PCBA ƒe ɖoɖowɔwɔ dzea egɔme zi geɖe kple Schematic Capture ƒe Nuléle, si kplɔe ɖo PCB ƒe Ðoɖowɔwɔ, . Mɔfiamewo ƒe ɖoɖowɔwɔ, . DRC (Aɖaŋuɖoɖo ƒe Sewo Me Dzodzro) ., kple DFM ƒe Dzesidede, emegbe nusiwo dona tso eme Gerber ƒe Nyatakakawo, . NC Drill ƒe Faɛlwo, . BOM (Nuwo Ŋuti Nyatakaka) ., kple Takpekpea ƒe Nɔnɔmetata. Le aɖaŋu siwo gɔme sese sesẽ gome la, . HDI PCB ƒe dɔwɔwɔ mɔ̃ɖaŋununya kple microvia siwo wotsɔa laser kuae kple lamination si kplɔ wo nɔewo ɖo ate ŋu abia tso esi.

Fail vevi siwo wotsɔ dea nyawo me dometɔ aɖewoe nye:

• Netlist ƒe ŋkɔwo
• Mɔ̃ɖaŋununya ƒe Nɔnɔmetata
• Kpeɖeŋutɔ ƒe Nyatakakagbalẽvi
• Dɔwɔwɔ ƒe Ŋutete ƒe Nuŋlɔɖi (trace kekeme suetɔ / dometsotso, do ƒe lolome suetɔ, ​​solder mask dam kekeme, impedance dziɖuɖu ƒe nudidiwo)

Core output files dometɔ aɖewoe nye:

• Gerber ƒe ʋu si nye RS-274X alo ODB++ ƒe dɔwɔwɔ
• NC Drill ƒe Faɛl
• Tia & De Faɛl la me
• Stencil Gerber ƒe agbalẽa
• Dodokpɔƒe Ŋuti Nyatakaka
• Takpekpe ƒe Nɔnɔmetata & Silkscreen File

2.1 Gɔmeɖose siwo ku ɖe ɖoɖo nu

Teƒeɖoɖo nye PCBA ƒe ɖoɖowɔwɔ ƒe gɔmeɖoanyi eye wòkpɔa ŋusẽ ɖe edzi tẽ Dzesiwo ƒe Mɔzɔzɔ ƒe Nyonyome, . Dzoxɔxɔ ƒe Dɔwɔwɔ, kple Nusiwo woate ŋu awɔ. Nuwo ɖoɖo nyuie le vevie ŋutɔ na impedance dziɖuɖu PCB aɖaŋuwo kple dijitaal nutome sue siwo zɔna kabakaba.

• Dɔwɔwɔ ƒe Mamã: Miɖe analog, digital, power, kple high-speed interface teƒewo ɖe vovo be woaƒo asa na nusiwo doa kplamatse wo.
• Dzesiwo ƒe Sisi: Da akpawo ɖe dzesi ƒe sisi ƒe mɔ dzi be woaɖe crossing kple loop area dzi akpɔtɔ.
• Akpa Vevi Siwo Wotsɔ Ðo Ŋgɔ: Da MCU/FPGA/SoC, DDR, gaƒoɖokui, kple ŋusẽ modules gbã.
• Nugbɔ ƒe Ðoɖowɔwɔ: Kadodowo, abɔtawo, kple LED siwo te ɖe ʋuƒoa ƒe gowo ŋu be woawɔ ɖe mɔ̃ɖaŋununya ƒe nudidiwo dzi.
• Dzoxɔxɔ ƒe Ðoɖowɔɖi: Ŋusẽ gã ƒe akpa siwo te ɖe dzoxɔxɔ ƒe mɔ̃wo alo dzoxɔxɔ ƒe mɔ̃wo ŋu; kpee ɖe eŋu dzoxɔxɔ to arrays dzi le akpa siwo le dzo dam te.

2.2 Mɔzɔzɔ ƒe Nu Veviwo

• Trace Kekeme & Fifia Ŋutete: 0.5 mm trace width on 1 oz copper tsɔa abe 1 A. Ne èdi elektrikŋusẽ si lolo wu la, zãe akɔbli na alo akɔbli ƒe kpekpeme siwo le kpekpem wu.
• Vovototo Atsu kple asi: USB, HDMI, LVDS, Ethernet hiã Didime ƒe Sɔsɔ, . Dometsotso Siwo Sɔ, kple Kpekpeɖeŋu Sesẽ be woalé be na wo dzesi ƒe fɔmaɖimaɖi eye nàɖee dzi akpɔtɔ nusiwo wotsɔ de eme ƒe bu kple return loss.
• Impedance si Dzi Woɖu: Dzesi siwo le du dzi ŋutɔ hiã be woabu akɔnta tso stack-up me ƒe nɔnɔme ƒe mɔxexeɖenu; asixɔxɔ siwo bɔ enye 50 Ω ɖeka-nuwuwu kple 100 Ω vovototo. Ele be mɔ̃ɖaŋuŋutinunya me toto nalɔ eme impedance dziɖuɖu kpeɖodzinana.
• Mɔ si dzi woato atrɔ ayi: Kpɔ egbɔ be wowɔ nufiame yameʋu blibo aɖe be woaƒo asa na yameʋu si me mama ƒe EMI nyawo; kpee ɖe eŋu stitching vias ƒe nutata te ɖe layer ƒe tɔtrɔwo ŋu.
• To eme: Ðe via siwo zɔna kabakaba dzi kpɔtɔ; zã Akɔta Kuku alo Ŋkuagbãtɔwo/Woɖi Vias ne ehiã. Le HDI ƒe nɔnɔmetatawo gome la, zãe via siwo woƒo ƒu ɖe wo nɔewo dzi alo via siwo nɔa tsatsam kple akɔbli si wotsɔ yɔa nu me.

DFM madeamedzi kplɔa ame yia... Solder ƒe Tɔdzisasrã, . Yɔdokpewo tsɔtsɔ ƒu gbe, . Fafɛ Solder Ƒuƒoƒowo, . Kpeɖeŋutɔ ƒe Tɔtrɔ, kple Solder Bɔlwo. DFM me dzodzro hafi woawɔe le agbɔsɔsɔ gã me kpena ɖe ame ŋu be woakpɔ nuku si dona tso eme gbãtɔ ta.

3.1 Anyigba ƒe Nɔnɔme ƒe Aɖaŋuwɔwɔ

Ele be anyigba ƒe nɔnɔmewo nawɔ ɖe edzi IPC-7351 ƒe agbalẽa. Pad ƒe wɔwɔme nyuie le vevie hafi woate ŋu aka ɖe edzi PCB ƒe kpekpe kple PCBA ƒe kpekpe.

• CHIP ƒe akpawo (0402, 0603, 0805) .: Ele be pad ƒe lolome nasɔ kple stencil ƒe aperture kple reflow profile be woaƒo asa na tombstoneing.
• QFN (Quad Flat No-kplɔ̃) .: Anyigba si le ete Dzoxɔxɔ ƒe Pad ele be woama wo me be woaɖe ʋuʋudedi kple ƒunukpeƒe siwo fa miamiamia dzi akpɔtɔ; zã solder mask si woɖe fia (SMD) . alo non-solder mask si woɖe fia (NSMD) . pads siwo sɔ.
• BGA (Ball Grid ƒe Ðoɖowɔɖi) .: Pad ƒe didime nyea 80–85% le bɔl ƒe didime nu; ele be solder mask ʋuʋu nade pɛpɛpɛ be woaƒo asa na solder mask le pad dzi. Ne èdi BGA si ƒe gbeɖiɖi le nyuie la, zãe solder mask dam kekeme ≤0.1 mm alo ɖe tɔdzisasrã ɖa ne ehiã.
• SOT/SOP/QFP ƒe dɔwɔwɔ: Fine pitch bia be solder mask dam ƒe kekeme nasɔ be wòaxe mɔ ɖe bridging nu.

3.2 Akpawo ƒe Dometsotso & Mɔfiame

• Ele be akpa siwo te ɖe wo nɔewo ƒe dometsotso naɖo pick-and-place nozzle kple rework nudidiwo gbɔ (≥0.3 mm).
• Dzra akpa siwo sɔ ɖe wo nɔewo nu ɖe ​​mɔ ɖeka nu be AOI ƒe ŋkuléle ɖe wo ŋu nanɔ bɔbɔe wu.
• Na didime si sɔ nanɔ akpa kɔkɔwo kple kpuiwo dome be vɔvɔli nagagblẽ le wo ŋu le tsi si le sisim ake me o.

3.3 Solder Mask & Seda ƒe ʋuƒo

• Solder Mask Dam kekeme ≥0.1 mm be woaxe mɔ ɖe tɔdzisasrã ƒe ƒoƒo nu.
• Seda ƒe nutrenu mele be woatsɔ aŋekotokuwo atsyɔ wo nɔewo dzi o; na ≥0.2 mm ƒe ʋuʋu.
• Polarrity ƒe Dzesidede, . Pin 1 Dzesi, kple Numekugbalẽ ƒe Dzesidede ele be eme nakɔ.
• Tia solder mask ƒe amadede (amadede dzẽ, blɔ, yibɔ, dzĩ, ɣi) le asisiwo ƒe didi nu; kpɔ egbɔ be xotutuwo tata ƒe xexlẽme le bɔbɔe.

4.1 DFT ƒe dɔwɔwɔ

DFT na be woate ŋu awɔ PCBA dodokpɔ nyuie, si mexɔ asi o eye wòdoa alɔ dodokpɔ ƒe ɖoɖowɔɖi ƒe wɔwɔ kple fixture ƒe ɖoɖowɔwɔ.

• Yameʋuɖoɖo ƒe Nusɔsrɔ̃ Dodokpɔ: Mehiã be woatsɔ fixture aɖeke awɔe o; si sɔ nyuie na kpɔɖeŋuwo kple hatsotso suewo.
• ICT (Dodokpɔ le Nutomea Me) .: Ebia dodokpɔ teƒewo kple nusi woatsɔ aɖoe; si sɔ na gbeɖiɖi sesẽ. Míewɔa aɖaŋu dodokpɔ teƒe ƒe kpɔɖeŋuwo kple nutsyɔtsyɔ si sɔ.
• FCT (Dɔwɔwɔ ƒe Nutome Dodokpɔ) .: Eɖo kpe PCBA ƒe dɔwɔwɔ ŋutɔŋutɔ dzi.
• Liƒodzikpɔƒe (JTAG) .: Ezãa chip dodokpɔ ƒe susuŋudɔwɔwɔ si wotu ɖe eme tsɔ ɖea dodokpɔ teƒe ŋutɔŋutɔwo dzi kpɔtɔna.

DFT ƒe nudidiwo:

• Dodokpɔ teƒe ƒe didime ≥0.8 mm, dometsotso ≥1.27 mm.
• Ma dodokpɔƒewo ɖe akpa ɖeka ne anya wɔ.
• Na dodokpɔwɔƒewo nagaxe mɔ na o eye nànɔ adzɔge tso akpa kɔkɔwo gbɔ.
• Dzra dodokpɔ teƒewo ɖo na ŋusẽ kple anyigbadzi ɖɔwo be woate ŋu awɔe power-off dodokpɔ kpui aɖe kple ŋusẽ-ʋu ƒe ʋuʋudedi dzidzedze.

4.2 DFA ƒe dɔwɔwɔ

DFA léa fɔ ɖe kpekpea ƒe dɔwɔwɔ nyuie kple vodadawo nu tsitsi ŋu.

• Panelization ƒe nyawo: Zã V-tso (V-Dzesidede) . alo Mouse Bite / Stamp Do. Elabena pcb ƒe kpekpe kple akpa siwo le nugbɔ, zã tab ƒe mɔfiame kple sisiblisi ƒe ɖuɖu.
• Dɔwɔnuwo ƒe Ketekemɔ: 3–5 mm kekeme na conveyor transfer kple positioning.
• Fiducial Mark: Xexeame katã ƒe fiducial 2–3 ya teti; nutoa me fiducials na mɔ̃ siwo ƒe gbeɖiɖi le nyuie abe BGA kple QFN ene.
• Poka-Yoke ƒe dɔwɔwɔ: Kpɔ egbɔ be kadodowo ƒe nɔnɔme le etɔxɛ be woaxe mɔ ɖe megbedede nu.

5.1 Dzesiwo ƒe Fɔmaɖimaɖi (SI) .

SI nyawo dometɔ aɖewoe nye Dzedze, . Crosstalk ƒe nyawo, . Nusiwo gbɔ eme, . Undershoot ƒe afɔkpodzi, kple Ɣeyiɣi ƒe Skew. Duƒuƒu sesĩe PCB ƒe ɖoɖowɔwɔ ate ŋu azãe do ŋgɔ na ɖoɖowɔwɔ ƒe nɔnɔmetata kple ɖoɖowɔwɔ vɔ megbe ƒe kpeɖodzinana be woada asɔ le ŋku ƒe nɔnɔmetata.

• Impedance ƒe sɔsɔ kple wo nɔewo: Dzɔtsoƒe ƒe xexlẽdzesiwo ƒe nuwuwu, parallel nuwuwu, alo AC ƒe nuwuwu.
• Didime ƒe Sɔsɔ: Serpentine routing na DDR data/adrɛs ƒuƒoƒowo kple vovototo eve.
• Crosstalk ƒe Nutete: 3W se (dometsotso ≥3× trace kekeme); tsɔ dzɔlawo ƒe dzesiwo kpe ɖe eŋu hena dzesi veviwo.
• Trɔ yi Via: Tsɔ stitching vias kpe ɖe layer tɔtrɔwo ŋu be woaɖe loop inductance dzi akpɔtɔ.

5.2 Ŋusẽ ƒe Nuteƒewɔwɔ (PI) .

PI nyawo dometɔ aɖewoe nye Ŋusẽ ƒe Toɣliɖeɖe, . Voltage ƒe ɖiɖi, kple Anyigbadzi Bounce. A si ŋu wotrɔ asi le nyuie Ŋusẽmamã ƒe Dɔwɔƒe (PDN) . le vevie ŋutɔ na dɔwɔwɔ si li ke.

• Decoupling ƒe Kapacitor: Da 0.1 μF + 10 μF ƒe ƒuƒoƒo ɖe ŋusẽ ƒe pin ɖesiaɖe gbɔ; zã capacitors siwo ƒe ESL bɔbɔ na decoupling si ƒe frequency lolo.
• Ŋusẽ Yameʋu ƒe Mamã: Analog kple digital ŋusẽ yameʋuwo ɖe vovo; ƒo asa na mamãwo tsotso kple dzesi siwo le du dzi sesĩe.
• Mɔ si dzi Impedance le bɔbɔe: Ŋusẽ kple anyigba yameʋu siwo te ɖe wo nɔewo ŋu naa yameʋu ƒe ŋutete; lé dielectric tsɛ si le ŋusẽ kple anyigba ƒe ƒuƒoƒo dome ɖe te.
• To Xexlẽme dzi: Parallel multiple vias na mɔ siwo dzi fifia sɔ gbɔ ɖo; zã via siwo me akɔbli yɔ fũu na via siwo me wozãa elektrikŋusẽ le ŋutɔ.

5.3 EMC (Elektrikŋusẽ ƒe Dɔwɔnawo ƒe Ðekawɔwɔ) .

EMC ƒe nutsyɔnuwo EMI (Elektrikŋusẽ ƒe Mɔxexe Ðe Enu) . kple EMS (Elektrikŋusẽ ƒe Dɔlékuiwo ƒe Dɔléle) .. EMC ƒe sedziwɔwɔ me toto do ŋgɔ ate ŋu ade dzesi afɔku siwo le aɖaŋuwɔwɔ me hafi woadoe kpɔ le se nu.

• 20H Sedede: Recess ŋusẽ yameʋu ƒe goawo to 20× layer dometsotso be woaɖe fringing agblewo dzi akpɔtɔ.
• Interface ƒe Ʋuʋu: Tsɔ TVS, common mode chokes, ferrite beads, kple capacitors kpe ɖe I/O kadodowo ŋu.
• Ametakpɔnu: Zã nutsyɔnu siwo wotsɔ kpɔa ame ta le teƒe siwo ŋu woate ŋu awɔ nuvevii; na anyigbadzinu siwo wotsɔna ƒoa anyigbae na akpoxɔnu ƒe kpeɖeŋutɔ.
• Crystal & Gaƒoɖokui: Mɔzɔzɔ aɖeke mele kristalo te o; zã dzɔlawo ƒe dzesiwo eye nàna gaƒoɖokui ƒe dzesiwo nanɔ kpuie.

5.4 HDI PCB ƒe ɖoɖowɔwɔ

Le aɖaŋu siwo ƒe kpekpeme lolo gome la, . HDI PCB ƒe dɔwɔwɔ mɔ̃ɖaŋununya kple microvia siwo wotsɔa laser kuae, . ŋkunɔwo ƒe viawo, kple woɖi viawo enaa nɔnɔme ƒe akpa suewo kple mɔfiame ƒe tsɔtsɔme si lolo wu te ŋu wɔa dɔ. Nu vevi siwo ŋu nàbu:

• Microvia ƒe akpa ƒe xexlẽme ƒe sɔsɔme zi geɖe la, ≤1:1.
• Zã microvia siwo woƒo ƒu ɖe wo nɔewo dzi na layer ƒe tɔtrɔwo le teƒe siwo amewo sɔ gbɔ ɖo ŋutɔ.
• Lamination si kplɔ wo nɔewo ɖo dɔwɔwɔ ɖe mɔ ɖe microvia ƒuƒoƒo geɖe ŋu.
• Via-le-pad dzi kple akɔbli si wotsɔ yɔa nu me kple planarization ƒe ɖoɖowɔwɔ na BGA ƒe fanout.

6.1 BGA ƒe Aɖaŋuwɔwɔ

BGA pad ƒe wɔwɔme kpɔa ŋusẽ ɖe soldering ƒe kutsetse dzi tẽ na PCB ƒe kpekpe kple PCBA ƒe kpekpe, vevietɔ le BGA dɔwɔɖoɖo siwo me gbeɖiɖi nyuiwo le me.

• Pad ƒe didime ≈0.8–0.85× bɔl ƒe didime (le kpɔɖeŋu me, 0.25 mm pad na 0.3 mm bɔl).
• Solder mask ʋuʋu lolo wu pad to 0.025–0.05 mm le axa ɖesiaɖe.
• NSMD (Non-Solder Mask si woɖe fia) . alo SMD (Woɖe Solder Mask Gɔme) .; NSMD si bɔ na BGA si ƒe gbeɖiɖi le nyuie.
• Fanout vias 0.2 mm/0.1 mm alo esi le sue wu; zã Via-le-Pad dzi kple Akɔbli yɔ / Resin yɔ fũ be woaxe mɔ ɖe solder ƒe ʋuʋu nu.
• Kpee ɖe eŋu nutoa me fiducial dzesiwo te ɖe BGA ŋu be woatsɔ aɖoe ɖe teƒe si sɔ pɛpɛpɛ.

6.2 QFN ƒe Aɖaŋuwɔwɔ

QFN (Quad Flat No-lead) packages hiã beléle na dzoxɔxɔ ƒe pad ƒe wɔwɔme.

• Ma dzoxɔxɔ ƒe aŋenu ɖe ​​akpa sue geɖe me alo nàzã aŋe ɖeka si ƒe stencil ƒe ʋɔtruwo le akpa vovovowo me be nàɖe ʋuʋudedi dzi akpɔtɔ.
• Keke pin pads 0.2–0.3 mm yi ŋgɔ wu package edge hena AOI ƒe ŋkuléle ɖe eŋu.
• Zã Resin ƒe Plugging alo Akɔbli si Wotsɔ Klɔ Nu na dzoxɔxɔ ƒe pad vias be woaxe mɔ ɖe solder wicking nu.
• Ne èdi QFN si ŋu ŋusẽ le ŋutɔ la, tsɔe kpee dzoxɔxɔ to ƒuƒoƒo dzi do ƒome kple akɔbli yameʋu siwo le eme.

6.3 0402 / 0201 / 01005 Nu suewo ƒe akpa aɖewo

• 0402 ƒe dometsotso: 0.4–0.5 mm; 0201: 0.25–0.3 mm ƒe didime; 01005: 0.15–0.2 mm.
• Zã anti-solder ball stencil apertures (notched alo ɖe edzi).
• Na fiducial dzesi siwo sɔ be woatsɔ aɖo teƒea wòade pɛpɛpɛ.
• Bu eŋu glue tsɔtsɔ na amewo na axa eve ƒe kpekpe kple akpa kpekpewo.

7.1 Stencil ƒe Aperture ƒe Aɖaŋuwɔwɔ

Stencil aperture ƒe wɔwɔme ye ɖonɛ tẽ solder paste ƒe agbalẽtata nyonyome eye ele be woawɔe wòanyo wu na PCBA ɖesiaɖe.

• Stencil ƒe Titrime: 0.1–0.15 mm si bɔ; 0.08 mm na akpa suewo; 0.2 mm na elektrikŋusẽ si nu sẽ.
• Nutoa me ƒe xexlẽme ƒe sɔsɔme: Aperture ƒe teƒe / aperture gli ƒe teƒe > 0.66.
• Aspect Ratio ƒe xexlẽme: Aperture ƒe kekeme / stencil ƒe titrime > 1.5.
• Aperture Tɔxɛwo: QFN dzoxɔxɔ pad fesre sue geɖe; BGA ƒe gotagome alo dzogoe ene me dzi ɖeɖe kpɔtɔ; anti-solder bɔl notched apertures na chip akpawo.
• Bu eŋu afɔɖeɖe ƒe stencil na akpa vovovoawo ƒe lolome siwo wotsaka (le kpɔɖeŋu me, stencil si le ɣie na teƒe siwo elektrikŋusẽ sɔ gbɔ ɖo, si le tsɛ na esiwo ƒe gbeɖiɖi le nyuie).

7.2 Gbugbɔgadzɔ & Ƒutsotsoewo ƒe Soldering

• Gbugbɔgadzɔ ƒe Soldering: Na SMT ƒe akpa aɖewo; bia be wòasɔ dzoxɔxɔ ƒe nɔnɔmetata (do dzo do ŋgɔ, de tsii, gbugbɔ tsi, fafa). Zã nitrogen ƒe sisi ake hena tsidzadza si nyo wu kple oxidation dzi ɖeɖe kpɔtɔ.
• Ƒutsotsoewo ƒe Soldering: Na to-do (DIP) akpawo kple SMT dzĩ glue dɔwɔwɔ.
• Tiatia Ƒutsotsoewo ƒe Soldering: Localized soldering na to-do ƒe akpawo; si sɔ nyuie na mɔ̃ɖaŋununya vovovowo ƒe boardwo.
• Dɔwɔna si me Kplu Manɔmee: SAC305 si wotsɔa ga ƒoa nui; dzoxɔxɔ si sɔ gbɔ wu si wogbugbɔna ƒuna la nye 235–250 °C. Nusiwo bɔ ɖe anyigba dzi wu enu dometɔ aɖewoe nye HASL si me lifi mele o, . LƆ̃ ƉE EDZI, . Lɔlɔ̃nu Faa Dzotsidɔwɔƒe, . klosalo si wotsɔ nyrɔa nu me, kple tsinyenye ƒe tin.

7.3 Takpekpe si wotsaka

Tsɔ SMT reflow kple DIP wave soldering ƒo ƒu, alo zãe Pin-in-Paste (PIP) ƒe ƒuƒoƒo . na to-do ƒe akpa siwo le reflow me.

8.1 Panelization ƒe Mɔnuwo

• V-tso (V-Dzesidede) .: Ga home sue aɖe ko; na ʋuƒo siwo le dzogoe ene me siwo me nugbɔ ƒe akpa aɖeke mele o.
• Mouse Bite / Stamp Do: Na ʋuƒo alo nugbɔ ƒe akpa siwo mewɔ ɖeka o; zã tab ƒe mɔfiame kple sisiblisi ƒe ɖuɖu.
• Tɔdzisasrã + Mouse ƒe ɖuɖu: Eƒoa ŋusẽ kple kaklã bɔbɔe nu ƒu.

8.2 Dɔwɔnuwo Rail & Fiducial Dzesi

• Dɔwɔnuwo ƒe ketekemɔ ƒe kekeme: 3–5 mm.
• Fiducial dzesi: 1 mm ƒe didime, 2–3 mm solder mask ʋuʋu, sika alo nyɔnyrɔ̃ tin nuwuwu.
• Nutoa me fiducials na BGA/QFN fine-pitch mɔ̃wo.

8.3 Panel ƒe lolome & Agbɔsɔsɔ

• Panel ƒe lolome le pick-and-place kple reflow oven ƒe seɖoƒewo me (≤400 mm × 400 mm).
• Da sɔ le dɔwɔwɔ nyuie kple nuwo zazã me; ƒo asa na aʋawɔwɔ.
• Zã breakaway tabwo alo routed slots ƒe ɣeyiɣiwo be woaɖe nuteɖeamedzi dzi akpɔtɔ le depaneling me.

9.1 Elektrikŋusẽ ƒe Dzodzro

• DRC mewɔ vodada siwo wua ame o.
• Vevietɔ dzesi didime sɔsɔ, impedance, dometsotso.
• Ŋusẽ net to xexlẽme kple fifia ŋutete.
• Dzesi ƒe blibonyenye ƒe nɔnɔmetata emetsonuwo ɖo ŋku ƒe nɔnɔmetata ƒe nudidiwo gbɔ.

9.2 DFM ƒe Dzodzro

• Pad ƒe lolome le IPC-7351 nu.
• Kpekpeɖeŋunanuwo ƒe dometsotso ɖoa nudidi suetɔ kekeake si nye pick-and-place gbɔ.
• Solder mask dam, seda, polarity dzesi kɔ.
• Stencil aperture doa go area ratio.
• Panelization ƒe nyawo kple dɔwɔnuwo ƒe ketekemɔ fifia.

9.3 DFT ƒe Dzodzro

• Dodokpɔ teƒe ƒe nutsyɔtsyɔ le ɖɔ veviwo dzi.
• Dodokpɔ teƒewo mɔxeɖenu aɖeke manɔmee.
• ICT fixture ƒe ŋutete.

9.4 Takpekpea ƒe Dzesidede

• Tooling rail kple fiducial dzesiwo le afima.
• Panelization mɔnu si me susu le.
• Kpeɖeŋutɔ ƒe didime tso V-tso ≥0.5 mm.

9.5 Nuŋlɔɖiwo ƒe Blibodede

• Gerber layer ŋkɔyɔyɔ si woɖo ɖe ɖoɖo nu.
• BOM ƒe akpa ƒe xexlẽdzesiwo, agbalẽviwo, agbɔsɔsɔmewo de pɛpɛpɛ.
• Tia & tsɔ faɛl la sɔ kple BOM.
• Stencil faɛl sɔ kple PCB ƒe nɔnɔme.

Le domenyinu ƒe adzɔnuwo alo esiwo megali o ta PCBA nutome sue takpekpewo, . PCBA ƒe megbenyawo gbɔ kpɔkpɔ ate ŋu agbugbɔ awɔ schematics, BOM, kple Gerber files tso physical boards me eye wòatsɔ nyatakaka siwo wogbugbɔ axɔ la aƒo ƒu kple yeye PCB ƒe ɖoɖowɔwɔ kple PCBA ƒe kpekpe dɔwɔwɔ ƒe ɖoɖo.

Míaƒe reverse engineering ƒe ɖoɖoa dometɔ aɖewoe nye:

• Board ƒe nɔnɔmetatawo ɖeɖe kple X-ray ƒe ŋkuléle ɖe nu ŋu be woawɔ anyigbatata na ƒuƒoƒo ememetɔwo.
• Kpeɖeŋutɔ ƒe dzesidede kple BOM ɖeɖe siwo dome akpa aɖewo ɖɔliɖɔli siwo megali o hã le.
• Schematic capture tso netlist gbugbɔgatu me.
• PCB ɖoɖo modzakaɖeɖe kple DFM ƒe ŋgɔyiyiwo.
• Kpɔɖeŋu PCBA kpekpe kple dɔwɔwɔ ƒe dodokpɔ.

Dɔ bubu siwo ŋu asixɔxɔ le:

• Nusiwo wotsɔ blaa nu ɖe ​​ɖoɖo nu na nuto sesẽwo.
• Potting kple encapsulation na ʋuʋudedi ƒe tsitretsitsi.
• De dzesi nu le ete na BGA kple CSP ƒe agbalẽviwo.
• Gbugbɔ wɔ dɔ eye nàdzrae ɖo zã BGA gbugbɔgawɔ dɔwɔƒe.
• Dɔwɔwɔ dodokpɔ ƒe ŋgɔyiyi na PCBA si wowɔ ɖe ɖoɖo nu.