PCBA nhyehyɛe taa fi ase Schematic Capture a Wɔde Kyerɛw Nsɛm, a ɛno akyi no PCB a Wɔde Si Hɔ, . Ɔkwan a wɔfa so yɛ adwuma, . DRC (Nsusuwii Mmara Nhwehwɛmu) ., ne DFM Nhwehwɛmu, afei nea efi mu ba Gerber Fael ahorow, . NC Drill Fael ahorow, . BOM (Nneɛma a Wɔde Yɛ Adwuma Ho Mmara) ., ne Nhyiamu Mfoniniyɛ. Wɔ nhyehyɛe ahorow a ɛyɛ den ho no, . HDI PCB a ɛwɔ hɔ mfiridwuma ne microvias a wɔde laser ayɛ ne lamination a ɛtoatoa so ebia wɔbɛhwehwɛ.

Core input fael ahorow no bi ne:

• Netlist a wɔde kyerɛw nsɛm
• Mfiridwuma mu Mfoniniyɛ
• Component Datasheet a Wɔde Di Dwuma
• Adeyɛ ho Tumi Nwoma (asua koraa trace trɛw / ntam kwan, a ɛba fam koraa tokuru kɛse, solder mask dam trɛw, impedance control ahwehwɛde)

Core output fael ahorow no bi ne:

• Gerber RS-274X na ɔkyerɛwee anaasɛ ODB++ na ɛwɔ hɔ
• NC Drill Fael a ɛwɔ hɔ
• Pick & Fa Fael no to hɔ
• Stencil Gerber na ɔkyerɛwee
• Sɔhwɛ Nsɛntitiriw Amanneɛbɔ
• Nhyiam Mfonini & Silkscreen Fael

2.1 Nnyinasosm a wde bhy adwuma mu

Nneɛma a wɔde si hɔ ne PCBA nhyehyɛe no fapem na ɛka tẽẽ Nsɛnkyerɛnneɛ Routing Quality, . Ɔhyew mu Adwumayɛ, ne Nneɛma a wɔyɛ. Nneɛma a wɔde besisi baabi a ɛfata ho hia kɛse ma impedance control PCB a wɔde di dwuma nhyehyɛe ahorow ne dijitaal amansin a ɛkɔ ntɛmntɛm.

• Dwumadi mu Nkyekyɛmu: Tetew analog, digital, power, ne high-speed interface mmeae ahorow mu na woakwati ntwitwiridii.
• Nsɛnkyerɛnne a Ɛsen: Fa components to signal flow kwankyerɛ no so na ama crossing ne loop area no so atew.
• Nneɛma a Ɛho Hia a Ɛho Hia: Fa MCU/FPGA/SoC, DDR, dɔn, ne tumi module ahorow di kan.
• Edge a Wɔde Si Hɔ: Nkitahodi, bɔton, ne LED ahorow a ɛbɛn board anoano sɛnea ɛbɛyɛ a wobedi mfiri ahwehwɛde ahorow ho dwuma.
• Ɔhyew Nhyehyɛe: Nneɛma a ɛwɔ ahoɔden kɛse a ɛbɛn ɔhyew a wɔsɛe no anaa ɔhyew a wɔde hyɛ mu; fa ka ho thermal via nhyehyɛe ahorow wɔ nneɛma a ɛyɛ hyew ase.

2.2 Nneɛma a Ɛho Hia wɔ Routing ho

• Trace Width & Mprempren Tumi: 0.5 mm trace width wɔ 1 oz kɔbere soa bɛyɛ 1 A. Sɛ wopɛ current a ɛkɔ soro a, fa di dwuma kɔbere ma anaa kɔbere a emu duru yɛ den.
• Nsonsonoe Awarefo: USB, HDMI, LVDS, Ethernet hwehwɛ Ne Tenten a ɛne ne ho hyia, . Ntam Ntam a Ɛyɛ Pɛ, ne Nkitahodi a Ɛyɛ Den sɛ wɔbɛhwɛ so sɛnkyerɛnne kwan so nokwaredi na tew so insertion a wɔhwere ne sanba a wɔhwere.
• Impedance a Wɔhyɛ So: Ahoɔhare kɛse nsɛnkyerɛnne hwehwɛ sɛ su impedance bu akontaa fi stack-up; gyinapɛn ahorow a wɔtaa de di dwuma ne 50 Ω biako-awie ne 100 Ω nsonsonoe. Ɛsɛ sɛ mfiridwuma mu nhwehwɛmu no ka ho impedance a wɔde di dwuma nokwaredi a wɔde di dwuma.
• Ɔkwan a Wɔfa so San Kɔ: Hwɛ sɛ reference plane a edi mũ na woakwati split plane EMI nsɛm; fa ka ho stitching vias a wɔde pam ade bɛn layer nsakrae ahorow.
• Fa: Tew via ahorow a ɛkɔ ntɛmntɛm so; fa di dwuma Akyi Drilling anaasɛ Anifuraefo/Wɔasie Vias bere a ɛho hia no. Sɛ wopɛ HDI nhyehyɛe ahorow a, fa di dwuma via ahorow a wɔaboaboa ano anaasɛ vias a ɛhinhim ne kɔbere a wɔde ahyɛ mu ma.

DFM a enye no de... Solder a Wɔde Yɛ Adwuma, . Ɔboda mu abo a wɔtow, . Solder Nkwaa a Ɛyɛ Nwini, . Component Shift a Wɔde Yɛ Nneɛma, ne Solder Balls a Wɔde Yɛ Adwuma. DFM nhwehwɛmu ansa na wɔayɛ no pii boa ma wɔbɔ aba a edi kan a ɛtwam no ho ban.

3.1 Asase Nhwɛsoɔ Nsusuiɛ

Ɛsɛ sɛ asase ho nhyehyɛe ahorow di so IPC-7351 na ɛwɔ hɔ. Pad nhyehyɛe a ɛfata ho hia na ama wotumi de ho ato so PCB nhyiamu ne PCBA nhyiamu.

• CHIP Nneɛma a Wɔde Yɛ Adwuma (0402, 0603, 0805) .: Ɛsɛ sɛ pad kɛse ne stencil aperture ne reflow profile hyia na wɔakwati sɛ wɔbɛbɔ ɔboda abo.
• QFN (Quad Flat a enni kɔbere) .: Ase hɔ Ɔhyew Pad a Wɔde Yɛ Nneɛma ɛsɛ sɛ wɔkyekyɛ mu na ama nkwaa a ɛyɛ nwini ne nea ɛyɛ nwini no so atew; fa di dwuma solder mask a wɔakyerɛkyerɛ mu (SMD) . anaasɛ a ɛnyɛ solder mask a wɔakyerɛkyerɛ mu (NSMD) . pads a ɛfata.
• BGA (Ball Grid Nkyekyɛm) .: Pad ntwemu taa yɛ 80–85% wɔ bɔɔl no ntwemu; ɛsɛ sɛ solder mask bue yɛ pɛpɛɛpɛ na wɔakwati solder mask wɔ pad so. Sɛ wopɛ BGA a ɛyɛ fɛ a, fa di dwuma solder akatasoɔ dam ne tɛtrɛtɛ ≤0.1 mm anaasɛ yi dam fi hɔ sɛ ɛho hia a.
• SOT/SOP/QFP na ɛyɛ adwuma: Fine pitch hwehwɛ sɛ solder mask dam trɛw a ɛfata na amma bridging.

3.2 Nneɛma a ɛwɔ afã horow no ntam kwan & Orientation

• Ɛsɛ sɛ afã horow a ɛbɛn ho no di pick-and-place nozzle ne rework ahwehwɛde ahorow ho dwuma (≥0.3 mm).
• Fa nneɛma a ɛte saa ara hyɛ ɔkwan koro so na ama AOI nhwehwɛmu ayɛ mmerɛw.
• Ma kwan a ɛfata si nneɛma atenten ne ntiantiaa ntam na woakwati sunsuma nkɛntɛnso bere a reflow no.

3.3 Solder Mask & Silkscreen a wɔde hyɛ mu

• Solder Mask Dam a ɛwɔ hɔ ne tɛtrɛtɛ ≥0.1 mm na amma wɔasiw bridge ano.
• Silkscreen a wɔde hwɛ nneɛma so ɛnsɛ sɛ ɛkata pad ahorow so; ma ≥0.2 mm kwan a ɛda hɔ.
• Polarity Agyiraehyɛde, . Pin 1 Nsɛnkyerɛnnede, ne Nhwehwɛmu a Wɔde Kyerɛw Nsɛm ɛsɛ sɛ emu da hɔ.
• Paw solder mask kɔla (ahabammono, bruu, tuntum, kɔkɔɔ, fitaa) a egyina adetɔfo pɛ so; hwɛ hu sɛ anansesɛm tintim no betumi akenkan.

4.1 DFT a wɔde di dwuma

DFT ma PCBA sɔhwɛ a etu mpɔn, a ɛho ka sua tumi yɛ adwuma na ɛboa sɔhwɛ nhyehyɛe nkɔso ne fixture nhyehyɛe.

• Flying Probe Sɔhwɛ: Ɛho nhia sɛ wɔde fixture biara di dwuma; a eye ma prototypes ne batch nketewa.
• ICT (Nsɔhwɛ a Wɔyɛ wɔ Ɔmansin Mu) .: Ɛhwehwɛ sɛ sɔhwɛ mmeae ne fixture; a ɛfata ma ɛnne a ano yɛ den. Yɛyɛ adwini sɔhwɛ nsɛntitiriw nhwɛso ahorow a wɔde kata so sɛnea ɛsɛ.
• FCT (Adwumayɛ mu Kwansin Sɔhwɛ) .: Ɛhwɛ sɛ PCBA dwumadi ankasa yɛ nokware.
• Ɔhye so Nhwehwɛmu (JTAG) .: Ɔde chip test logic a wɔasisi mu di dwuma de tew honam fam sɔhwɛ nsɛntitiriw so.

DFT ahwehwɛde ahorow:

• Sɔhwɛ beae no ntwemu ≥0.8 mm, ntam kwan ≥1.27 mm.
• Kyɛ sɔhwɛ mmeae wɔ ɔfã biako bere a ɛbɛyɛ yiye no.
• Ma sɔhwɛ mmeae a biribiara nsiw wo kwan na twe wo ho fi nneɛma atenten ho.
• Fa sɔhwɛ mmeae sie ma tumi ne asase so asau na ama ayɛ yiye tumi-dum sɔhwɛ tiawa ne power-on voltage susuw a wɔde susuw nneɛma ho.

4.2 DFA a wde bhy mu

DFA twe adwene si nhyiamu a ɛyɛ adwuma yie ne mfomsoɔ a wɔsiw ano so.

• Panelization a wɔde yɛ nneɛma: Fa di dwuma V-twitwa (V-Nkonimdi) . anaasɛ Mouse Bite / Stamp Tokuru. Ma pcb nhyiamu ne nneɛma a ɛsensɛn anoano, de di dwuma tab kwan a wɔfa so yɛ adwuma ne mmoadabi a wɔaka wɔn.
• Tooling Rail a Wɔde Di Dwuma: 3–5 mm trɛw ma conveyor transfer ne gyinabea.
• Fiducial Mark a Wɔde Di Dwuma: Anyɛ yiye koraa no, wiase nyinaa fiducials 2–3; mpɔtam hɔ fiducials ma mfiri a ɛyɛ fɛ te sɛ BGA ne QFN.
• Poka-Yoke na ɛyɛ: Hwɛ sɛ connectors wɔ orientation soronko na amma reverse insertion.

5.1 Nsɛnkyerɛnneɛ no mudi mu kura (SI) .

SI nsɛm no bi ne Sɛso, . Crosstalk a wɔde di dwuma, . Nneɛma a ɛboro so, . Undershoot na ɛyɛ, ne Bere a Wɔde Yɛ Skew. Ahoɔhare a ɛkɔ soro PCB nhyehyɛe betumi de adi dwuma pre-layout simulation a wɔyɛ ne nhyehyɛe akyi adansedi sɛnea ɛbɛyɛ a wɔbɛsɔ ahwɛ aniwa ho mfonini.

• Impedance a ɛne ne ho hyia: Source series awiei, parallel awiei, anaa AC awiei.
• Ne Tenten a ɛne ne ho hyia: Serpentine routing ma DDR data/address akuw ne nsonsonoe abien abien.
• Crosstalk a Wɔde Siw Ano: 3W mmara (akwansin ≥3× trace trɛw); fa guard traces ka ho ma nsɛnkyerɛnne a ɛho hia.
• San kɔ Via: Fa stitching vias a ɛbɛn layer nsakrae ka ho na ama loop inductance so atew.

5.2 Tumi a Wɔde Di Dwuma (PI) .

PI nsɛm no bi ne Tumi Dede, . Voltage a Ɛkɔ fam, ne Asase so Bounce. A wɔayɛ no yiye Tumi a Wɔkyekyɛ (PDN) . ho hia kɛse ma oprehyɛn a ɛyɛ den.

• Decoupling Capacitor a wɔde hyɛ mu: Fa 0.1 μF + 10 μF nkabom gu tumi pin biara ho; fa di dwuma capacitors a ɛwɔ ESL a ɛba fam ma decoupling a ɛyɛ frequency a ɛkorɔn.
• Tumi Wimhyɛn a Wɔapaapae: Analog ne dijitaal ahoɔden wimhyɛn ahorow a ɛtetew mu; kwati sɛ wode nsɛnkyerɛnne a ɛde ahoɔhare kɛse bɛtwa mpaapaemu.
• Ɔkwan a Ɛfa Impedance a Ɛba Fam: Tumi ne asase so wimhyɛn a ɛbɛn ho no ma wimhyɛn ahoɔden tumi yɛ adwuma; kura dielectric a ɛyɛ tratraa mu wɔ tumi ne asase so ntoatoaso ntam.
• Via Count so na ɛyɛ: Parallel multiple vias ma akwan a ɛkɔ soro; fa di dwuma vias a kɔbere ahyɛ mu ma ma vias a ɛkɔ soro mprempren.

5.3 EMC (Electromagnetic Nhyiamu) .

EMC kata so EMI (Electromagnetic Ntwitwiridii) . ne EMS (Electromagnetic Nneɛma a Ɛyɛ Den) .. EMC nhwehwɛmu a wɔyɛ ansa na wɔadi mmara so no betumi ahu asiane ahorow a ɛwɔ nhyehyɛe no mu ansa na wɔasɔ ahwɛ wɔ ɔkwan a ɛfata so.

• 20H Mmara: Recess tumi wimhyɛn anoano denam 20× layer spacing so na ɛtew fringing afuw so.
• Interface Filtering a Wɔde Yɛ Nneɛma: Fa TVS, common mode chokes, ferrite beads, ne capacitors ka ho wɔ I/O nkitahodi ahorow so.
• Nneɛma a wɔde bɔ wɔn ho ban: Fa nkataso a ɛbɔ ho ban di dwuma wɔ mmeae a ɛyɛ mmerɛw; ma grounding pads a wɔde yɛ nneɛma ma kyɛm a wɔde bata ho.
• Crystal & Dɔn a Wɔde Yɛ Adwuma: Ɔkwan biara nni hɔ a wɔfa so wɔ ahwehwɛ ase; fa guard traces di dwuma na ma dɔn traces nyɛ tiaa.

5.4 HDI PCB Nsusuwii

Sɛ wopɛ mfonini ahorow a ɛyɛ density a, . HDI PCB a ɛwɔ hɔ mfiridwuma ne microvias a wɔde laser ayɛ, . anifuraefo vias, ne a wɔasie no vias ma form factors nketewa ne routing density a ɛkorɔn tumi. Nneɛma atitiriw a ɛsɛ sɛ wususuw ho:

• Microvia afã horow a ɛyɛ pɛpɛɛpɛ mpɛn pii no ≤1:1.
• Fa di dwuma microvia ahorow a wɔaboaboa ano ma layer nsakrae wɔ mmeae a nnipa pii wɔ hɔ.
• Lamination a ɛtoatoa so adeyɛ no ma kwan ma microvia layers pii.
• Via-wɔ-pad so ne kɔbere a wɔde ahyɛ mu ma ne planarization a wɔde yɛ nneɛma ma BGA fanout no.

6.1 BGA Nsusuwii

BGA pad nhyehyɛe no nya soldering aba so nkɛntɛnso tẽẽ ma PCB nhyiamu ne PCBA nhyiamu, titiriw wɔ BGA dwumadie a ɛyɛ fɛ mu.

• Pad ntwemu ≈0.8–0.85× bɔɔl ntwemu (sɛ nhwɛso no, 0.25 mm pad ma 0.3 mm bɔɔl).
• Solder mask bue kɛse sen pad denam 0.025–0.05 mm wɔ ɔfã biara.
• NSMD (Wɔakyerɛkyerɛ Akataso a Ɛnyɛ Solder Mu) . anaasɛ SMD (Solder Mask a Wɔakyerɛkyerɛ Mu) .; NSMD abu so ma BGA a ɛyɛ fɛ.
• Fanout vias a ɛyɛ 0.2 mm/0.1 mm anaa nea ennu saa; fa di dwuma Via-wɔ-Pad mu ne Kɔbere a Wɔahyɛ no Ma / Resin a Wɔahyɛ no Ma sɛnea ɛbɛyɛ a wobesiw solder wicking ano.
• Fa ka ho mpɔtam hɔ fiducial agyiraehyɛde ahorow bɛn BGA ma wɔde besi hɔ pɛpɛɛpɛ.

6.2 QFN Nhyehyeɛ

QFN (Quad Flat No-lead) packages hwehwɛ sɛ wɔde ahwɛyiye yɛ thermal pad.

• Kyɛ thermal pad no mu yɛ no pad nketewa pii anaasɛ fa pad biako a ɛwɔ stencil apertures a wɔakyekyɛ mu di dwuma na ama voiding so atew.
• Trɛw pin pads 0.2–0.3 mm kɔ akyiri sen package no ano ma AOI nhwehwɛmu.
• Fa di dwuma Resin Plugging a Wɔde Yɛ Nneɛma anaasɛ Kɔbere a Wɔde Hyehyɛ Mu ma thermal pad vias na wɔasiw solder wicking ano.
• Sɛ wopɛ QFN a ahoɔden kɛse wom a, fa ka ho thermal via nhyehyɛe a ɛka kɔbere wimhyɛn ahorow a ɛwɔ mu no ho.

6.3 0402 / 0201 / 01005 Nneɛma nketenkete a wɔde yɛ adwuma

• 0402 pad ntam kwan: 0.4–0.5 mm; 0201: 0.25–0.3 mm, ne nea ɛwɔ hɔ; 01005: 0.15–0.2 mm.
• Fa anti-solder ball stencil apertures (notched anaa wɔatew so) di dwuma.
• Fa fiducial marks a ɛdɔɔso ma ma sɛnea wɔde besi hɔ no pɛpɛɛpɛ.
• Hwɛ gluu a wɔde ma ma afã abien nhyiam a nneɛma a emu yɛ duru wom.

7.1 Stencil Aperture nhyehyeɛ

Stencil aperture nhyehyɛe no kyerɛ tẽẽ solder paste a wɔde tintim nhoma quality na ɛsɛ sɛ wɔyɛ no yiye ma PCBA biara.

• Stencil a Ɛyɛ Den: 0.1–0.15 mm a wɔtaa yɛ; 0.08 mm ma micro afã horow; 0.2 mm ma mprempren a ɛkorɔn.
• Mpɔtam Hɔ Nkyɛmu: Aperture beae / aperture ɔfasu beae > 0.66.
• Afã Nkyɛmu: Aperture trɛw / stencil kɛse > 1.5.
• Apertures Titiriw a Wɔde Yɛ Adwuma: QFN thermal pad mfɛnsere nketewa pii; BGA kurukuruwa anaa ahinanan a wɔtew so; anti-solder bɔɔl notched apertures ma chip afã horow.
• Hwɛ anammɔntu stencil ma nneɛma akɛse a wɔadi afra (sɛ nhwɛso no, stencil a ɛyɛ den ma mmeae a mprempren ahoɔden kɛse wom, teateaa ma nea ɛyɛ fɛ).

7.2 Reflow & Wave Soldering a wɔde hyɛ mu

• Reflow Soldering a wɔde yɛ adwuma: Wɔ SMT afã horow ho; hwehwɛ sɛ ɛyɛ nea ɛfata ɔhyew ho nsɛm (preheat, soak, san fa nsu, ma onwini). Fa di dwuma nitrogen a ɛsan kɔ nipadua no mu ama nsuo a ɛkɔ anim ne oxidation a ɛso atew.
• Asorɔkye Soldering: Na through-hole (DIP) afã horow ne SMT kɔkɔɔ gluu nhyehyɛe.
• Asorɔkye Soldering a Wɔpaw: Localized soldering ma through-tokuru afã horow; eye ma mfiridwuma a wɔadi afra board ahorow.
• Adeyɛ a Kɔbere Nni Ho: SAC305 solder a wɔde yɛ aduru; ɔhyew a ɛsen biara a ɛsan ba no yɛ 235–250 °C. Nneɛma a wɔtaa de wie wɔ soro no bi ne HASL a kɔbere nnim, . PENE, . Ogya Dwumadibea a Wotu Wɔn Ho Ma, . dwetɛ a wɔde hyɛ nsu mu, ne tin a wɔde hyɛ nsu mu.

7.3 Nhyiamu a wɔadi afra

Fa SMT reflow ne DIP asorɔkye soldering bom, anaa fa di dwuma Pin-in-Paste (PIP) a wɔde hyɛ mu . ma through-hole components wɔ reflow mu.

8.1 Akwan a wɔfa so yɛ Panelization

• V-twitwa (V-Nkonimdi) .: Ɛka a ɛba fam; ma ntaaboo a ɛyɛ ahinanan a enni anoano afã horow.
• Mouse Bite / Stamp Tokuru: Wɔ boards anaa edge components a ɛnkɔ so daa ho; fa di dwuma tab kwan a wɔfa so yɛ adwuma ne mmoadabi a wɔka wɔn.
• Bridge + Mouse a Wɔka no: Ɛka ahoɔden ne mpaapaemu a ɛyɛ mmerɛw bom.

8.2 Nnwinnadeɛ Rail & Fiducial Mark

• Nnwinnade keteke kwan no trɛw: 3-5 mm.
• Fiducial agyiraehyɛde: 1 mm diameter, 2–3 mm solder mask bue, sika kɔkɔɔ anaa immersion tin wie.
• Mpɔtam hɔ fiducials ma BGA/QFN fine-pitch mfiri.

8.3 Panel Kɛseɛ & Dodow

• Panel kɛse wɔ pick-and-place ne reflow fononoo anohyeto mu (≤400 mm × 400 mm).
• Kari pɛ wɔ adwumayɛ mu yiyedi ne nneɛma a wɔde di dwuma; kwati sɛ wobɛkɔ akodi.
• Fa di dwuma breakaway tabs a ɛwɔ hɔ anaasɛ routed slots a wɔde fa kwan so sɛnea ɛbɛyɛ a wɔbɛtew adwennwen so bere a wɔreyɛ depaneling no.

9.1 Electrical Nhwehwɛmu

• DRC mfomso biara nni hɔ a edi awu.
• Nsɛnkyerɛnne tenten a ɛho hia a ɛne ne ho hyia, impedance, spacing.
• Power net via count ne mprempren tumi.
• Nsɛnkyerɛnneɛ mudi mu kura ho simulation nea efi mu ba no di aniwa mfonini ahwehwɛde ahorow ho dwuma.

9.2 DFM Nhwehwɛmu

• Pad kɛse sɛnea IPC-7351 te.
• Component spacing di ahwehwɛde a ɛba fam koraa a ɛfa pick-and-place ho dwuma.
• Solder akataso dam, silkscreen, polarity agyiraehyɛde pefee.
• Stencil aperture hyia mpɔtam hɔ nsusuwii.
• Panelization a wɔde yɛ nneɛma ne tooling keteke kwan so akyɛdeɛ.

9.3 DFT Nhwehwɛmu

• Sɔhwɛ point coverage wɔ asau a ɛho hia so.
• Sɔhwɛ nsɛntitiriw a biribiara nsiw wɔn kwan.
• ICT fixture a wobetumi ayɛ.

9.4 Nhyiamu Nhwehwɛmu

• Tooling keteke ne fiducial agyiraehyɛde ahorow a ɛwɔ hɔ.
• Panelization kwan a ntease wom.
• Component kwan a ɛda V-cut ≥0.5 mm.

9.5 Nwoma a wde bhy mu no nyinaa

• Gerber layer din a wɔde too gua no yɛ nea wɔahyɛ da ayɛ.
• BOM fã nɔma, nneɛma a wɔde ahyɛ mu, dodow a ɛyɛ pɛpɛɛpɛ.
• Pick & place fael no ne BOM hyia.
• Stencil fael no ne PCB nhyehyɛe hyia.

Wɔ nneɛma a wɔde ayɛ agyapade anaasɛ nea ne bere atwam ho PCBA amansin board ahorow, . PCBA akyi mfiridwuma betumi asan ayɛ schematics, BOM, ne Gerber fael ahorow afi honam fam board ahorow so na wɔde data a wɔasan anya no abɔ foforo PCB nhyehyɛe ne PCBA nhyiamu adwumayɛ nhyehyɛe.

Yɛn reverse engineering nhyehyɛe no bi ne:

• Board mfoninitwa ne X-ray nhwehwɛmu sɛ wɔde bɛyɛ map a ɛwɔ mu layers.
• Component identification ne BOM a woyi fi mu nea ɛka ho ne afã horow a ne bere atwam a wɔde besi ananmu.
• Schematic capture a wɔde kyere nneɛma efi netlist a wɔsan yɛ no foforo so.
• PCB nhyehyɛe ahomegye ne DFM nkɔso ahorow.
• Prototype PCBA nhyiamu ne dwumadi ho sɔhwɛ.

Nnwuma foforo a ɛsom bo:

• Conformal a wɔde kata so ma nneɛma a atwa yɛn ho ahyia a emu yɛ den.
• Potting ne encapsulation a wɔde hyɛ mu sɛnea ɛbɛyɛ a wobetumi agyina wosow ano.
• Underfill ahyɛ mu ma ma BGA ne CSP packages.
• San yɛ adwuma na siesie de BGA rework station di dwuma.
• Dwumadi mu sɔhwɛ nkɔso ma PCBA a wɔahyɛ da ayɛ.