedans ni kɛ ehe kpãa gbee: Source series naagbee, parallel naagbee, loo AC naagbee.
• Kɛlɛ ni kɛ ehe kpãa gbee: Serpentine gbɛtsɔɔmɔ kɛha DDR data/adrɛs kui kɛ srɔtofeemɔi enyɔ.
• Krostalk Nɔyeli: 3W mla (sɛɛgbɛ ≥3× trace lɛlɛ); kɛ bulɔi ahe okadii ni he hiaa afata he.
• Ku sɛɛ kɛtsɔ: Kɛ tsɔne ni akɛkpɛɔ nii ni bɛŋkɛɔ layer tsakemɔi lɛ afata he koni eba loop inductance lɛ shi.

5.2 Hewalɛ Emuuyeli (PI)

PI saji lɛ fata he Hewalɛ Gbɛɛmɔ, Voltej ni baa shi, kɛ Shikpɔŋ nɔ Bouns. Afee lɛ jogbaŋŋ Hewalɛ mlijaa nɛtwɛk (PDN) he hiaa waa kɛha nitsumɔ ni yɔɔ shiŋŋ.

• Kapasitor ni ajieɔ kɛjɛɔ mli: Okɛ 0.1 μF + 10 μF ni akɛfee ekome lɛ awo hewalɛ pin fɛɛ pin he; kɛ feeɔ ESL tsɔnei ni baa shi kɛha sɛɛkuu ni yaa hiɛ waa.
• Hewalɛ Kɔɔyɔŋ Mlijaa: Analog kɛ digital hewalɛ kɔɔyɔŋ lɛlɛi ni yɔɔ srɔtoi; tsi ohe kɛjɛ gbɛjegbɛi ni mli eja ni okadii ni yaa oya yɔɔ mli lɛ afomɔ he.
• Gbɛ ni Hewalɛ ni Baa Shi: Hewalɛ kɛ shikpɔŋ nɔ ŋwɛi ŋtayaai ni bɛŋkɛ amɛhe lɛ feɔ ŋtayaai ahe hewalɛ; kwɛ dielectric bibioo ni yɔɔ hewalɛ kɛ shikpɔŋ nɔ fãi lɛ ateŋ lɛ nɔ.
• Kɛtsɔ Kanemɔ nɔ: Parallel vias babaoo kɛha gbɛi ni nɔ kwɔ ni yɔɔ amrɔ nɛɛ; kɛ feeɔ vias ni akɔɔble eyi mli obɔ kɛha vias ni yɔɔ ŋmɛnɛŋmɛnɛ beaŋ.

5.3 EMC (Elektromagnetik tsakpaa)

EMC nɔ EMI (Elektrɔmagnɛtik nibii ni tsiɔ mɔ naa) kɛ EMS (Elektromagnɛtik henumɔ). EMC mlikwɛmɔ ni afeɔ dani atsuɔ he nii lɛ baanyɛ ayoo osharai ni yɔɔ gbɛjianɔtoo lɛ mli dani aka lɛ akwɛ.

• 20H Mla lɛ: Recess hewalɛ kɔɔyɔŋ lɛlɛ lɛ naagbee kɛtsɔ 20× ŋwɛi ŋta lɛ nɔ koni ekɛba fringing ŋmɔji lɛ shi.
• Intɛfɛs Filta: Okɛ TVS, tsɔnei ni akɛtswaa tsɔnei ni afɔɔ nitsumɔ, ferrite tsɔnei, kɛ capacitors ni yɔɔ I/O tsɔnei lɛ afata he.
• Hebuu: Okɛ shielding covers atsu nii yɛ hei ni he hiaa waa lɛ anɔ; kwɛɛmɔ shikpɔŋ nɔ tsɔnei kɛha shield ni akɛkpɛtɛɔ he.
• Kristal kɛ ŋmɛlɛtswaa: Gbɛtsɔɔmɔ ko bɛ kristalo shishi; kɛ bulɔi ahe okadii atsu nii ni oha ŋmɛlɛtswaa he okadii lɛ afee kuku.

5.4 HDI PCB he mfonirifeemɔ

Kɛha tsɔnei ni mli wa waa, HDI PCB tɛknɔlɔji kɛ laser ni akɛfoɔ nibii bibii amli, shwilafoi agbɛi, kɛ vias ni afu lɛ ehaa form factors bibii kɛ gbɛtsɔɔmɔ density ni nɔ kwɔ baa. Nibii titrii ni esa akɛ asusu he:

• Mikrovia henɔ mlijaa bei pii lɛ ≤1:1.
• Kɛ feeɔ mikrovia ni ato he gbɛjianɔ kɛha layer tsakemɔi yɛ hei ni mɛi babaoo yɔɔ lɛ.
• Lamination ni nyiɛɔ sɛɛ gbɛjianɔtoo lɛ ŋmɛɔ gbɛ ni microvia fãi babaoo.
• Kɛtsɔ-yɛ-pad mli kɛ akɔɔble ni awo mli kɛ gbɛjianɔtoo kɛha BGA sɛɛsaramɔ.

6.1 BGA he ŋaa

BGA pad he mfoniri lɛ saa soldering yibiiwoo he tɛ̃ɛ kɛha PCB kpee kɛ PCBA kpee, titri lɛ yɛ BGA nitsumɔi ni yɔɔ gbee kpakpa mli lɛ amli.

• Pad lɛ mlijaa ≈0.8–0.85× bɔɔlu lɛ mlijaa (nɔkwɛmɔnɔ, 0.25 mm pad kɛha 0.3 mm bɔɔlu).
• Solder mask ni gbeleɔ da fe pad kɛ 0.025–0.05 mm yɛ fa fɛɛ fa.
• NSMD (Atsɔɔ Mask ni Jeee Solda mli) aloo SMD (Sold Mask shishitsɔɔmɔ); NSMD ni afɔɔ namɔ kɛha BGA ni yɔɔ gbee kpakpa.
• Fanout kɛtsɔ 0.2 mm/0.1 mm loo nɔ ni baa shi fe nakai nɔ; kɛ feeɔ Kɛtsɔ-yɛ-Pad mli kɛ Akɔɔble ni Eyi Mli / Resin ni Eyi Mli koni ekɛtsi solder ni fiteɔ nii lɛ naa.
• Kɛtsa maŋ lɛ mli fiducial okadii ni bɛŋkɛ BGA kɛha he ni akɛwoɔ lɛ pɛpɛɛpɛ.

6.2 QFN he mfonirifeemɔ

QFN (Quad Flat No-lead) nibii ni akɛwoɔ mli lɛ biɔ ni afee tsɔne ni haa hulu tsoɔ waa lɛ jogbaŋŋ.

• Jaa thermal pad lɛ mli awo pads bibii babaoo mli loo okɛ pad kome ni stencil mli fãi yɔɔ mli lɛ atsu nii koni ekɛba voiding shi.
• Gbalamɔ pin pads 0.2–0.3 mm kɛho paketi lɛ naa kɛha AOI kwɛmɔ.
• Kɛ feeɔ Resin ni akɛwoɔ mli aloo Akɔɔble ni Akɛwoɔ Mli kɛha thermal pad vias ni baatsi solder ni shwieɔ shi lɛ naa.
• Kɛha QFN ni he wa waa lɛ, kɛfata he thermal kɛtsɔ gbɛjianɔtoo nɔ ni kɛ akɔɔble kɔɔyɔŋ lɛlɛi ni yɔɔ mli lɛ tsaa.

6.3 0402 / 0201 / 01005 Nibii bibii ni yɔɔ mli

• 0402 ŋwɛi ŋta: 0.4–0.5 mm; 0201: 0.25 kɛyashi 0.3 milimitai; 01005: milimitai 0.15-0.2.
• Kɛ anti-solder bɔɔlu stencil apertures (ni aŋmala loo aba shi) atsu nii.
• Ha fiducial okadii ni fa bɔ ni sa kɛha he ni akɛwoɔ lɛ pɛpɛɛpɛ.
• Kwɛmɔ ekoŋŋ glu ni akɛhaa kɛha fãi enyɔ ni akɛ nibii ni tsii yɔɔ mli lɛ feɔ ekome.

7.1 Stencil Agbɛjianɔtoo He Mfoniri

Stencil aperture he mfoniri lɛ tsɔɔ tɛ̃ɛ solda paste kalamɔ kpakpa ni esa akɛ afee lɛ jogbaŋŋ aha PCBA fɛɛ PCBA.

• Stencil lɛ Mlilɛi: 0.1–0.15 mm ji nɔ ni afɔɔ namɔ; 0.08 mm kɛha nibii bibii ni akɛtsuɔ nii; 0.2 mm kɛha ŋmɛnɛŋmɛnɛ ni nɔ kwɔ.
• He lɛ mlijaa: He ni agbeleɔ / gbogbo he > 0.66.
• Aspekt Ratio: Gbɛjegbɛ lɛ mlilɛɛmɔ / stensil lɛ mlilɛɛmɔ > 1.5.
• Apertures Krɛdɛɛi: QFN thermal pad samfɛji bibii babaoo; BGA kpokpaa loo sqɛɛ shishijee; anti-solder bɔɔlu ni atswa kɛha chip mli nibii.
• Kwɛmɔ ekoŋŋ stensil ni akɛyaa kɛha nibii ni efutu lɛ adalɛi (tamɔ, stencil ni mli wa kɛha hei ni ŋmɛnɛŋmɛnɛ beaŋ ŋmɛnɛŋmɛnɛ beaŋ nibii babaoo yɔɔ, bibioo kɛha fine-pitch).

7.2 Reflow & Wave Solɛda

• Solda ni Reflow: Kɛha SMT nibii; biɔ ni sa dɔlɛ he saji (dɔlɛ, shwiemɔ, shwiemɔ ekoŋŋ, fɛ̃i). Kɛ feeɔ nitrogen ni hoɔ ekoŋŋ kɛha ŋmɔtɔ ni hi jogbaŋŋ kɛ oksideshin ni baa shi.
• Wave Solda: Kɛha kɛtsɔ-bu (DIP) nibii kɛ SMT red glue gbɛjianɔtoo.
• Soldɛŋ ni Halaa Wave: Solder ni akɛwoɔ he ko kɛha nibii ni tsɔɔ bu lɛ mli lɛ; ni hi jogbaŋŋ kɛha tɛknɔlɔji ni akɛfutuɔ tsɔnei.
• Gbɛjianɔtoo ni Lead-Bɛɛ Mli: SAC305 tsɔne ni akɛwoɔ tsɔne mli; hulutsoo be ni fe fɛɛ ni ji 235–250 °C. Nɔ ni fata he ji nɔ ni afɔɔ naa yɛ ŋwɛi naagbee HASL ni lead bɛ mli, EKOMEFEEMƆ, La He Nitsumɔhe ni Kɛ Amɛhe Eha, shika ni akɛwoɔ nu mli, kɛ tin ni akɛwoɔ nu mli.

7.3 Kpee ni Akɛfutuɔ

SMT reflow kɛ DIP wave tsɔne ni akɛwoɔ tsɔne mli lɛ afata he, loo okɛtsu nii Pin-yɛ-Kpɛtɛ (PIP) kɛha kɛtsɔ-bu mli nibii ni yɔɔ reflow mli.

8.1 Gbɛi ni Atsɔɔ nɔ Afeɔ Kuu

• V-fomɔ (V-Skoring): Shika ni baa shi; kɛha tsei ni yɔɔ ŋwɛigbɛ ni ŋwɛigbɛ nibii bɛ mli.
• Mous Bite / Stamp Bu: Kɛha tsɔnei ni bɛ gbɛjianɔtoo mli loo sɛɛgbɛ nibii; kɛ feeɔ tab gbɛtsɔɔmɔ kɛ ŋmɔtɔ ŋmɔɔ.
• Briji + Mous Bite: Ekɛ hewalɛ kɛ mligbalamɔ ni yɔɔ mlɛo lɛ feɔ ekome.

8.2 Nibii ni akɛtsuɔ nii kɛ Hekɛnɔfɔɔ Okadi

• Nibii ni akɛtsuɔ nii oketeke lɛ mlilɛɛmɔ: 3–5 mm.
• Fiducial okadi: 1 mm ŋwɛi ŋta, 2–3 mm solder mask gbelemɔ, shika tsuru loo nu mlibotemɔ tin naagbee.
• Kuu mli fiducials kɛha BGA/QFN tsɔnei ni hi jogbaŋŋ.

8.3 Panel lɛ Dalɛ kɛ Eyibɔ

• Panel dalɛ yɛ flɔnɔɔ mli husui ni akɛwoɔ mli (≤400 mm × 400 mm).
• Balance nitsumɔ jogbaŋŋ kɛ nibii ni akɛtsuɔ nii; tsi ohe kɛjɛ sɛɛkuu he.
• Kɛ feeɔ fãmɔ tabs aloo gbɛjegbɛi ni atsɔɔ nɔ koni ekɛba nɔnyɛɛ shi yɛ be mli ni afeɔ depanel lɛ.

9.1 Elektrik Kwɛmɔ

• DRC tɔmɔi ni gbeɔ mɔ bɛ mli.
• Okadi lɛ kɛlɛ ni kɛ ehe kpãa gbee, impedansi, gbɛ ni kã amɛteŋ.
• Hewalɛ net kɛtsɔ yibɔ kɛ ŋmɛnɛŋmɛnɛ nyɛmɔ nɔ.
• Okadi emuuyeli he nɔkwɛmɔnɔ nɔ ni jɛɔ mli baa lɛ kɛ hiŋmɛi mfonirifeemɔ taomɔ nii lɛ kpãa gbee.

9.2 DFM Kwɛmɔ

• Pad dalɛ kɛha IPC-7351.
• Gbɛjegbɛ ni yɔɔ mli lɛ yeɔ pick-and-to taomɔi bibii lɛ anɔ.
• Solda mask dam, silkskriin, polaritɛ kadimɔ ni mli ka shi faŋŋ.
• Stencil aperture lɛ kɛ he ni eyɔɔ lɛ mlijaa kpeɔ.
• Panelfeemɔ kɛ oketeke ni akɛtsuɔ nii nikee.

9.3 DFT Kwɛmɔ

• Kaa he ni akɛhaa yɛ ŋshɔŋlooi ni he hiaa waa lɛ anɔ.
• Kaa hei ni nɔ ko tsiii amɛ gbɛ.
• ICT nibii ni akɛtsuɔ nii lɛ ahe nitsumɔ.

9.4 Kpee Kwɛmɔ

• Tooling oketeke kɛ fiducial okadii ni yɔɔ.
• Panelization gbɛ ni jwɛŋmɔ yɔɔ mli.
• Nɔ ni yɔɔ mli lɛ teŋ jɛkɛmɔ kɛjɛ V-cut ≥0.5 mm.

9.5 Woji Ahe Nitsumɔ

• Gerber gbɛiwoo ni ato he gbɛjianɔ.
• BOM fã yibɔi, nibii ni akɛwoɔ mli, yibɔi ni ja.
• Tsɔɔmɔ ni okɛ faili ni kɛ BOM lɛ kpãa gbee.
• Stencil faili lɛ kɛ PCB he mfoniri lɛ kpãa gbee.

Kɛha gboshinii nibii loo nibii ni etsɛ PCBA kpokpaa nɔkwɛlɔi, PCBA sɛɛkuu tsɔne he nilee baanyɛ afee schematics, BOM, kɛ Gerber faili kɛjɛ gbɔmɔtsoŋ tsɔnei amli ni ekɛ saji ni ana lɛ atsa ehee nɔ . PCB he mfonirifeemɔ kɛ PCBA kpee nitsumɔ mli yaa.

Wɔ sɛɛkuu tsɔne he gbɛjianɔtoo lɛ fata he:

• Board mfonirifeemɔ kɛ X-ray kwɛmɔ koni akɛfee mligbɛ fãi lɛ ahe mfoniri.
• Nibii ni yɔɔ mli lɛ ayɔsemɔ kɛ BOM jiemɔ ni fãi ni efite ni akɛtoɔ najiaŋ lɛ fata he.
• Skematik ni akɛmɔɔ kɛjɛ netlist sɛɛkuu mli.
• PCB gbɛjianɔtoo hiɛtserɛjiemɔ kɛ DFM hiɛyaai.
• PCBA kpee he nɔkwɛmɔnɔ kɛ nitsumɔ mli kaa.

Sɛɛnamɔi krokomɛi ni akɛfata he:

• Nɔ ni akɛwoɔ nɔ ni kɛ ehe kpãa gbee kɛha shihilɛi ni mli wa waa.
• Potting kɛ enkapsula kɛha shitee-kɛ-woo.
• Yimɔ shishi kɛha BGA kɛ CSP paketii lɛ.
• Tsu nii ekoŋŋ ni osaa kɛtsɔ BGA nitsumɔhe ni akɛtsuɔ nii ekoŋŋ lɛ nɔ.
• Nitsumɔ kaa mliyaa kɛha kusum PCBA.