Umklamo we-PCBA uvame kucala nge . Kutsatfwa kweSchemu, kulandzelwe ngu . Kubekwa kwe-PCB, Umzila, DRC (Hlola Umtsetfo Wekuklama), futsi Hlola i-DFM, bese kuba nemiphumela Emafayela eGerber, Emafayela e-NC Drill, BOM (Umtsetfosivivinyo Wetintfo), futsi Umdvwebo Wemhlangano. Kumadizayini layinkimbinkimbi, I-HDI PCB tebuchwepheshe nge ema-microvias labhobolwe nge-laser futsi kulandzelana kungase kudzingeke.

Emafayela layinhloko ekufaka afaka ekhatsi:

• Luhla lwenethi
• Umdvwebo weMshini
• Liphepha lemininingwane yetincenye
• Umbhalo Wemandla Enchubo (bubanti lobuncane bekulandzelela/sikhala, bubanti lobuncane bembobo, bubanti bedamu le-solder mask, tidzingo tekulawula i-impedance)

Emafayela laphumako lamcoka afaka ekhatsi:

• I-RS-274X nobe ODB++
• Ifayela le-NC Drill
• Khetsa futsi ubeke lifayela
• Sitensela Gerber
• Umbiko Weliphuzu Lekuhlola
• Umdvwebo Wekuhlangana & Ifayela Lesikrini Sesilika

2.1 Timiso Tekubeka

Kubekwa kusisekelo sekwakhiwa kwe-PCBA futsi kuthinta ngco . Lizinga Lendlela Yesiginali, Kusebenta Kwekushisa, futsi Kukhicitwa. Kubekwa kahle kubaluleke kakhulu kulawula impedance PCB imiklamo kanye netisekethe tedijithali letinesivinini lesikhulu.

• Kuhlukanisa lokusebentako: Hlukanisa i-analog, idijithali, emandla, kanye netindzawo tekusebentisana ngesivinini lesikhulu kute ugweme kuphazamiseka.
• Kugeleta kweSiginali: Faka tincenye endzaweni yekugeleta kwesiginali kwentela kunciphisa kwewela kanye nendzawo ye-loop.
• Incenye Lebalulekile Lebalulekile: Faka i-MCU / FPGA / SoC, i-DDR, iwashi, kanye nemamojula emandla kucala.
• Kubekwa Emphethweni: Tihlanganisi, tinkinobho, kanye nema-LED edvute nemiphetho yebhodi kute kuhlangabetwe netidzingo temshini.
• Kuhleleka Kwekushisa: Tincenye letinemandla lamakhulu letisedvute netindlela tekusakata kushisa noma emaphedi lashisako; hlanganisa thermal ngekusebentisa ema-arrays ngaphansi kwetincenye letishisako.

2.2 Tintfo letibalulekile tekuhamba

• Landzelela Bubanti & Likhono Lamanje: 0.5 mm bubanti bekulandzelela ku 1 oz copper ithwala cishe 1 A. Kute utfole lamanje laphakeme, sebentisa . litfusi le noma tisindvo telitfusi letikhulu.
• Umbhangqwana lowehlukile: I-USB, i-HDMI, i-LVDS, i-Ethernet idzinga Kuhambisana kwebudze, Sikhala Lesilinganako, futsi Kuhlanganiswa lokucinile kugcina bucotfo besiginali bese unciphisa kulahlekelwa ngekufaka futsi kubuyisela kulahlekelwa.
• Impedansi Lelawulwako: Timphawu letinesivinini lesikhulu tidzinga impedance yesici lebalwa kusuka ku-stack-up; emanani lavamile 50 Ω single-end kanye 100 Ω umehluko. Lokubuyeketwa kwebunjiniyela kufanele kufaka ekhatsi kulawula kuvimbela kucinisekisa.
• Indlela Yekubuya: Cinisekisa indiza lephelele yekubhekisa kugwema tindzaba te-EMI yendiza leyehlukene; hlanganisa kutfunga ngetindlela edvute netingucuko telucwencwe.
• Nga: Nciphisa ema-vias lasheshako; sebentisa Kubhobota emuva nobe Timphumputhe/Tindlela Letingcwatjiwe nangabe kunesidzingo. Kute utfole imiklamo ye-HDI, sebentisa ngetindlela letipakishiwe nobe vias lenyakatako kanye na- kugcwaliswa kwelitfusi.

I-DFM lembi iholela ku Kuhlanganisa ngeSolder, Kufaka ematje emathuna, Emalunga eSolder Labandzako, Shift yetincenye, futsi Emabhola eSolder. Kuhlatiya kwe DFM ngaphambi kwekukhicita ngebunyenti kusita kuvikela umkhicito wekucala-wekudlula.

3.1 Kuklama Iphethini Yemhlaba

Emaphethini emhlaba kumele ahambisane ne IPC-7351. Umklamo wephedi lofanele ubalulekile kute wetsembeke Umhlangano we-PCB futsi Umhlangano we-PCBA.

• Tincenye te-CHIP (0402, 0603, 0805): Usayizi wephedi kumele uhambisane nekuvuleka kwestencil kanye nephrofayli yekugeleta kabusha kugwema kugcotjwa ngematje emathuneni.
• QFN (I-Quad Flat Kute umholi): Ngephansi Iphedi Leshisako kufanele ihlukaniswe kwentela kunciphisa voiding kanye nemalunga labandzako; sebentisa imaskhi ye-solder lechaziwe (SMD) nobe imaskhi lengakasoldi lechaziwe (NSMD) emaphedi ngendlela lefanele.
• BGA (Luhlelo Lwegridi Yelibhola): Pad ububanzi kuvame 80-85% ububanzi ibhola; solder imaski kuvulwa kumele kube ngqo kugwema solder imaski on pad. Ku-BGA lencane, sebentisa idamu lemaski yesolda bubanti ≤0.1 mm noma kucedza lidamu uma kudzingeka.
• SOT/SOP/QFP: I-pitch lencane idzinga bubanti bedamu le-solder mask leyenele kuvikela kubhubha.

3.2 Sikhala Setincenye & Kucondziswa

• Sikhala setincenye letisedvute kumele sihlangabetane netidzingo te-nozzle yekukhetsa-nekubeka kanye nekusebenta kabusha (≥0.3 mm).
• Lungisa tincenye letifanako ngendlela lefanako kute kube lula kuhlolwa kwe-AOI.
• Gcina libanga lelenele emkhatsini wetincenye letindze naletimfisha kugwema umphumela wesitfunti ngesikhatsi sekugeleta kabusha.

3.3 Sifonyo Sesolda & Sikrini Sesilika

• Lidamu leMaski yeSolda bubanti ≥0.1 mm kuvikela kubhuloho.
• Sikrini sesilika akukafaneli kutsi emaphedi ahlangane; gcina ≥0.2 mm kuvuleka.
• Kumaka kwe Polarity, Inkomba ye-Pin 1, futsi Sikhombisi Sesikhombo kufanele kucace.
• Khetsa umbala wemaski we-solder (luhlata, loluhlata sasibhakabhaka, lomnyama, lobovu, lomhlophe) ngekuya ngekukhetsa kwemakhasimende; kucinisekisa kutsi kushicilelwa kwe-legend kuyafundzeka.

4.1 I-DFT

DFT kuniketa emandla, phansi-tindleko PCBA kuhlolwa kanye isekela kuhlolwa luhlelo intfutfuko kanye fixture design.

• Kuhlolwa kwe-Probe Lendizako: Kute sicumbi lesidzingekako; ilungele ema-prototypes kanye nemaqoqo lamancane.
• ICT (Sivivinyo Sesifundza): Kudzinga emaphuzu ekuhlolwa kanye nekulungiswa; ilungele ivolumu lesetulu. Siklama emaphethini emaphuzu ekuhlola ngekuhlanganiswa lokwenele.
• FCT (Sivivinyo Sesiyingi Lesisebentako): Icinisekisa kusebenta kwe-PCBA yangempela.
• Kuhlola umncele (JTAG): Usebentisa logic yekuhlolwa kwe-chip leyakhelwe ngaphakathi kunciphisa emaphuzu ekuhlolwa emtimbeni.

Tidzingo te-DFT:

• Ububanzi bephuzu lokuhlola ≥0.8 mm, sikhala ≥1.27 mm.
• Sabalalisa emaphuzu ekuhlola ngakulolunye luhlangotsi uma kungenteka.
• Gcina emaphuzu ekuhlolwa angavinjelwa futsi akhashane netincenye letindze.
• Beka emaphuzu ekuhlolwa emandla kanye nemanethi laphansi kute kuniketelwe emandla sivivinyo lesifishane sekucima emandla futsi Kukala ivoltheji yemandla.

4.2 I-DFA

DFA igcile ekuhlanganiseni kahle kanye nekuvimbela emaphutsa.

• Kufaka emaphaneli: Sebentisa V-cut (V-Kushaya) nobe Kulunywa ligundvwane / Imbobo Yesitembu. Kutsi pcb umhlangano ngetincenye letilenga emphethweni, sebentisa umzila wethebhu ngekulunywa ligundvwane.
• Sitimela Semathuluzi: 3–5 mm ngebubanti bekudluliswa kwe conveyor kanye nekubeka.
• Limaki Lekwetsembeka: Okungenani 2-3 fiducials emhlabeni wonkhe; fiducials lendzawo yetintfo letine-pitch lencane njenge-BGA ne-QFN.
• Lijoka le-Poka: Cinisekisa kutsi tihlanganisi tinekucondziswa lokuhlukile kuvikela kufakwa lokubuyela emuva.

5.1 Bucotfo Besiginali (SI)

Tindzaba te-SI tifaka ekhatsi Kubuyisa, Kukhuluma ngekuphambana, Kwehlula, Kudubula ngaphansi, futsi Sikhatsi Skew. Sivinini lesikhulu Umklamo we-PCB ungasebentisa kulingisa ngaphambi kwekuhleleka futsi kucinisekiswa ngemuva kwekuhleleka kuhlola Umdvwebo wemehlo.

• Kuhambisana kwe-Impedance: Kucedvwa kwechungechunge lwemtfombo, kucedvwa lokuhambisanako, noma kucedvwa kwe-AC.
• Kuhambisana kwebudze: Umzila we-Serpentine we-DDR data / emacembu emakheli kanye netimbili temehluko.
• Kucindzetelwa kwe-Crosstalk: 3W umtsetfo (sikhala ≥3 × umlandvo ububanzi); engeta imikhondo yekugadza yetimphawu letibucayi.
• Buyisela ngekusebentisa: Faka ema-vias ekuthunga edvute netingucuko telucwencwe kute unciphise inductance ye-loop.

5.2 Kutsembeka Kwemandla (i-PI)

Tindzaba te-PI tifaka ekhatsi Umsindvo wemandla, Kwehla kwevoltheji, futsi Kugcuma Emhlabatsini. Indlela leyakhiwe kahle . Inethiwekhi Yekusabalalisa Emandla (i-PDN) kubaluleke kakhulu ekusebenteni lokuzinzile.

• Kukhipha i-Capacitor: Beka 0.1 μF + 10 μF inhlanganisela edvute nephini ngayinye yamandla; sebentisa ema-ESL laphansi ngekutsi kukhishwe imvamisa lesetulu.
• Kuhlukaniswa kwendiza yemandla: Tindiza temandla te-analog kanye netedijithali letihlukene; kugwema kwewela tincenye letinetimphawu letinesivinini lesikhulu.
• Indlela Lephansi Yekuvimbela: Amandla lasedvute kanye netindiza letiphansi kudala i-capacitance yendiza; gcina dielectric mncane emkhatsini amandla kanye netingcingo phansi.
• Ngekubala: Vias letinyenti letihambisanako tetindlela letisezingeni lelisetulu; sebentisa ema-vias lagcwele litfusi nge-vias lesetulu yamanje.

5.3 EMC (Kuhambisana Kwegezi)

I-EMC ihlanganisa EMI (Kuphazamiseka Kwegezi) futsi EMS (Kutsatseka Kwegezi). Kubuyeketwa kwekulandzela kwe-EMC ngaphambi kwekulandzela kungabona bungoti bekuklama ngaphambi kwekuhlolwa lokusemtsetfweni.

• 20H Umtsetfo: Recess emandla indiza imiphetho nge 20 × ungqimba isikhala kunciphisa fringing emasimu.
• Kuhlunga kwesikhombisi: Ngeta TVS, imodi evamile chokes, ubuhlalu ferrite, kanye capacitors at I / O tixhumanisi.
• Kuvikela: Sebentisa timbonyo tekuvikela etindzaweni letibucayi; kuniketa emaphedi ekubeka phansi ngekunamatsela kwesihlangu.
• I-Crystal neLiwashi: Kute umzila ngaphansi kwemakristalu; sebentisa imikhondo yekugadza futsi ugcine imikhondo yewashi imfisha.

5.4 Umklamo we-HDI PCB

Kute utfole imiklamo lesetulu, I-HDI PCB tebuchwepheshe nge ema-microvias labhobolwe nge-laser, timphumphutse, futsi kungcwatjiwe vias iniketa emandla tintfo letincane tefomu kanye nekucina kwendlela lephakeme. Tintfo letibalulekile leticatshangelwako:

• Silinganiso sesici se-Microvia ngalokuvamile ≤1:1.
• Sebentisa ema-microvia lahlanganisiwe kuze kube netingucuko telucwencwe etindzaweni letinebantfu labanyenti.
• Kulandzelana kwetintfo inchubo ivumela tincenye letinyenti te-microvia.
• Ngekusebentisa-ku-phedi kanye na- kugcwaliswa kwelitfusi futsi kuhlela ngekutsi kube ne-BGA.

6.1 Umklamo we-BGA

Umklamo we-BGA pad uthinta ngco umkhicito we-soldering we- Umhlangano we-PCB futsi Umhlangano we-PCBA, ikakhulukati eticelweni te-BGA letine-pitch lencane.

• Ububanzi bephedi ≈0.8–0.85× ububanzi bebhola (sib., 0.25 mm iphedi yebhola le 0.3 mm).
• Solder imaski kuvulwa enkulu kune pad ngu 0.025-0.05 mm ngalunye.
• NSMD (Imaski Lengasiwo Ekusolder Ichaziwe) nobe SMD (Imaski Yekusondzela Lechaziwe); NSMD levamile ye-BGA lencane-pitch.
• Kuphuma ngekusebentisa 0.2 mm/0.1 mm noma ngaphansi; sebentisa Ngekusebentisa-ku-Phedi kanye na- Kugcwaliswe Litfusi / Kugcwaliswe Iresini kuvikela kutsi solder ingatsatsi.
• Hlanganisa emamaki e-fiducial endzaweni edvute ne BGA kute kubekwe kahle.

6.2 Umklamo we-QFN

Emaphakheji e-QFN (Quad Flat Kute umholi) adzinga umklamo wekucophelela wephedi leshisako.

• Hlukanisa iphedi leshisako ibe ngemaphedi lamancane lamaningi noma usebentise iphedi yinye lenetikhala te stencil letihlukanisiwe kwentela kunciphisa kukhipha sikhala.
• Nweba emaphedi emaphini 0.2–0.3 mm ngale kwemphetho wephakheji yekuhlolwa kwe-AOI.
• Sebentisa Kufakwa kwe Resin nobe Kugcwaliswa kweLitfusi for vias pad kushisa kuvimbela solder wicking.
• Ku-QFN lenemandla lamakhulu, faka lokushisako ngeluhlu kuxhumana netindizamshini telitfusi tangekhatsi.

6.3 0402 / 0201 / 01005 Tincenye letincane

• 0402 sikhala sephedi: 0.4-0.5 mm; 0201: 0.25-0.3 mm; 01005: 0.15-0.2 mm.
• Sebentisa tikhala te-stencil yebhola le-anti-solder (letinema-notch noma letincishisiwe).
• Niketa emamaki lanele e-fiducial ekucinisekeni kwekubeka.
• Cabanga kukhipha iglu for umhlangano double-sided nge tincenye letisindzako.

7.1 Umklamo Wekuvula Kwesitensela

Umklamo wekuvula we-stencil uncuma ngalokucondzile kuphrinta kwe-solder ikhwalithi futsi kufanele kwentiwe kahle ku-PCBA ngayinye.

• Bukhulu beStensili: 0.1–0.15 mm lejwayelekile; 0.08 mm yetincenye letincane; 0.2 mm ngekutsi kube nemandla lamakhulu.
• Silinganiso sendzawo: Indzawo yekuvula / indzawo yelubondza lwekuvula > 0.66.
• Silinganiso sesici: Bubanti bekuvula / bukhulu besitensi > 1.5.
• Tikhala Letikhetsekile: QFN pad lokushisa emafasitelo lamancane lamanyenti; BGA umjikeleto noma sikwele kuncishiswa; anti-solder ibhola notched tincenye chip.
• Cabanga stensela yesinyatselo ngebukhulu betincenye letihlangene (sib., stencil lendze yetindzawo letinemandla lamakhulu, lencane ye-fine-pitch).

7.2 Kugeleta kabusha & Kusolder kwemagagasi

• Kugeleta kabusha kwekusolela: Kuba tincenye te-SMT; kudzinga lokufanele iphrofayli yekushisa (shisisa ngaphambilini, kucwilisa, kugeleta kabusha, kupholisa). Sebentisa kugeleta kabusha kwe-nitrogen kwentela kumantisa lokuncono kanye nekunciphisa i-oxidation.
• Kusolela ngemagagasi: Kuba nge-mbobo (DIP) tincenye kanye SMT glue red inqubo.
• Kukhetsa emagagasi ekusolder: Kusoldering kwendzawo kwetincenye letihamba ngembobo; ilungele emabhodi lahlanganisiwe-ebuchwepheshe.
• Inchubo Lete Umholi: SAC305 inhlanganisela yekusondzela; lokushisa lokusetulu kwekugeleta kabusha 235-250 °C. Kucedvwa kwemhlabatsi lokuvamile kufaka ekhatsi HASL lengenamtholi, VUMA, Litiko Letemlilo Lekutitsandzela, isiliva yekucwilisa, futsi litini lekucwilisa.

7.3 Umhlangano Lohlanganisiwe

Hlanganisa kugeleta kabusha kwe-SMT kanye nekusolder kwegagasi le-DIP, noma usebentise Kufaka-Kunamatsisela (PIP) for nge-imbobo tincenye ku reflow.

8.1 Tindlela Tekubeka Emaphaneli

• V-cut (V-Kushaya): Tindleko letiphansi; emabhodi layindingilizi ngaphandle kwetincenye temphetfo.
• Kulunywa ligundvwane / Imbobo Yesitembu: Kumabhodi langakavami noma tincenye temphetfo; sebentisa umzila wethebhu kanye na- kulunywa ligundvwane.
• Libhuloho + Kulunywa Ligundvwane: Ihlanganisa emandla kanye nekuhlukana kalula.

8.2 Sitimela Semathuluzi Nemamaki Ekwetsembeka

• Ububanzi besitimela sekusebentisa emathuluzi: 3-5 mm.
• Limaki le Fiducial: 1 mm bubanti, 2-3 mm solder mask kuvulwa, igolide noma kucwilisa tin kucedza.
• Tintfo leticinisekisiwe tendzawo tetintfo te-BGA / QFN letine-pitch lencane.

8.3 Usayizi wePhaneli & Linani

• Usayizi wephaneli ngaphakatsi kwemikhawulo yehhavini lekukhetsa-nekubeka kanye nekugeleta kabusha (≤400 mm × 400 mm).
• Kusebenta kahle kwebhalansi kanye nekusetjentiswa kwetintfo; kugwema kugucuka.
• Sebentisa Emathebhu laphukako nobe tikhala leticondzisiwe kunciphisa kucindzeteleka ngesikhatsi sekukhipha emapaneli.

9.1 Hlola Gezi

• DRC kute emaphutsa labulalako.
• Kuhambisana kwebudze besiginali lebalulekile, impedance, sikhala.
• Inethi yamandla ngekubala kanye nemandla lamanje.
• Kulingisa bucotfo besiginali imiphumela ihlangabetana netidzingo temdvwebo wemehlo.

9.2 Hlola i-DFM

• Usayizi wephedi nge-IPC-7351.
• Sikhala setincenye sihlangabetana netidzingo letincane tekukhetsa-nekubeka.
• Lidamu lemaski e-solder, sikrini sesilika, kumaka lokucacile kwe-polarity.
• Kuvuleka kwe-stencil kuhlangabetana nesilinganiso sendzawo.
• Kufaka emaphaneli futsi sitimela semathuluzi lokukhona.

9.3 Hlola i-DFT

• Kuhlanganiswa kwemaphuzu ekuhlola kumanethi labalulekile.
• Emaphuzu ekuhlola angavinjelwa.
• Kukhonakala kwekulungiswa kwe-ICT.

9.4 Hlola Umhlangano

• Tooling sitimela kanye nemamaki e-fiducial akhona.
• Indlela yekubeka emaphaneli inengcondvo.
• Ibanga lencenye kusuka ku-V-cut ≥0.5 mm.

9.5 Kuphelela kwemibhalo

• Gerber ungqimba emagama ejwayelekile.
• BOM inombolo yencenye, emaphakheji, emanani anembile.
• Khetsa & beka ifayela lehambisana ne-BOM.
• Ifayela le-stencil lihambisana nemklamo we-PCB.

Kumikhicito lendzala noma lengasasebenti Emabhodi esekhethi e-PCBA, PCBA ubunjiniyela emuva ingaphindze idale emafayela e-schematics, i-BOM, kanye ne-Gerber kusuka kumabhodi labonakalako bese ihlanganisa idatha lebuyiselwe ku- Umklamo we-PCB futsi Umhlangano we-PCBA kuhamba kwemsebenti.

Inchubo yetfu yebunjiniyela lobubuyela emuva ifaka ekhatsi:

• Kutsatfwa kwemifanekiso yebhodi kanye nekuhlolwa kwe-X-ray kufaka emabalave etinhlayiya tangekhatsi.
• Kukhonjwa kwetincenye kanye nekukhishwa kwe-BOM kufaka ekhatsi tincenye letingasasebenti letifakwe esikhundleni sato.
• Kubanjwa kweluhlelo kusuka ekwakhiweni kabusha kwe-netlist.
• Kuhleleka kwe-PCB kutijabulisa ngekutfutfukiswa kwe-DFM.
• Umhlangano we-PCBA wesibonelo kanye nekuhlolwa kwekusebenta.

Tinsita letengetiwe letinelinani lelengetiwe:

• Kugcobisa lokuhambisanako ngetindzawo letilukhuni.
• Kufaka emabhodwe kanye nekufaka ngekumelana nekudvudvuta.
• Gcwalisa ngaphansi emaphakheji e-BGA kanye ne-CSP.
• Sebenta kabusha futsi ulungise kusebentisa siteshi sekusebenta kabusha se-BGA.
• Kutfutfukiswa kwekuhlolwa lokusebenta nge PCBA yesiko.