Umklamo we-PCBA uthoma nge- Ukuthathwa kwehlelo, kulandele Ukubekwa kwe-PCB, Ukukhamba, I-DRC (Ukuhlola Umthetho Wokuklama), kunye Hlola i-DFM, bese kuphuma Amafayela we-Gerber, Amafayela we-NC Drill, I-BOM (Umthethosivivinywa wezinto), kunye Umdwebo wokuhlanganisa. Ngemiklamo eyinkimbinkimbi, I-HDI PCB ithekhnoloji ene ama-microvias abhorelwe nge-laser kunye ukulandelana kungatlhogeka.

Amafayela wokufaka aqakathekileko afaka hlangana:

• I-Netlist
• Umdwebo wemitjhini
• Ikhasi ledatha yeengcenye
• Umtlolo wekghono lokusebenza .

Amafayela wokuphuma aqakathekileko afakahlangana:

• Gerber RS-274X namkha ODB++
• Ifayela le-NC Drill
• Khetha begodu ufake ifayela
• I-Stencil Gerber
• Umbiko wephuzu lokuhlolwa
• Umdwebo we-Assembly & Ifayela le-Silkscreen

2.1 Imigomo yokuBekwa

Ukubekwa kusisekelo somklamo we-PCBA begodu kuthinta ngqo Ikhwalithi yokudlulisa isiginali, Ukusebenza kokuTjhisa, kunye Ukwenza izinto. Ukubekwa kuhle kuqakathekile i-PCB yokulawula ukuvimbela amadizayini namasekhethi wedijithali anejubane elikhulu.

• Ukuhlukaniswa okusebenzako: Hlukanisa iindawo ze-analog, zedijithali, zamandla, nezesivinini esiphezulu ukugwema ukuphazamiseka.
• Ukugeleza kwesiginali: Faka iingcenye ngendlela yokugeleza kwesiginali ukwehlisa indawo yokuwela ne-loop.
• Ingcenye eqakathekileko eqakatheke khulu: Beka i-MCU/FPGA/SoC, i-DDR, iwatjhi, kanye namamojula wamandla phambili.
• Ukubekwa kwe-Edge: Iinhlanganisi, amabhathini, nama-LED eduze namaphethelo webhodi ukuhlangabezana neemfuneko zemitjhini.
• Ukuhleleka kokutjhisa: Iingcenye ezinamandla amakhulu eduze namatjhaneli wokukhipha umtjhiso nofana amaphedi womtjhiso; ukungezelela ukutjhisa ngokusebenzisa ama-array ngaphasi kweengcenye ezitjhisako.

2.2 Iinqophiso eziqakathekileko

• Ububanzi bokulandelela kanye nomthamo wamanje: 0.5 mm ububanzi bomkhondo ku-1 oz yekhopha ithwala pheze i-1 A. Ukuze uthole umtjhini ophezulu, sebenzisa ikhopha nofana iinsimbi zethusi eziqinileko.
• I-Differential Pair: I-USB, i-HDMI, i-LVDS, i-Ethernet itlhoga Ukumadanisa ubude, Isikhala esilinganako, kunye Ukuhlanganisa okuqinileko ukugcina ukuthembeka kwesiginali begodu unciphise ukulahlekelwa kokufaka kunye ukubuyisela ukulahlekelwa.
• I-impedance elawulwako: Amatshwayo wejubane elikhulu atlhoga ukuvimbela okuqakathekileko okubalwe ukusuka ekuhlanganiseni; amanani avamileko angama-50 Ω aphetheko kanye nama-100 Ω ahlukileko. Ukubuyekezwa kwezobunjiniyela kufanele kufaka hlangana ukulawula ukuvimbela ukuqinisekiswa.
• Indlela yokubuyela emuva: Qinisekisa bona indiza epheleleko yokubhekisa ukubalekela imiraro ye-EMI yendiza ehlukanisiweko; ukungezelela iindlela zokuthunga eduze nokutjhuguluka kwesendlalelo.
• Ukuya: Nciphisa ama-vias anebelo elikhulu; ukusebenzisa Ukubhora emuva namkha Iindlela ezingaboni/ezingcwatshiweko lokha nakutlhogekako. Ngemiklamo ye-HDI, sebenzisa iindlela ezihlanganisiweko namkha iindlela ezitjhingako ne ukuzaliswa kwekhopha.

I-DFM embi irholela ekutheni Ukuhlanganisa i-Solder, Ukubekwa ngamatje, Amalunga we-Cold Solder, Ukutjhuguluka kwengcenye, kunye Amabholo we-Solder. Ukuhlaziywa kwe-DFM ngaphambi kokukhiqizwa okukhulu kusiza ukuvikela isivuno sokuthoma.

3.1 Umklamo wePhetheni yeNarha

Amaphetheni wendawo kufanele akhambisane IPC-7351. Umklamo wephedi ofaneleko uqakathekile ekuthembekeni Ukuhlanganiswa kwe-PCB kunye Umhlangano we-PCBA.

• Iingcenye ze-CHIP (0402, 0603, 0805): Ubukhulu bephedi kufanele bufane nokuvuleka kwesitensili kanye nephrofayili yokugeleza kabutjha ukugwema ukuthunwa.
• QFN (Quad Flat No-lead): Iphasi Iphedi yokutjhisa kufanele ihlukaniswe ukwenzela bona kwehliswe amalunga wokuvuvuka namakhaza; ukusebenzisa i-solder mask echazwe (SMD) namkha i-non-solder mask ehlathululwe (NSMD) amaphedi ngendlela efaneleko.
• BGA (I-Ball Grid Array): Ububanzi bephedi buvamise ukuba yi-80-85% yobubanzi bebholo; ukuvulwa kwemaski yokusolda kufanele kube kuhle ukugwema imaski yokusolda phezu kwephedi. Nge-BGA enephitjhi ehle, sebenzisa i-solder mask idamu ububanzi ≤0.1 mm nofana ususe idamu nangabe kuyatlhogeka.
• SOT/SOP/QFP: Iphitjhi ehle idinga ububanzi bedamu lokuvikela ukukhandela ukuhlangana.

3.2 Ukuhlukaniswa kweengcenye nokutjhinga

• Isikhala seengcenye eziseduze kufanele sihlangabezane neemfuneko zokukhetha nokubeka umlomo nokusebenza kabutjha (≥0.3 mm).
• Hlanganisa iingcenye ezifanako ngendlela efanako ukwenzela bona kube lula ukuhlola i-AOI.
• Gcina ibanga elaneleko hlangana neengcenye ezide nezimfitjhani ukubalekela umphumela wesithunzi ngesikhathi sokugeleza kabutjha.

3.3 Imaski ye-Solder & Isikrini sesilika

• I-Solder Mask Dam ububanzi ≥0.1 mm ukukhandela ukuhlangana.
• Isikrini sesilika akukafaneli bona ihlanganise amaphedi; gcina ukuvuleka okungaphezu kwe-0.2 mm.
• Ukutshwaya i-Polarity, Isitjengiso sePhini 1, kunye Umtloli weReferensi kufanele kube sobala.
• Khetha umbala wemaski yokusolda (oluhlaza satjani, ohlaza satjani, omnyama, obomvu, omhlophe) ngokuya ngokuthanda kwamakhasimende; qinisekisa ukufundeka kokugadangisa inganekwane.

4.1 DFT

I-DFT yenza bona kube nokuhlolwa kwe-PCBA okusebenzako, okubizako begodu isekela ukuthuthukiswa kwehlelo lokuhlolwa nokuklanywa kwezinto ezisetjenziswako.

• Ukuhlolwa kwe-Flying Probe: Akutlhogeki isisetjenziswa; ilungele amaprothothayipi namaqoqo amancani.
• I-ICT (I-In-Circuit Test): Kutlhoga amaphuzu wokuhlola kanye nesisetjenziswa; ilungele ivolumu ephezulu. Siklama amaphetheni wephuzu lokuhlolwa ngokuvikelwa okwaneleko.
• I-FCT (Ukuhlolwa Kwesekethe Esebenzako): Iqinisekisa ukusebenza kwangempela kwe-PCBA.
• Ukuskena komngcele (JTAG): Isebenzisa indlela yokuhlola i-chip eyakhelwe ngaphakathi ukwehlisa amaphuzu wokuhlolwa.

Iimfuneko ze-DFT:

• Ububanzi bendawo yokuhlola ≥0.8 mm, isikhala ≥1.27 mm.
• Sabalalisa amaphuzu wokuhlolwa ngehlangothini linye lokha nakukghonakala.
• Gcina amaphuzu wokuhlolwa angaphazanyiswa begodu kude namalunga amade.
• Bekela amaphuzu wokuhlola amandla namanethi wephasi ukwenzela bona ukuhlolwa okufitjhani kokuvala amandla kunye ukulinganisa ivoltheji yamandla.

4.2 DFA

I-DFA igxile ekusebenzeni kuhle kokuhlanganisa nokukhandela amaphutha.

• Ukuhlanganiswa kwamaphaneli: Ukusebenzisa I-V-cut (V-Scoring) namkha Ukuluma kwegundane / umgodi wesitembu. Kwe umhlangano we-pcb ngeengcenye ezilenga emaphethelweni, sebenzisa ukuthunyelwa kwethebhu ngokulunywa yigundane.
• Isitimela samathulusi: 3-5 mm ububanzi ukudluliswa kwe-conveyor nokubeka.
• Itshwayo le-Fiducial: Okungenani ama-fiducials ama-2-3 wephasi loke; ama-fiducial wendawo wamadivayisi we-fine-pitch afana ne-BGA ne-QFN.
• I-Poka-Yoke: Qinisekisa bona iinhlanganisi zinendlela ehlukileko ukukhandela ukufakwa emuva.

5.1 Ukuthembeka kwesiginali (SI)

Iindaba ze-SI zifaka hlangana Isiboniso, Ukukhulumisana, Ukudlula, Ukudubula ngaphasi, kunye Ukuphambuka kwesikhathi. Ijubane elikhulu Umklamo we-PCB angasebenzisa ukulingisa kwangaphambi kokuhlela kunye ukuqinisekiswa ngemva kokuhleleka ukuhlola umdwebo wamehlo.

• Ukumadanisa i-impedance: Ukuqedwa kochungechunge lomthombo, ukuqedwa okufanako, nofana ukuqedwa kwe-AC.
• Ukumadanisa ubude: Ukukhamba kwe-Serpentine kwedatha ye-DDR/amaqembu wamakheli kanye nama-differential pairs.
• Ukugandelelwa kwe-crosstalk: umthetho we-3W (isikhala ≥3× ububanzi bomkhondo); engeza imikhondo yokugada amatshwayo aqakathekileko.
• Buyela nge-: Faka iindlela zokuthunga eduze nokutjhuguluka kwesendlalelo ukwehlisa ukungena kwe-loop.

5.2 Ukuthembeka kwamandla (PI)

Iindaba ze-PI zifaka hlangana Umsindo wamandla, Ukwehla kwevoltheji, kunye Ukugxuma phasi. Indlela eyakhiwe kuhle Inethiwekhi yokusabalalisa amandla (i-PDN) kuqakathekile ekusebenzeni okuzinzileko.

• Ukuhlukanisa i-Capacitor: Faka i-0.1 µF + 10 µF inhlanganisela eduze kwephini yamandla ngayinye; ukusebenzisa ama-ESL aphasi ukuhlukaniswa kwamafrikhwensi aphezulu.
• Ukuhlukaniswa kwendiza yamandla: Hlukanisa amaplani wamandla we-analog newedijithali; balekela ukuwela ama-splits ngamatshwayo wejubane elikhulu.
• Indlela ye-Impedance ephasi: Amandla aseduze kanye namaplani wephasi enza i-plane capacitance; gcina i-dielectric encani hlangana namandla namalayini wephasi.
• Ngokubala: Ama-vias amanengi ahambisanako weendlela ezine-current ephezulu; ukusebenzisa iindlela ezizele ithusi malungana nama-vias aphezulu wamanje.

5.3 I-EMC (Ukuvumelana Kwegezi)

I-EMC ihlanganisa I-EMI (Ukuphazamiseka kwe-Electromagnetic) kunye I-EMS (Ukuthambekela Kwegezi). Ukubuyekezwa kwe-EMC ngaphambi kokuthobela kungakhomba ubungozi bokuklama ngaphambi kokuhlolwa okusemthethweni.

• Umthetho we-20H: Hlola amaphethelo wendiza yamandla nge-20× isikhala sesendlalelo ukwehlisa amasimu ahlanganisiweko.
• Ukuhlunga kwesikhombisi: Faka i-TVS, i-common mode chokes, ama-ferrite beads, kanye nama-capacitors kuma-I/O connectors.
• Ukuvikela: Sebenzisa iimvalo zokuvikela eendaweni ezibucayi; nikela amaphedi wokufaka phasi ukunamathisela isihlangu.
• Ikristalu newatjhi: Akukho ukukhamba ngaphasi kwamakristalu; sebenzisa imikhondo yokulinda begodu ugcine imikhondo yewashi ifitjhani.

5.4 Umklamo we-HDI PCB

Ngemiklamo ephezulu, I-HDI PCB ithekhnoloji ene ama-microvias abhorelwe nge-laser, iindlela ezingaboniko, kunye iindlela ezingcwatjiweko kwenza bona kube namafomu amancani kanye nokuminyana okuphezulu. Iinqunto eziqakathekileko:

• Isilinganiso se-Microvia ngokuvamileko ≤1:1.
• Ukusebenzisa ama-microvias ahlanganisiwe ukutjhuguluka kwesendlalelo eendaweni ezinabantu abanengi.
• Ukulandelana kokulandelana ikambiso ivumela amalayini amanengi we-microvia.
• Ngokudlula-ngaphakathi kwephedi ne ukuzaliswa kwekhopha kunye ukuhleleka ukuthola i-BGA fanout.

6.1 Umklamo we-BGA

Umklamo wephedi ye-BGA uthinta ngqo isivuno sokusolder Ukuhlanganiswa kwe-PCB kunye Umhlangano we-PCBA, khulukhulu eensetjenzisweni ze-BGA ezizwakala kuhle.

• Ububanzi bephedi ≈0.8–0.85× ububanzi bebholo (isib., iphedi eyi-0.25 mm yebholo eyi-0.3 mm).
• Ukuvulwa kwemaski yokusolda kunephedi nge-0.025-0.05 mm ngehlangothini ngalinye.
• I-NSMD (Non-Solder Mask Defined) namkha I-SMD (i-Solder Mask Defined); I-NSMD ejayelekileko ye-BGA enephitjhi ehle.
• I-Fanout vias 0.2 mm/0.1 mm nofana encani; ukusebenzisa I-Via-in-Pad ne Ikhopha ezaliswe / i-Resin ukukhandela ukutjhwaba kwe-solder.
• Ukungezelela amatshwayo wendawo eduze kwe-BGA ukuthola ukubekwa okunembileko.

6.2 Umklamo we-QFN

Amaphakheji we-QFN (Quad Flat No-lead) atlhoga ukuklanywa kuhle kwe-thermal pad.

• Hlukanisa iphedi yokutjhisa ibe ziiphedi ezinengi ezincani nofana usebenzise iphedi eyodwa eneenkhala zestensela ezihlukanisiweko ukwehlisa ukungabi khona.
• Nweba amaphedi wephini 0.2-0.3 mm ngale komphetho wephakheji ukuhlola i-AOI.
• Ukusebenzisa Ukufakwa kwe-resin namkha Ukuzaliswa kwekhopha ukukhandela ukutjhisa kwe-solder.
• Nge-QFN enamandla amakhulu, engeza ukutjhisa nge-array ukuxhuma eendizeni zekhopha zangaphakathi.

6.3 0402 / 0201 / 01005 Iingcenye ezincani

• 0402 isikhala sephedi: 0.4–0.5 mm; 0201: 0.25–0.3 mm; 01005: 0.15–0.2 mm.
• Sebenzisa iimbobo ze-stencil ze-anti-solder (ezinomgodi nofana ezinciphisiweko).
• Nikela ngamatshwayo aneleko wokuthembeka ukunemba kokubekwa.
• Tjheja ukukhipha iglu ukuhlanganiswa kwamahlangothi amabili ngeengcenye ezisindako.

7.1 Idizayini ye-Stencil Aperture

Umklamo wokuvuleka kwe-stencil unquma ngqo ukugadangiswa kwe-solder ikhwalithi begodu kufanele ilungiselelwe i-PCBA ngayinye.

• Ukuqina kwesitensili: 0.1–0.15 mm ejayelekileko; 0.08 mm yeengcenye ezincani; 0.2 mm yamanje aphezulu.
• Isilinganiso sendawo: Indawo yokuvula / indawo yodonga lokuvuleka > 0.66.
• I-Aspect Ratio: Ububanzi bokuvuleka / ukujiya kwesitensili > 1.5.
• Iindawo ezikhethekileko: QFN thermal pad amafasitela amanengi amancani; Ukunciphisa okuyindilinga kwe-BGA; ama-aperture we-anti-solder we-notched weengcenye ze-chip.
• Tjheja isitensili segadango ngobukhulu beengcenye ezihlangeneko (isib., istensela eqinileko yeendawo ezine-current ephezulu, encani ye-pitch encani).

7.2 Ukugeleza kabutjha nokutjhinga kwamagagasi

• Ukupholisa kabutjha: Ngeengcenye ze-SMT; ifuna okufaneleko iphrofayili yamazinga womtjhiso (futhumeza, ukuthambisa, ukugeleza kabutjha, ukupholisa). Ukusebenzisa ukugeleza kabutjha kwe-nitrogen ukwenza ngcono ukuthambisa nokunciphisa ukukhiqizwa kwe-oksijini.
• Ukusolderwa kwamagagasi: Ngeengcenye ze-through-hole (DIP) kanye nekambiso ye-SMT ye-glue ebomvu.
• Ukukhetha amagagasi: Ukusolderwa okusendaweni kweengcenye ze-through-hole; ilungele amabhodi wethekhnoloji ehlangeneko.
• Ikambiso enganawo umthofu: SAC305 i-solder paste; izinga lokutjhisa eliphezulu lokugeleza 235 ukuya ku-250 °C. Ukuqedwa kwephasi okujayelekileko kufaka hlangana i-HASL enganawo umthofu, UKUVUMA, UmNyango wezeMlilo wokuzithandela, isiliva yokucwilisa, kunye itini lokucwilisa.

7.3 Ukuhlanganiswa okuhlangeneko

Hlanganisa i-SMT reflow kanye ne-DIP wave soldering, nofana usebenzise Pin-in-Paste (PIP) ngeengcenye ezidlula emgodini ekugelezeni kabutjha.

8.1 Iindlela zokwenza amaphaneli

• I-V-cut (V-Scoring): Iindleko eziphasi; amabhodi angama-rectangle ngaphandle kweengcenye eziseceleni.
• Ukuluma kwegundane / umgodi wesitembu: Emabhodini angakajayeleki nofana iingcenye eziseceleni; ukusebenzisa ukuthunyelwa kwethebhu ne ukuluma kwegundwane.
• Ibhuloho + Ukuluma kwegundane: Ihlanganisa amandla nokuhlukana lula.

8.2 I-Tooling Rail & Fiducial Mark

• Ububanzi besitimela samathulusi: 3-5 mm.
• Itshwayo le-fiducial: 1 mm ububanzi, 2-3 mm ukuvulwa kwemaski yokusolda, igolide nofana ukuqedwa kwethini lokucwilisa.
• Iimphathiswa zendawo zamadivayisi we-BGA/QFN we-fine-pitch.

8.3 Ubukhulu bephaneli nobunengi

• Ubukhulu bephaneli ngaphakathi kwemikhawulo yokukhetha nokubeka nokubuyisela i-oveni (≤400 mm × 400 mm).
• Ukulinganisa ukusebenza kuhle nokusetjenziswa kwepahla; balekela ukutjhinga.
• Ukusebenzisa amathebhu wokuhlukana namkha ama-slots ahlelweko ukwehlisa ukugandeleleka ngesikhathi sokuhlukana.

9.1 Ukuhlola igezi

• I-DRC ayikho amaphutha abulalako.
• Ukumadanisa ubude besiginali eqakathekileko, ukuvimbela, isikhala.
• Inethi yamandla ngokubala namandla wamanje.
• Ukulingiswa kobuqotho besiginali imiphumela ihlangabezana neemfuneko zomdwebo wamehlo.

9.2 Hlola i-DFM

• Ubukhulu bephedi nge-IPC-7351.
• Ukuhlukaniswa kweengcenye kuhlangabezana neemfuneko ezincani zokukhetha nokubeka.
• Idamu lemaski yokusolda, isikrini sesilika, ukutshwaya kwe-polarity okucacileko.
• Ukuvuleka kwe-stencil kuhlangabezana nesilinganiso sendawo.
• Ukuhlanganiswa kwamaphaneli kunye isitimela samathulusi njenganje.

9.3 Hlola i-DFT

• Ukuhlolwa kwephuzu lokuhlanganiswa emanethini aqakathekileko.
• Amaphuzu wokuhlolwa angaphazanyiswa.
• Ukusebenza kwe-ICT.

9.4 Ukuhlola ukuhlangana

• Isitimela samathulusi namatshwayo we-fiducial akhona.
• Indlela yokwenza amaphaneli inengqondo.
• Ibanga lengcenye ukusuka ku-V-cut ≥0.5 mm.

9.5 Ukuphelela kwemitlolo

• Ukuqanjwa kwesendlalelo se-Gerber kulinganisiwe.
• Inomboro zengcenye ze-BOM, amaphakheji, amanani anembile.
• Khetha begodu ubeke ifayela lifana ne-BOM.
• Ifayela le-stencil lifana nomklamo we-PCB.

Ngemikhiqizo yefa nofana engasasebenziko Amabhodi we-PCBA, Ubunjiniyela obubuyela emuva be-PCBA angakha kabutjha amafayela we-schematics, i-BOM, namafayela we-Gerber ukusuka emabhodini abonakalako bese uhlanganisa idatha ebuyiselweko nenye Umklamo we-PCB kunye Umhlangano we-PCBA ukugeleza komsebenzi.

Ikambiso yethu yobunjiniyela obubuyela emuva ifakahlangana:

• Ukuthathwa kwemifanekiso yebhodi nokuhlolwa kwe-X-ray ukudweba amalayini wangaphakathi.
• Ukukhonjwa kweengcenye nokukhutjhwa kwe-BOM kufaka hlangana ukutjhugululwa kweengcenye eziphelelwe sikhathi.
• Ukuthunjwa kwesikimu ukusuka ekwakhiweni kabutjha kwe-netlist.
• Ukuzithabisa kokuhleleka kwe-PCB ngokuthuthukiswa kwe-DFM.
• Umhlangano we-PCBA wokuthoma kanye nokuhlolwa kokusebenza.

Iinkonzo ezingezelelweko:

• Ukugcotshwa okuvumelanako eendaweni ezimbi.
• Ukutjala nokuvala ukujamelana nokudlidliza.
• Zalisa ngaphasi yamaphakheji we-BGA ne-CSP.
• Ukusebenza kabutjha nokulungisa ukusebenzisa isitetjhi sokusebenza kabutjha se-BGA.
• Ukuthuthukiswa kokuhlolwa okusebenzako ye-PCBA eyenziwe ngokwezifiso.