Tsarin PCBA yawanci yana farawa da Kama Tsarin, sai kuma Wurin PCB, Hanyar hanya, DRC (Duba Dokokin Zane), kuma Duba DFM, sannan fitarwa Fayilolin Gerber, Fayilolin Rage Wutar Lantarki na NC, BOM (Dokar Kayayyaki), kuma Zane na TaroDon ƙira masu rikitarwa, HDI PCB fasaha tare da microvias da aka haƙa da laser kuma lamination mai bi da bi ana iya buƙata.

Fayilolin shigarwar asali sun haɗa da:

• Jerin Yanar Gizo
• Zane na Inji
• Takardar Bayanan Kayan Aiki
• Takardar Ƙarfin Tsarin Aiki (mafi ƙarancin faɗin/tazara tsakanin ramuka, mafi ƙarancin girman rami, faɗin abin rufe fuska na solder, buƙatun sarrafa impedance)

Fayilolin fitarwa na asali sun haɗa da:

• Gerber RS-274X ko ODB++
• Fayil ɗin Raƙuman NC
• Zaɓi & Sanya Fayil
• Stencil Gerber
• Rahoton Wurin Gwaji
• Fayil ɗin Zane & Silkscreen

2.1 Ka'idojin Sanyawa

Sanyawa shine tushen ƙirar PCBA kuma yana shafar kai tsaye Ingancin Hanyar Sigina, Aikin Zafin Jiki, kuma Ƙirƙirar masana'antuSanya wuri mai kyau yana da mahimmanci ga PCB mai kula da impedance ƙira da da'irori na dijital masu sauri.

• Rarraba Aiki: Raba yankunan sadarwa na analog, dijital, wutar lantarki, da kuma manyan hanyoyin sadarwa domin gujewa tsangwama.
• Gudun Sigina: Sanya sassan a cikin hanyar kwararar sigina don rage yankin ketarewa da madauki.
• Muhimmancin Bangaren Musamman: Sanya MCU/FPGA/SoC, DDR, agogo, da kuma kayan aiki na wutar lantarki da farko.
• Sanya Gefen: Haɗawa, maɓallai, da LEDs kusa da gefunan allo don biyan buƙatun injina.
• Tsarin Zafin Jiki: Abubuwan da ke da ƙarfi sosai kusa da tashoshin watsa zafi ko kushin zafi; ƙara thermal ta hanyar jeri a ƙarƙashin abubuwan da aka haɗa masu zafi.

2.2 Muhimman Abubuwan da ke Buɗe Hanya

• Faɗin Bin Diddigi da Ƙarfin Yanzu: Faɗin ramin 0.5 mm akan jan ƙarfe 1 oz yana ɗaukar kimanin 1 A. Don mafi girman wutar lantarki, yi amfani da tagulla don ko kuma nauyin jan ƙarfe mai kauri.
• Bambancin Biyu: USB, HDMI, LVDS, Ethernet suna buƙata Daidaita Tsawon, Daidaitaccen Tazara, kuma Haɗin kai mai ƙarfi don kiyayewa mutuncin sigina da kuma rage girman asarar shigarwa kuma asarar dawowa.
• Impedance Mai Sarrafawa: Siginar sauri mai girma tana buƙatar juriya ta musamman da aka ƙididdige daga tarin bayanai; ƙimar gama gari ita ce bambancin 50 Ω mai iyaka ɗaya da kuma bambancin 100 Ω. Ya kamata bitar injiniya ta haɗa da ikon sarrafa impedance tabbatarwa.
• Hanyar Dawowa: Tabbatar da cikakken jirgin sama mai ma'ana don guje wa matsalolin EMI na jirgin sama da suka raba; ƙara hanyoyin dinki kusan sauyi a cikin Layer.
• Ta hanyar: Rage amfani da hanyoyin sadarwa masu sauri; Hakowa Bayan Baya ko Makafi/Binne Vias idan ya zama dole. Don ƙirar HDI, yi amfani da tayoyi masu tarin yawa ko hanyoyin da aka yi watsi da su tare da Cika jan ƙarfe.

Rashin kyawun DFM yana haifar da Haɗin Solder, Jifan kabari, Haɗin gwiwa na Sanyi, Canjin Sashi, kuma Ƙwallon SolderBinciken DFM kafin samar da kayayyaki da yawa yana taimakawa wajen kare yawan amfanin da aka samu a farkon lokaci.

3.1 Tsarin Ƙasa

Tsarin ƙasa dole ne ya dace da IPC-7351Tsarin kushin da ya dace yana da mahimmanci don ingantaccen aiki Taro na PCB kuma Taro na PCBA.

• Kayan CHIP (0402, 0603, 0805): Girman faifan dole ne ya dace da buɗewar stencil da kuma bayanin sake kwarara don guje wa jifan kabari.
• QFN (Quad Flat No-guda): Ƙasa Kushin zafi ya kamata a raba shi don rage fitar da ruwa da kuma wuraren sanyi; An ayyana abin rufe fuska na solder (SMD) ko an ayyana abin rufe fuska mara siyarwa (NSMD) kushin da ya dace.
• BGA (Rukunin Grid na Kwallo): Girman faifan yawanci shine 80-85% na diamita na ƙwallo; buɗe abin rufe fuska na solder dole ne ya zama daidai don guje wa abin rufe fuska na solder akan faifan. Don BGA mai laushi, yi amfani da mask ɗin solder mask faɗin ≤0.1 mm ko kuma a cire madatsar ruwa idan ana buƙata.
• SOT/SOP/QFP: Kyakkyawan siffa yana buƙatar isasshen faɗin abin rufe fuska na solder don hana gadawa.

3.2 Tazarar Kayan Aiki da Tsarinsu

• Tazarar da ke kusa da sassan dole ne ta cika buƙatun bututun da aka ɗauka da kuma sake yin aiki (≥0.3 mm).
• Daidaita abubuwan da suka yi kama da juna a cikin hanya ɗaya don sauƙin duba AOI.
• A ajiye isasshen tazara tsakanin abubuwa masu tsayi da gajeru don guje wa tasirin inuwa yayin sake kwarara.

3.3 Abin Rufe Ido da Allon Siliki

• Madatsar Mask ta Solder faɗin ≥0.1 mm don hana haɗuwa.
• Siliki mai laushi bai kamata ya yi karo da kusurwoyi ba; a kiyaye izinin ≥0.2 mm.
• Alamar Polarity, Alamar Pin 1, kuma Mai Zaɓar Bayani dole ne a bayyana.
• Zaɓi launin abin rufe fuska na solder (kore, shuɗi, baƙi, ja, fari) dangane da fifikon abokin ciniki; tabbatar da cewa an iya karanta rubutun tatsuniya.

4.1 DFT

DFT tana ba da damar yin gwajin PCBA mai inganci da araha kuma tana tallafawa haɓaka shirye-shiryen gwaji da ƙirar kayan aiki.

• Gwajin Binciken Tashi: Babu buƙatar kayan aiki; ya dace da samfura da ƙananan rukuni.
• ICT (Gwajin Cikin Da'ira): Yana buƙatar maki na gwaji da kayan aiki; ya dace da babban girma. Mun tsara alamu na gwajin tare da isasshen ɗaukar hoto.
• FCT (Gwajin Da'irar Aiki): Yana tabbatar da ainihin aikin PCBA.
• Scan na Iyaka (JTAG): Yana amfani da dabarun gwajin guntu da aka gina a ciki don rage maki na gwaji na zahiri.

Bukatun DFT:

• Diamita na wurin gwaji ≥0.8 mm, tazara ≥1.27 mm.
• Raba wuraren gwaji a gefe ɗaya idan zai yiwu.
• A ajiye wuraren gwaji ba tare da wani cikas ba kuma a nisanci manyan sassan jiki.
• Ajiye wuraren gwaji don wutar lantarki da raga na ƙasa don kunna gwajin gajere na kashe wuta kuma Ma'aunin ƙarfin lantarki mai aiki da wutar lantarki.

4.2 DFA

DFA ta mayar da hankali kan ingancin taro da kuma hana kurakurai.

• Panelization: Amfani Yanke-V (Maki-V) ko Cizon Beraye / Ramin TambariDomin taron pcb tare da abubuwan da ke rataye gefe, amfani hanyar sarrafa shafin tare da cizon beraye.
• Layin Kayan AikiFaɗin 3–5 mm don canja wurin jigilar kaya da sanya shi.
• Alamar Aminci: Aƙalla amintattun ƙasashen duniya guda 2-3; amintattun gida don na'urori masu kyau kamar BGA da QFN.
• Poka-Yoke: Tabbatar cewa masu haɗin suna da yanayin musamman don hana shigar da baya.

5.1 Ingancin Sigina (SI)

Matsalolin SI sun haɗa da Tunani, Crosstalk, Overshoot, Ƙarƙashin Harbi, kuma Lokacin SkewBabban gudu Tsarin PCB iya amfani kwaikwayon da aka riga aka tsara kuma Tabbatar bayan tsari don kimantawa zane na ido.

• Daidaitawar Impedance: Karewar jerin tushe, karewa a layi ɗaya, ko karewa ta AC.
• Daidaita Tsawon: Hanyar Serpentine don ƙungiyoyin bayanai/adireshi na DDR da nau'ikan nau'ikan daban-daban.
• Dakatar da Tattaunawar Juna: Dokar 3W (tazara ≥3× faɗin alamar alama); ƙara alamun tsaro don mahimman sigina.
• Dawowa Ta Hanyar: Ƙara hanyoyin dinki kusa da canjin layuka don rage madaurin da ke shiga.

5.2 Ingancin Ƙarfi (PI)

Matsalolin PI sun haɗa da Hayaniyar Ƙarfi, Rage ƙarfin lantarki, kuma Fashewar ƘasaAn tsara shi da kyau Cibiyar Rarraba Wutar Lantarki (PDN) yana da mahimmanci don aiki mai dorewa.

• Ƙarƙashin Capacitor: Sanya haɗin 0.1 µF + 10 µF kusa da kowace fil ɗin wuta; yi amfani da ƙananan ƙarfin ESL don haɗakar mita mai yawa.
• Raba Jirgin Sama Mai Lantarki: Raba jiragen wutar lantarki na analog da na dijital; a guji tsallakawa da sigina masu saurin gudu.
• Hanyar Ƙarƙashin Ƙarƙashin Ƙasa: Ƙwayoyin wutar lantarki da na ƙasa da ke kusa suna ƙirƙirar ƙarfin jirgin sama; suna kiyaye siraran dielectric tsakanin wutar lantarki da layukan ƙasa.
• Ta hanyar ƙidaya: Hanyoyi masu yawa a layi ɗaya don hanyoyin da ke da saurin hawa; yi amfani da hanyoyin da aka cika da tagulla don hanyoyin sadarwa masu yawan wutar lantarki.

5.3 EMC (Daidaitawar Lantarki)

Murfin EMC EMI (Tasirin Lantarki) kuma EMS (Sauƙin Lantarki)Bitar EMC kafin bin ƙa'idodi na iya gano haɗarin ƙira kafin gwaji na hukuma.

• Dokar H20: Rage gefunan jirgin sama mai ƙarfi da tazara mai faɗi 20× don rage filayen fringing.
• Tace Fuskar Sadarwa: Ƙara TVS, chokes na yanayin gama gari, beads na ferrite, da capacitors a mahaɗin I/O.
• KariyaYi amfani da murfin kariya a kan wurare masu laushi; samar da kushin ƙasa don haɗa garkuwa.
• Crystal & Agogo: Babu hanyar sadarwa a ƙarƙashin lu'ulu'u; yi amfani da alamun tsaro kuma ka rage alamun agogo.

Zane na 5.4 HDI PCB

Don ƙira mai yawa, HDI PCB fasaha tare da microvias da aka haƙa da laser, hanyoyin makafi, kuma binne hanyoyin yana ba da damar ƙananan abubuwan tsari da kuma yawan hanyoyin sadarwa mafi girma. Muhimman abubuwan da za a yi la'akari da su:

• Rabon ɓangaren Microvia yawanci ≤1:1.
• Amfani taraktocin microvia don sauyawar Layer a yankunan da ke da yawan jama'a.
• Lamination mai jere tsari yana ba da damar yadudduka da yawa na microvia.
• Ta hanyar-in-pad tare da Cika jan ƙarfe kuma tsara tsari don masu sha'awar BGA.

6.1 Tsarin BGA

Tsarin kushin BGA yana shafar yawan amfani da solder kai tsaye don Taro na PCB kuma Taro na PCBA, musamman a cikin aikace-aikacen BGA masu kyau.

• Diamita na kushin ≈0.8–0.85× diamita na ƙwallo (misali, kushin 0.25 mm don ƙwallo 0.3 mm).
• Buɗewar abin rufe fuska da ya fi girman kushin girma da 0.025–0.05 mm a kowane gefe.
• NSMD (An Bayyana Abin Rufe Ido Ba Tare Da Soya Ba) ko SMD (An Bayyana Abin Rufe Ido); NSMD gama gari ne ga BGA mai kyau.
• Fano mai girman 0.2 mm/0.1 mm ko ƙasa da haka; yi amfani da Ta hanyar-in-Pad tare da Cikakken Tagulla / Cikakken Guduro don hana walƙatar solder.
• Ƙara alamun aminci na gida kusa da BGA don daidaitaccen wurin sanyawa.

6.2 Tsarin QFN

Fakitin QFN (Quad Flat No-lead) suna buƙatar ƙirar kushin zafi mai kyau.

• Raba kushin zafi zuwa ƙananan kushin da yawa ko amfani da kushin guda ɗaya tare da ramukan stencil da aka raba don rage fitar da ruwa.
• Faɗaɗa faifan fil 0.2–0.3 mm fiye da gefen fakitin don duba AOI.
• Amfani Filogin Resin ko Ciko da Tagulla don amfani da thermal pad vias don hana solder wicking.
• Don QFN mai ƙarfi, ƙara thermal via jeri haɗawa da jiragen jan ƙarfe na ciki.

6.3 0402 / 0201 / 01005 Ƙananan Abubuwan Haɗaka

• Tazarar faifan 0402: 0.4–0.5 mm; 0201: 0.25–0.3 mm; 01005: 0.15–0.2 mm.
• Yi amfani da ramukan stencil na ƙwallon da ba sa solder (wanda aka yi masa alama ko aka rage).
• Samar da isassun alamun aminci don daidaiton sanyawa.
• Yi la'akari da rarraba manne don haɗuwa mai gefe biyu tare da kayan aiki masu nauyi.

7.1 Tsarin Buɗewar Siminti

Tsarin buɗewar stencil kai tsaye yana ƙayyade bugu na manna solder inganci kuma ya kamata a inganta shi don kowane PCBA.

• Kauri na Stencil: 0.1–0.15 mm na yau da kullun; 0.08 mm don ƙananan abubuwan haɗin gwiwa; 0.2 mm don babban wutar lantarki.
• Rabon Yanki: Yankin Buɗewa/Bangaren Buɗewa > 0.66.
• Rabon Al'amari: Faɗin Buɗewa / kauri na stencil > 1.5.
• Bututun Musamman: Faifan zafi na QFN ƙananan tagogi da yawa; rage zagaye ko murabba'i na BGA; ramuka masu ƙyalli na ƙwallon hana siyarwa don abubuwan guntu.
• Yi la'akari da stencil na mataki don girman kayan haɗin da aka haɗa (misali, stencil mai kauri don wuraren da ke da ƙarfin lantarki mai yawa, siriri don ƙaramin tsari).

7.2 Sake Gudurawa da Rage Wuta

• Sake Sanyaya Wutar Lantarki: Don abubuwan haɗin SMT; yana buƙatar ingantaccen aiki bayanin yanayin zafi (a fara dumamawa, jiƙawa, sake kwarara, sanyaya). sake kwararar nitrogen don inganta jikewa da rage iskar oxygen.
• Rage Wutar Lantarki: Don abubuwan da ke cikin ramin (DIP) da kuma tsarin manne ja na SMT.
• Zaɓaɓɓen Wave Soldering: Yin solder na gida don abubuwan da ke cikin rami; ya dace da allunan fasaha iri-iri.
• Tsarin Babu Guba: Man shafawa na SAC305; zafin sake kwararar ruwa mafi girma 235–250 °C. Kammalawar saman da aka saba yi sun haɗa da HASL mara gubar, YARDA, Sashen Kashe Gobara na Masu Sa-kai, azurfa mai nutsewa, kuma tin ɗin nutsewa.

7.3 Haɗakarwa Mai Haɗaka

Haɗa sake amfani da SMT da kuma haɗawar DIP wave, ko amfani da Manna a cikin Manna (PIP) don abubuwan da ke cikin ramin da ke cikin sake kwarara.

8.1 Hanyoyin Shirya Faɗaɗawa

• Yanke-V (Maki-V): Ƙaramin farashi; don allunan murabba'i masu kusurwa huɗu ba tare da kayan haɗin gefe ba.
• Cizon Beraye / Ramin Tambari: Don allunan da ba su dace ba ko kayan haɗin gefen; yi amfani da hanyar sarrafa shafin tare da cizon beraye.
• Gada + Cizon beraye: Yana haɗa ƙarfi da sauƙin rabuwa.

8.2 Layin Kayan Aiki da Alamar Aminci

• Faɗin layin kayan aiki: 3-5 mm.
• Alamar asali: diamita 1 mm, buɗewar abin rufe fuska na solder 2-3 mm, ƙarewar zinare ko nutsewa.
• Amintattun gida don na'urorin BGA/QFN masu kyau.

8.3 Girman Faifai da Yawa

• Girman faifan a cikin iyakokin tanda mai ɗaukar kaya da kuma sake kwarara (≤400 mm × 400 mm).
• Daidaita inganci da amfani da kayan aiki; a guji faɗawa cikin rikici.
• Amfani shafuka masu fashewa ko ramummuka masu hanya don rage damuwa yayin cire panel.

9.1 Duba Wutar Lantarki

• DRC ba ta da wani mummunan sakamako.
• Daidaita tsawon siginar mai mahimmanci, juriya, tazara.
• Wutar lantarki ta hanyar ƙidaya da ƙarfin lantarki.
• Kwaikwayon daidaiton sigina sakamakon ya cika buƙatun zane na ido.

9.2 Duba DFM

• Girman faifan a kowace IPC-7351.
• Tazarar sassan ya cika mafi ƙarancin buƙatun zaɓi da wuri.
• Madatsar mask ta solder, silkscreen, alamar polarity bayyananne.
• Buɗewar simintin ya cika rabon yanki.
• Panelization kuma layin kayan aiki yanzu.

9.3 Duba DFT

• Rufe wurin gwaji akan raga masu mahimmanci.
• Ba a cika samun cikas ga wuraren gwaji ba.
• yuwuwar kayan aikin ICT.

9.4 Duba Taro

• Ana nuna alamun kayan aiki da kuma alamun aminci.
• Hanyar da aka tsara ta hanyar panelization ta dace.
• Nisa daga sassa daga yanke V ≥0.5 mm.

9.5 Cikakkiyar Takardu

• Sunan Layer na Gerber daidaitacce.
• Lambobin sassan BOM, fakiti, adadi daidai.
• Zaɓi & sanya fayil ɗin ya dace da BOM.
• Fayil ɗin stencil ya dace da ƙirar PCB.

Don samfuran da suka gabata ko tsoffin kayayyaki Allon da'ira na PCBA, Injiniyan baya na PCBA zai iya sake ƙirƙirar fayilolin zane-zane, fayilolin BOM, da Gerber daga allon zahiri kuma haɗa bayanan da aka dawo dasu zuwa sabon Tsarin PCB kuma Taro na PCBA aikin aiki.

Tsarin injiniyan mu na baya ya haɗa da:

• Hoton allo da kuma duba X-ray don zana taswirar yadudduka na ciki.
• Gano sassan da kuma cire BOM gami da maye gurbin sassan da suka tsufa.
• Kama tsari daga sake gina jerin yanar gizo.
• Wasannin shimfidar PCB tare da inganta DFM.
• Taro na PCBA samfur da gwajin aiki.

Ƙarin ayyukan da aka ƙara ƙima:

• Rufin da ya dace don yanayi mai tsauri.
• Tukunya da kuma rufewa don juriya ga girgiza.
• Cika ƙasa don fakitin BGA da CSP.
• Sake aiki da gyara ta amfani da tashar sake fasalin BGA.
• Haɓaka gwajin aiki don PCBA na musamman.