Dhizaini yePCBA inowanzo tanga ne Kutorwa Kwechirongwa, ichiteverwa na Kuiswa kwePCB, Kuronga nzira, DRC (Kuongorora Mutemo Wekugadzira)uye Kuongorora kweDFM, zvino zvinobuda Mafaira eGerber, Mafaira eNC Drill, BOM (Bhiri reZvishandiso)uye Kudhirowa KwekuunganaKune magadzirirwo akaomarara, HDI PCB tekinoroji ine ma microvia akacherwa nelaser uye lamination inotevedzana zvingangodiwa.

Mafaira emukati makuru anosanganisira:

• Runyorwa rweNetlist
• Kudhirowa kweMichina
• Sheet reData reChikamu
• Gwaro Rekugona Kwekuita (hupamhi/nzvimbo shoma yekubvisa tsvina, saizi shoma yegomba, upamhi hwedhamu remasikisi anosonerwa, zvinodiwa pakudzora impedance)

Mafaira ekubuda makuru anosanganisira:

• Gerber RS-274X kana ODB++
• Faira reNC Drill
• Sarudza & Isa Faira
• Stencil Gerber
• Mushumo wePoint Test
• Dhirowa yeGungano & Faira reSilkscreen

2.1 Nheyo dzeKuisa

Kuiswa kwenzvimbo ndiyo hwaro hwekugadzirwa kwePCBA uye kunokanganisa zvakananga Hunhu hweKutungamira kweChiratidzo, Kushanda Kwekupisauye Kugona kugadzirwaKuiswa kwakakodzera kwakakosha pa PCB yekudzora impedance magadzirirwo uye maseketi edhijitari anomhanya zvikuru.

• Kupatsanura Kunoshanda: Gadzira nzvimbo dze analog, digital, power, uye high-speed interface kudzivirira kukanganiswa.
• Kuyerera kweChiratidzo: Isa zvikamu munzira yekuyerera kwechiratidzo kuti uderedze nzvimbo yekuyambuka nenzvimbo yekutenderera.
• Chinhu Chinokosha Chinokosha: Isa MCU/FPGA/SoC, DDR, wachi, uye mamodule emagetsi kutanga.
• Kuiswa kweMupendero: Zvinobatanidza, mabhatani, uye ma LED ari pedyo nemipendero yebhodhi kuti zvienderane nezvinodiwa zvemakanika.
• Kurongeka kweThermal: Zvikamu zvine simba guru zviri pedyo nenzira dzinopisa kupisa kana ma thermal pads; wedzera kupisa kuburikidza ne arrays pasi pezvinhu zvinopisa.

2.2 Zvinhu Zvakakosha Pakufambisa Nzira

• Upamhi hweTrace & Kugona Kwazvino: 0.5 mm trace width pa 1 oz mhangura inotakura anenge 1 A. Kuti uwane simba remagetsi rakakwirira, shandisa mhangura ye kana kuti huremu hwemhangura hwakakora.
• Kusiyana kwePair: USB, HDMI, LVDS, Ethernet inoda Kufananidza Hurefu, Nzvimbo Yakaenzanauye Kubatanidza Kwakasimba kuchengetedza kuvimbika kwechiratidzo uye kuderedza kurasikirwa kwekuisa uye kurasikirwa nekudzoka.
• Kudzorwa Kwekupokana: Masaini ekumhanya kwakanyanya anoda hunhu hweimpedance hwakaverengerwa kubva pa stack-up; zvakajairika zvinoti 50 Ω single-end uye 100 Ω differential. Ongororo yeinjiniya inofanira kusanganisira kudzora impedance kusimbiswa.
• Nzira Yekudzoka: Iva nechokwadi chekuti pane plane yakakwana yekutarisa kuti usasangana nematambudziko eEMI; wedzera mavhisi ekusona kuchinja kwezvikamu zvema layer pedyo.
• Kuburikidza ne: Deredza ma-vias ekumhanya kwepamusoro; shandisa Kuboorera Musana kana Mapofu/Mavhiza Akavigwa kana zvichidikanwa. Pamagadzirirwo eHDI, shandisa maburi akarongwa kana ma via akatenderedzwa ne kuzadza kwemhangura.

Kusashanda zvakanaka kweDFM kunotungamira ku Kubatanidza Solder, Kutema Matombo, Majoini Anotonhora Anosanganisa, Kuchinja kweChikamuuye Mabhora eSolderKuongororwa kweDFM kusati kwagadzirwa zvakawanda kunobatsira kuchengetedza goho rekutanga.

3.1 Kugadzira Mapatani Enyika

Mapatani enzvimbo anofanirwa kuenderana nezvinodiwa IPC-7351Kugadzira mapedhi akakodzera kwakakosha kuti pave nekuvimbika Musangano wePCB uye Musangano wePCBA.

• Zvikamu zveCHIP (0402, 0603, 0805)Saizi yepedhi inofanira kuenderana nekuvhurika kwestencil uye chimiro chepedhi kuti isatsvedzere makuva.
• QFN (Quad Flat No-lead): Pasi Pad yekupisa inofanira kupatsanurwa kuderedza kubuda kwemvura uye kutonhora kwemajoini; shandisa chifukidzo chesolder chakatsanangurwa (SMD) kana chifukidzo chisina kusungirirwa chakatsanangurwa (NSMD) mapedhi zvakakodzera.
• BGA (Ball Grid Array): Dhayamita yepad inowanzova 80–85% yedhayamita yebhora; kuvhura mask yekusolder kunofanirwa kunge kwakanyatsojeka kudzivirira mask yekusolder papad. Kune BGA inopinza zvakanaka, shandisa dhamu remasiki emuchina wekusonesa upamhi ≤0.1 mm kana kubvisa dhamu kana zvichidikanwa.
• SOT/SOP/QFP: Kupinza kwakapfava kunoda upamhi hwakakwana hwemask ekusolder kuti isavharidzike.

3.2 Kupatsanurana kweZvikamu & Kutungamira

• Nzvimbo iri pedyo inofanira kusangana nezvinodiwa zvekusarudza-nekuisa nozzle uye kugadzirisa patsva (≥0.3 mm).
• Gadzirisa zvikamu zvakafanana munzira imwe chete kuti zvive nyore kuongorora AOI.
• Chengeta daro rakakwana pakati pezvinhu zvirefu nezvipfupi kudzivirira mumvuri panguva yekubuda kwemvura.

3.3 Mask yeSolder & Sikirini yeSiriki

• Dhamu reMask reSolder upamhi ≥0.1 mm kudzivirira kuvharika.
• Sikirini yeSiriki Hazvifanirwe kupindirana nemapedhi; chengeta nzvimbo iri pakati pe ≥0.2 mm.
• Kucherechedza Polarity, Chiratidzo chePin 1uye Murongi weReferensi zvinofanira kujeka.
• Sarudza ruvara rwemasiki anosonerwa (girini, bhuruu, dema, tsvuku, chena) zvichienderana nezvinodiwa nemutengi; ita shuwa kuti kudhinda kwenyaya kunonyatso verengwa.

4.1 DFT

DFT inogonesa kuyedzwa kwePCBA kunoshanda uye kwakachipa uye inotsigira kugadzirwa kwechirongwa chekuyedza uye dhizaini yezvigadzirwa.

• Kuedzwa kweFlying Probe: Hapana chinodiwa; chakanakira ma prototypes nemabhechi madiki.
• ICT (Mubvunzo weMukati meDunhu): Inoda nzvimbo dzekuyedza uye zvinhu zvinoshandiswa; yakakodzera vhoriyamu yakawanda. Tinodhirowa mapatani epombi yekuedza nekuchengetedzwa kwakakwana.
• FCT (Muedzo weDunhu Rinoshanda): Inosimbisa mashandiro chaiwo ePCBA.
• Kuskena Muganho (JTAG): Inoshandisa nzira yekuedza chip yakavakirwa mukati kuti ideredze mapoinzi ekuedza chaiwo.

Zvinodiwa zveDFT:

• Dhayamita yenzvimbo yekuyedza ≥0.8 mm, nzvimbo iri pakati ≥1.27 mm.
• Goverana nzvimbo dzekuyedza kune rumwe rutivi kana zvichibvira.
• Chengeta nzvimbo dzekuyedza dzisina dziviriro uye kure nezvinhu zvirefu.
• Chengetedza nzvimbo dzekuyedza dzemagetsi nemambure epasi kuti zvikwanise bvunzo pfupi yekudzima magetsi uye kuyerwa kwevoltage yemagetsi.

4.2 DFA

DFA inotarisa pakushanda zvakanaka kwekugadzira uye kudzivirira zvikanganiso.

• Kuisa PanelShandisa V-cut (V-Scoring) kana Kuruma Kwembeva / Buri reChidhindo. Nokuti gungano rePCB nezvikamu zvinorembera pamucheto, shandisa nzira yekutumira ma tabo nekurumwa nembeva.
• Njanji Yekushandisa Maturusi: 3–5 mm yakafara yekufambisa uye kuisa conveyor panzvimbo.
• Chiratidzo cheFiducial: Zvingangoita zviviri kusvika zvitatu zvepasi rose; zviyeuchidzo zvemunharaunda zvezvishandiso zvepitch fine-pitch zvakaita seBGA neQFN.
• Poka-Yoke: Iva nechokwadi chekuti zvinobatanidza zvine divi rakasiyana rekudzivirira kuiswa kumashure.

5.1 Kuvimbika kweChiratidzo (SI)

Matambudziko eSI anosanganisira Kufungisisa, Kutaurirana kweCrosstalk, Kupfuura mwero, Mupfudzeuye Nguva YekutsananguraKumhanya kwakanyanya Dhizaini yePCB anogona kushandisa kutevedzera marongerwo ekare uye kusimbiswa kwemamiriro ekunze mushure mekurongwa kuongorora dhayagiramu yeziso.

• Kufananidza Impedance: Kugumiswa kwechikamu chepakutanga, kugumiswa kwakafanana, kana kugumiswa kweAC.
• Kufananidza Hurefu: Kurongeka kweSerpentine kwemapoka edata/kero dzeDDR uye mapeya akasiyana.
• Kudzvinyirira kweCrosstalk: Mutemo we3W (nzvimbo ≥3× upamhi hwetrace); wedzera trace yekudzivirira zviratidzo zvakakosha.
• Dzokera kuburikidza ne: Wedzera mavias ekusona pedyo nekuchinja kwelayer kuti uderedze kupinza kwe loop.

5.2 Kuvimbika Kwesimba (PI)

Matambudziko ePI anosanganisira Ruzha rweSimba, Kudonha kweVoltageuye Kusvetuka PasiYakagadzirwa zvakanaka Network Yekuparadzira Simba (PDN) Zvakakosha kuti ishande zvakanaka.

• Kubvisa Capacitor: Isa 0.1 µF + 10 µF musanganiswa pedyo nepini yega yega yemagetsi; shandisa ma capacitor eESL akaderera yekupatsanura machira nekazhinji.
• Kupatsanurwa kweNdege yeMagetsi: Siyanisa ndege dzemagetsi dzeanalog nedzedhijitari; dzivisa kupatsanurana nezviratidzo zvinomhanya zvakanyanya.
• Nzira yeImpedance Yakaderera: Magetsi ari pedyo nepasi anogadzira capacitance yendege; kuchengetedza dielectric yakatetepa pakati pemagetsi nepasi.
• Kuburikidza neCount: Parallel multiple vias dzenzira dzine simba guru; shandisa mavhisi azere nemhangura kune ma-via ane simba remagetsi.

5.3 EMC (Kuenderana kweElectromagnetic)

Zvivharo zveEMC EMI (Kupindirana kweMagineti) uye EMS (Kugona Kubatwa Nemagetsi)Ongororo yekutevedzera mitemo yeEMC inogona kuona njodzi dzekugadzira usati waedza zviri pamutemo.

• Mutemo we20H: Mipendero yemagetsi ekudzokera shure ine 20× layer space kuti ideredze minda yemipendero.
• Kusefa kweInterface: Wedzera maTVS, ma common mode chokes, ma ferrite beads, uye ma capacitor pama I/O connectors.
• KudziviriraShandisa zvivharo zvekudzivirira panzvimbo dzinonyanya kukuvadzwa; gadzira mapedhi ekudzika yekubatanidza nhoo.
• Kristaro neWachi: Hapana nzira yekufambisa zvinhu pasi pemakristaro; shandisa nzira dzekuchengetedza uye chengeta nzira dzewachi dziri pfupi.

5.4 Dhizaini yePCB yeHDI

Kune magadzirirwo ane huwandu hwakawanda hwezvinhu, HDI PCB tekinoroji ine ma microvia akacherwa nelaser, maburi asingaonekweuye mavhisi akavigwa zvinogonesa zvinhu zvidiki zvechimiro uye huwandu hwakawanda hwenzira dzekufambisa zvinhu. Zvinhu zvakakosha zvekufunga nezvazvo:

• Chiyero che microvia kazhinji ≤1:1.
• Shandisa ma microvia akaunganidzwa yekuchinja kwezvikamu munzvimbo dzine vanhu vakawanda.
• Kuravira kwakateverana Maitiro acho anobvumira ma microvia layers akawanda.
• Via-in-pad ne kuzadza kwemhangura uye kuronga yeBGA fanout.

6.1 Dhizaini yeBGA

Dhizaini yeBGA pad inokanganisa zvakananga goho rekusungirirwa kwesimbi Musangano wePCB uye Musangano wePCBA, kunyanya mukushandiswa kweBGA muchimiro chakanaka.

• Dhayamita yepad ≈0.8–0.85× dhayamita yebhora (semuenzaniso, pad ye 0.25 mm yebhora re 0.3 mm).
• Chifukidzo chesolder chakakura kupfuura pad ne 0.025–0.05 mm padivi rega rega.
• NSMD (Mask Isina Solder Yakatsanangurwa) kana SMD (Mask yeSolder Yakatsanangurwa)NSMD inowanzo shandiswa pakushandisa BGA inopidika zvakanaka.
• Fanout vias 0.2 mm/0.1 mm kana pasi; shandisa Via-mu-Pad ne Yakazadzwa nemhangura / Yakazadzwa neResin kudzivirira kupwanyika kwesimbi.
• Wedzera zviratidzo zvemunzvimbo pedyo neBGA kuti pave nenzvimbo chaiyo.

6.2 Dhizaini yeQFN

Mapakeji eQFN (Quad Flat No-lead) anoda dhizaini yekunyatso pisa.

• Cheka padhi rekupisa kuita mapadhi madiki akawanda kana kushandisa padhi rimwe chete rine maburi akapatsanurwa kuti uderedze kuvhurika kwechinhu.
• Tambanudza mapini pads 0.2–0.3 mm kupfuura mupendero wepakeji kuti uongororwe neAOI.
• Shandisa Kubatanidza Resin kana Kuzadza Mhangura ye thermal pad vias kudzivirira solder wicking.
• Kuti uwane QFN ine simba guru, wedzera kupisa kuburikidza ne array kubatanidza kune mapuraneti emhangura emukati.

6.3 0402 / 0201 / 01005 Zvikamu Zvidiki

• 0402 nzvimbo yepedhi: 0.4–0.5 mm; 0201: 0.25–0.3 mm; 01005: 0.15–0.2 mm.
• Shandisa maburi estencil anodzivirira kuputira bhora (akachekwa kana akaderedzwa).
• Ipa zviratidzo zvakakwana zvekuvimbika kuti zvive nyore kuisa.
• Funga nezve kuburitsa guruu yekuungana kwemativi maviri nezvikamu zvinorema.

7.1 Dhizaini yeStencil Aperture

Dhizaini yekuvhura stencil inosarudza zvakananga kudhinda nepaste yesolder mhando uye inofanira kugadziriswa kune yega yega PCBA.

• Ukobvu hweStencil: 0.1–0.15 mm zvakajairika; 0.08 mm yezvinhu zvidiki; 0.2 mm yemagetsi akakwira.
• Chiyero cheNzvimbo: Nzvimbo yekuvhara/nzvimbo yemadziro > 0.66.
• Chiyero cheAspect: Upamhi hweAperture / ukobvu hweStencil > 1.5.
• Maburi Akakosha: QFN thermal pad yakawanda mahwindo madiki; BGA denderedzwa kana kuti sikweya rekuderedza; maburi ane bhora rinodzivirira kuputirwa kwezvikamu zvechip.
• Funga nezve stencil yematanho yehukuru hwakasanganiswa hwezvikamu (semuenzaniso, stencil yakakora yenzvimbo dzine magetsi akawanda, yakatetepa yenzvimbo dzine gomba rakatsetseka).

7.2 Kudzoreredza & Kusunga Mafungu

• Kugadzirisazve Kutenderera: Kune zvikamu zveSMT; zvinoda zvakakodzera chimiro chetembiricha (dziisa, nyikisa, dzokorora kuyerera, kutonhodza). Shandisa kuyererazve kwenitrogen kuti inyorovese uye ideredze oxidation.
• Kubatanidza Mafungu: Zvezvinhu zvinopinda nepaburi (DIP) uye maitiro ekunamira tsvuku kweSMT.
• Kusunga Mafungu Ekusarudza: Kubatanidza zvinhu zviri munzvimbo imwe chete; zvakanaka kumabhodhi ane tekinoroji yakasanganiswa.
• Maitiro Asina Mutobvu: SAC305 solder paste; tembiricha yekudzoka kwemvura yepamusoro 235–250 °C. Kupedzisa kwepamusoro kwakajairika kunosanganisira HASL isina mutobvu, BVUMIRANA, Dhipatimendi reMoto reVazvipiri, sirivha yekunyudzauye gaba rekunyudza.

7.3 Musanganiswa weMusanganiswa

Sanganisa SMT reflow uye DIP wave soldering, kana kushandisa Pin-in-Namatidza (PIP) yezvikamu zvine maburi ari kuyererazve.

8.1 Nzira dzeKuisa Panel

• V-cut (V-Scoring): Mutengo wakaderera; yemapuranga erectangular asina zvikamu zvemupendero.
• Kuruma Kwembeva / Buri reChidhindo: Pamabhodhi asina kurongeka kana zvikamu zvemupendero; shandisa nzira yekutumira ma tabo ne kurumwa nembeva.
• Zambuko + Kuruma Kwembeva: Inosanganisa simba nekureruka kwekuparadzanisa.

8.2 Chiratidzo cheMaturusi & Chiratidzo cheFiducial

• Upamhi hwesimbi yekushandisa: 3–5 mm.
• Chiratidzo cheFiducial: dhayamita ye1 mm, kuvhura mask yesolder ye2–3 mm, kupera kwegoridhe kana kunyudza tin.
• Zvishandiso zvemunharaunda zvemidziyo yeBGA/QFN fine-pitch.

8.3 Saizi yePaneli & Huwandu

• Saizi yepaneru iri mukati memiganhu yekusarudza-uye-kuisa uye kudzoreredza ovheni (≤400 mm × 400 mm).
• Enzanisa kushanda zvakanaka uye mashandisirwo ezvinhu; dzivisa kukanganiswa.
• Shandisa ma tabo anokanganisa kana nzvimbo dzakarongwa kuderedza kushushikana panguva yekubvisa mapaneli.

9.1 Kuongorora Magetsi

• DRC hapana zvikanganiso zvinouraya.
• Kuenzanisa kureba kwechiratidzo chakakosha, impedance, nzvimbo.
• Mambure emagetsi kuburikidza nekuverengwa uye kugona kwemagetsi.
• Kutevedzera kuvimbika kwechiratidzo mhedzisiro inoenderana nezvinodiwa nedhayagiramu yemaziso.

9.2 Kuongororwa kweDFM

• Saizi yepad paIPC-7351.
• Kupatsanurwa kwezvikamu kunosangana nezvinodiwa zvishoma zvekusarudzwa nenzvimbo.
• Chifukidzo chesolder dam, silkscreen, chiratidzo che polarity chakajeka.
• Kuvhurika kwestencil kunoenderana nechiyero chenzvimbo.
• Kuisa Panel uye njanji yekushandisa maturusi zviripo.

9.3 DFT Check

• Kuongororwa kwenzvimbo dzekuyedza pamambure akakosha.
• Mapoinzi ekuyedza haana kuvharwa.
• Kugona kushanda kweICT.

9.4 Kuongorora Kuungana

• Nhare yekushandisa uye zviratidzo zvefiducial zviripo.
• Nzira yekuisa paneli inonzwisisika.
• Kureba kwechikamu kubva paV-cut ≥0.5 mm.

9.5 Kukwana Kwemagwaro

• Kutumidza Gerber layer kwakarongeka.
• Nhamba dzezvikamu zveBOM, mapakeji, huwandu hwakarurama.
• Sarudza & isa faira rinoenderana neBOM.
• Faira remastencil rinoenderana nekugadzirwa kwePCB.

Kune zvigadzirwa zvekare kana kuti zvekare Mabhodhi edunhu rePCBA, PCBA reverse engineering inogona kugadzirazve mafaira ezvirongwa, BOM, uye Gerber kubva pamabhodhi chaiwo uye kubatanidza data rakawanikwa kune idzva Dhizaini yePCB uye Musangano wePCBA mashandiro ebasa.

Maitiro edu ekugadzira mainjiniya ekudzokera shure anosanganisira:

• Kuongororwa kwemifananidzo yebhodhi uye X-ray kugadzira mapu emukati mezvikamu.
• Kuzivikanwa kwechikamu uye kubviswa kweBOM kusanganisira zvinhu zvekare zvinotsiva zvikamu.
• Kutorwa kwechirongwa kubva pakuvandudzwa kwenetlist.
• Kuvaraidza kwePCB nekuvandudzwa kweDFM.
• Musangano wePCBA wemuenzaniso uye bvunzo dzinoshanda.

Mamwe masevhisi anowedzera kukosha:

• Kupfeka kwakabatana kune nharaunda dzakaoma.
• Kuisa muhari uye kufukidza kudzivirira kudedera.
• Kuzadza zvishoma yemapakeji eBGA neCSP.
• Gadzirisa patsva nekugadzirisa uchishandisa nzvimbo yekugadzirisa BGA.
• Kuvandudzwa kwebvunzo dzekushanda yePCBA yakagadzirwa.