Bupange bwa PCBA butalika a Kujata kwachifanikisyo, kutobelwa a Kubikkwa kwa PCB, Nzila, DRC (Kulanga-langa Milawu Yakubamba), lubo DFM Check, mpawo zyazwa Mafayela aa Gerber, NC Drill Mafayela, BOM (Bbilo lyaZintu), lubo Kubunganya Zifwanikiso. Kuzintu zikatazya kumvwisisisya, HDI PCB tekinoloji a ma microvias aakaboola a laser lubo kubamba zintu zitobelana inga kwayandika.

Mafayela aakusaanguna abikkilizya:

• Netlist
• Kuzekaula Kwaminchina
• Pepa lya data lyazibeela
• lugwalo lwakukonzya kuchita (bupati bwachikozyano/kusiyana, bupati bwamugoti buniini, bupati bwadamu lyakukwabilila, ziyandikana zyakukwabilila)

Ma fayila aazwa mukati abikkilizya:

• Gerber RS-274X naakuti ODB++
• NC Drill File
• Kobweza akubikka fayela
• Stencil Gerber
• Lipooti Yamasunko
• Kubunganya Zifwanikiso & Fayela lya Silkscreen

2.1 Njiisyo zyakubikkwa

Kubikka ntalisyo yabupange bwa PCBA mpawo ilajatikizya Bubotu bwakutola twaambo, Kubeleka Kwakupya, lubo Kukonzya kupanga. Kubikka kabotu nchintu chipati loko kweendelezya PCB mabambe antoomwe amaseketi aadijitali aafwambaana.

• Kwaandaanya kwakubeleka: Aandaanya analog, digital, power, antoomwe a interface iifwambaana kuchitila kutabilila kunyongana.
• Kweenda kwaChitondeezyo: Bika zibeela munzila yeenda kwachitondezyo kuchitila kuti kutabi busena bwakuzabuka akuzyunguluka.
• Chintu chiyandikana loko: Bika MCU/FPGA/SoC, DDR, woola, antoomwe ama modules aanguzu kunembo.
• Kubikka kumbali: Zijatikizyo, mabbatani, ama LED afwaafwi ambali aamabboodi kuti zizuzikizye ziyandikana.
• Kubamba kwakupya: Zibeela zyanguzu zipati afwaafwi anzila zyakugwisya kupya naa zikwabilizyo zyakupya; yungizya kupya kwiinda muma array munsi lyazibeela zipya.

2.2 Nzila ziyandikana

• Bulamfu Bwakutobelezya Aanguzu Zyalino: 0.5 mm bupati bwa 1 oz yamukuba ilaa 1 A. Kuti ubelesye manguzu manji, kobelesya mukuba naakuti zintu zilemu zyamukuba zilemu.
• Zyobile Ziimpene: USB, HDMI, LVDS, Ethernet ziyandika Kukozyanya kwabulamfu, Kusiyana Kweelene, lubo Kuswaangana kuyumu kubamba kusyomeka kwachitondezyo akucesya kusweekelwa kwakunjizya lubo kujokezya kusweekelwa.
• Impedance yeendelezyegwa: Zitondeezyo zyakufwambaana ziyandika impedance iibalilwa kuzwa ku stack-up; mpindu zizibilikide zili 50 Ω zyamamanino omwe antoomwe a 100 Ω zyaandeene. Ikulanga-langa kwabu injiniya kweelede kubikkilizya kweendelezya kwakukazya kusinizya.
• Nzila yakujokela: Bona kuti ndeke yakulanga izulide kuchitila kutabilila mapenzi aa EMI aaandaanizyidwe; yungizya nzila zyakusonka afwaafwi akusanduka kwazibeela.
• Kwiinda: Kucesya nzila zifwambaana; belesya Kuboola musule naakuti Boofwu/Bazikkidwe Vias kuti kwayandika. Kumabambe aa HDI, kobelesya nzila zibikkidwe antoomwe naakuti nzila zitazungaani aamwi kuzuzya mukuba.

DFM iitali kabotu isololela ku Kuswaanganya, Kubikka mabwe, Zibeela Zyakubelesya Kutontola, Kuchincha kwazibeela, lubo Mabbola aa Solder. Kuvwuntauzya kwa DFM kakutanaba kupanga zintu zyiingi kulagwasya kukwabilila zyakulya zyakusaanguna.

3.1 Kubamba Nyika

Nzila zyanyika zyeelede kweendelana IPC-7351. Kubamba kabotu ma pad nchintu chipati loko kuti kube kusyomeka Kubunganya PCB lubo PCBA assembly.

• CHIP Components (0402, 0603, 0805): Bupati bwachipepa bweelede kweendelana akujula kwa stencil antoomwe a reflow profile kuchitila kutabilila tombbwe.
• QFN (Quad Flat No-lead): Munsi Ibbaaji lyakupya kweelede kwaandaanizyigwa kuchitila kuti kutabi kuzwa kwamaanzi akutontola; belesya chivwumbyo chakusofwaazya chakapandululwa (SMD) naakuti chivwumbyo chitali chakusowa (NSMD) ma pads munzila yeelede.
• BGA (Ball Grid Array): Bulamfu bwa bbola buli akati ka 80-85% bwabwamba bwa bbola; kujalula kwachivwumbyo chakusolder kweelede kuba kabotu kuchitila kutabilila chivwumbyo chakusolder aachipekupeku. Kuli BGA iili kabotu, kobelesya solder mask damu bupati ≤0.1 mm naakuti kugwisya damu kuti kwayandika.
• SOT/SOP/QFP: Ikugolela kubotu kuyandika bupati bwadamu lyama solder mask kutegwa kutabi kujatana.

3.2 Kusiyana kwazibeela akuzibikka

• Kusiyana kwazibeela zili afwaafwi kweelede kuzuzikizya ziyandikana zyakubweza akubikka mulomo akubambulula (≥0.3 mm).
• Bikka zibeela zikozyania munzila yomwe kuchitila kuti kube kuuba kulanga AOI.
• Bikka musinzo uuzulide aakati kazibeela zilamfu azifwiifwi kuchitila kutabilila mumvwula muchiindi chakujokela.

3.3 Chivwumbyo chakusolizya antoomwe achikwabilizyo chasilika

• Damu lya Solder Mask bupati ≥0.1 mm kuchitila kutabilila kujatana.
• Silika teelede kuvwumbilila mapepa; bamba ≥0.2 mm kuzwa.
• Kulemba kwa Polarity, Chitondeezyo cha Pin 1, lubo Sikulemba kweelede kusalala.
• Sala mubala wachisoti (sokwe, bbululu, mubala muubauba, mubala uusalala pyu, uutuba) kweendelanya akuyanda kwabasikuula; kusinizya kuti kusimba kwa legend kulabalwa.

4.1 DFT

DFT ilagwasya kuti PCBA ichite obotu, iitayandiki mali manji mpawo ilagwasyilizya kubamba mapulogilamu aakusunka akubamba zibelesyo.

• Kusunkwa kwakuvwuntauzya kwakuuluka: Taakwe chintu chiyandika; chilikabotu kuzibelesyo zyakusaanguna antoomwe atubunga tuniini.
• ICT (In-Circuit Test): Kuyanda masena aakusunka azibelesyo; zileelela kujwi pati. Tulapanga nzila zyakusunka alukwabililo luzulide.
• FCT (Kusunkwa Kwanzila Iibeleka): Kusinizya kuti PCBA ibelekela kabotu.
• Kulanga-langa munyinza (JTAG): Ibelesya nzila yakusunka chip yakayakidwe mukati kuchitila kuti kuchesye twaambo twamasunko.

Zyakuyanda zya DFT:

• Bupati bwabusena bwakusunka ≥0.8 mm, kwaandaana ≥1.27 mm.
• Aaba twaambo twamasunko kulubazu lumwi kuti kacikonzyeka.
• Bikka masena aakusunka kuti kaatakwe ntenda mpawo akale kule azibeela zilamfwu.
• Bikka masena aakusunka manguzu aansi kuchitila kuti musunko mufwaafwi wakuzima manguzu lubo kupima nguzu zyamagesi.

4.2 DFA

DFA ibikkila maanu kukubunganya kabotu akukwabilila kulubizya.

• Kubikka antoomwe: Belesya V-cut (V-Scoring) naakuti Kulumwa kwa mbeba / Mulyango wakusimba. Cha pcb assembly azibeela zilengaana, kobelesya nzila ya tab akulumwa mbeba.
• Nzila yakubelesya zibelesyo: 3-5 mm mubufwaafwi bwakutola akubikka.
• Fiducial Mark: Kusikila kuli 2-3 zyanyika yoonse; zisyomezyo zyamumunzi zyazibelesyo zyamajwi mabotu mbuli BGA a QFN.
• Poka-Yoke: Bona kuti zijatikizyo zilijisi busena bulibedelede kutegwa kutabi kunjizigwa kwakujokela musule.

5.1 Kusyomeka kwaChitondeezyo (SI)

makani aa SI abikkilizya Limwi bbazu, Kwaambulana, Kuyinda, Kufwusa ansi, lubo Kuchincha kwachiindi. Kufwambaana Bupange bwa PCB ulakonzya kubelesya kweezyanisya kakutanaba kubamba lubo kusinizya kwakumbele kulanga-langa mufanikisyo wameso.

• Kweezyanisya kwa Impedance: Kumanizya kwazibeela zyakusaanguna, kumanizya kwakukozyanya, naa kumanizya kwa AC.
• Kukozyanya kwabulamfu: Nzila ya Serpentine ya DDR data/makkeyala atubunga twaandeene.
• Kusinkilila Kwaambuuzyania: 3W mulawu (kusiyana ≥3× bupati bwakutobela); koyungizya zitondezyo zyakukwabilila zitondezyo zipati.
• Kujokela Kwiinda: Bikka nzila zyakusonka afwaafwi akusanduka kwazibeela kuchitila kuti uchesezye kujatana.

5.2 Kusyomeka kwanguzu (PI)

twaambo twa PI tubikkilizya Muzuzumo waNguzu, Kudonkola kwanguzu, lubo Kuzuza kwaansi. yakapangwa obotu Nzila Yakwaabila Nguzu (PDN) nchintu chipati loko kuti kube kubeleka kabotu.

• Kugwisya Chitondeezyo: Bika 0.1 µF + 10 µF misanganisyo afwaafwi a pini yanguzu imwi aimwi; belesya low-ESL capacitors yakugwisya zyintu zyiingi.
• Kwaandaanya Ndeke Yanguzu: Ndeke zyanguzu zyaandeene zya analog a digital; kotantamuka kuzabuka zibeela zijisi zitondezyo zyakufwambaana.
• Nzila ya Impedance nsyoonto: Nguzu zili afwaafwi antoomwe aandeke zyaansi zipa kuti ndeke ibe aanguzu; bamba dielectric iiteteete aakati kamanguzu anyika.
• Kwiinda mukubala: Nzila zyiingi zikozyenye zyamagesi manji; belesya nzila zizwide mukuba kunzila zyamagesi manji.

5.3 EMC (Kweendelana Kwamagesi)

EMC ilavwumba EMI (Kunyonganya Kwamagesi) lubo EMS (Kukonzya kubelesya magesi). Kulanga-langa kwa EMC kakutanaba kutobela milawu kulakonzya kujana ntenda zyakupanga kakutanaba kusunkwa.

• 20H Mulawu: Bikka mibalo yamagesi a 20× kwaandaana kwamisela kuchitila kuti kutabi kusiyana.
• Kusefa nzila zyakubelesya: Bikka TVS, zikwabilizyo zyamumuni, ma ferrite beads, antoomwe ama capacitors ku I/O connectors.
• Kukwabilila: Belesya zivwunisyo zyakukwabilila mumasena aatali kabotu; janisya ma padi aakubikkila ansi chakujatilila ntobo.
• Crystal & Clock: Kunyina kweenda munsi aamakristalu; kobelesya nzila zyakukwabilila mpawo ubambe nzila zyawoola kuti zifwiifwi.

5.4 HDI PCB Design

Kuli zintu zijisi bunji bwazintu, HDI PCB tekinoloji a ma microvias aakaboola a laser, nzila zitaboni, lubo nzila zyazikkwa ilakonzya kuchita kuti kube zintu ziche akuti kube nzila zyiingi. Zintu zipati zyakuyeeyela:

• Microvia aspect ratio kanjikanji ≤1:1.
• Belesya ma microvias aabikkidwe antoomwe kuchincha kwazibeela mumasena aajisi bantu biingi.
• Kubamba zintu zitobelana nzila izumizya zibeela zyiingi zya microvia.
• Kwiinda-mu-pad aamwi kuzuzya mukuba lubo kubamba ku BGA fanout.

6.1 BGA Design

Bupange bwa BGA pad bulakonzya kugwasya kusofwaazya Kubunganya PCB lubo PCBA assembly, ikapati mumapulogilamu aa BGA aajisi jwi libotu.

• Bulamfu bwabbola ≈0.8–0.85× bupati bwabbola (nkokuti, 0.25 mm bbola lya 0.3 mm).
• Kujula kwachivwumbyo chipati kwiinda 0.025-0.05 mm kulubazu lomwe.
• NSMD (Non-Solder Mask Defined) naakuti SMD (Solder Mask Defined); NSMD ilidumide ku BGA yamajwi mabotu.
• Fanout vias 0.2 mm/0.1 mm naa munsi; belesya Kwiinda-mu-Pad aamwi Kuzula Mukuba / Kuzula Nsamu kuchitila kutabilila kugwisigwa kwa solder.
• Yungizya zitondezyo zyakusyomeka zyamumunzi afwaafwi a BGA kuti ubikkwe kabotu.

6.2 QFN Design

Ma QFN (Quad Flat No-lead) ma packages ayanda kubamba kabotu thermal pad.

• Aandaanya kapepa kakupya kuba tupepa tuniini tunji naakuti ubelesye kapepa komwe kajisi zibeela zya stencil apertures kuchitila kuti kutabi kuvwundauka.
• Koyungizya mapini 0.2-0.3 mm kwiinda mumbali aabbokesi kuti ubone AOI.
• Belesya Kujala kwa Resin naakuti Kuzuzya Mukuba zya thermal pad vias kuchitila kutabilila kugwisigwa kwa solder.
• Ku QFN iilaanguzu kapati, bika kupya kwiinda mumulongo kuswaangana aandeke zyamukuba zyamukati.

6.3 0402 / 0201 / 01005 Zibeela Ziniini

• 0402 kwaandaana: 0.4–0.5 mm; 0201: 0.25–0.3 mm; 01005: 0.15–0.2 mm.
• Belesya zibelesyo zikwabilila bbola (zijisi zilonda naa ziceede).
• Amupe zitondezyo zyakusyomeka zizulide kuti kube kululama kwakubikkwa.
• Ziyeesesye kupa gluu kubunganya kwamabazu obile azibeela zilemu.

7.1 Kubamba nzila yakuvwungulula

Bupange bwakuvwungulula stencil bulasala kusimba kwa solder bubotu alimwi bweelede kuchitwa kabotu kuli PCBA imwi aimwi.

• Bupati bwa Stencil: 0.1–0.15 mm chili kabotu; 0.08 mm kuzibeela ziche; 0.2 mm kuti kube manguzu manji.
• Mweelwe wabusena: Busena bwakujula / busena bwabwaanda bwakujula > 0.66.
• Mweelwe wa Aspect Ratio: Bulamfu bwamulyango / bupati bwa stencil > 1.5.
• Zijaluzyo Zyaalubazu: QFN thermal pad mawindo manji masyoonto; BGA muzunguluko naakuti sikweya kucesya; bbola lya anti-solder lijisi zipulo zyazibeela zya chip.
• Ziyeesesye chitondeezyo cha ntaamu kuzibeela zisanganizidwe (nkokuti, chitondeezyo chilemu kumasena ajisi magesi manji, chitete kumasena aajisi jwi libotu).

7.2 Kujokela alimwi akuswaanganya kwamayuwe

• Kusofwaazya: Kuzibeela zya SMT; kuyandika chiimo chakupya (kupya, kutontozya, kujokezya, kutontozya). Belesya kujokela kwa nitrogen kuti kube kuteta kabotu akugwisya muya.
• Kusofwaazya kwamayuwe: Kuzibeela zya through-hole (DIP) anzila ya SMT red glue.
• Kusalazya Kwawave: Kusofwaazya kwabusena bwazibeela zyamumulyango; chilikabotu kumabboodi aatekinoloji iiswaangene.
• Nzila Iitakwe Lead: SAC305 nsimbi yakubelesya; kupya kwakujokela 235-250 °C. Kumaninizya kwaatala kwadumide kubikkilizya HASL iitakwe lead, ZUMINANA, Basikulisungula Basikuzimya Mulilo, nsiliva yakubbizya, lubo tini lyakubbizya.

7.3 Kubunganya Kusanganya

Swaanganya SMT reflow antoomwe a DIP wave soldering, naakuti ubelesye Pin-in-Paste (PIP) kuzibeela zyamugoti mu reflow.

8.1 Nzila zyakubelesya

• V-cut (V-Scoring): Muulo muniini; kumabboodi aali mbuli bbola aatakwe zibeela zyakumbali.
• Kulumwa kwa mbeba / Mulyango wakusimba: Kumabboodi aatali kabotu naakuti zibeela zyamumbali; belesya nzila ya tab aamwi kuluma mbeba.
• Bbulogwe + Kulumwa kwa Mbeba: Kuswaanganya manguzu akuubauba kwakwaandaanya.

8.2 Tooling Rail & Fiducial Mark

• Bulamfu bwanzila yakubelesya: 3-5 mm.
• Chitondeezyo cha Fiducial: 1 mm mubwamba, 2-3 mm chivwunisyo chakujalula, ngolida naakuti kumanizya.
• Zisyomezyo zyamumunzi zya BGA/QFN minchina yamajwi mabotu.

8.3 Bupati bwa Paneli a Mweelwe

• Bupati bwabbokesi buli mukati kazeezyo zyakubweza-a-kubikka akujokolosya oveni (≤400 mm × 400 mm).
• Kubamba kabotu akubelesya zintu; kutantamuka kutyompokelwa.
• Belesya ma tabs aaandaanizyidwe naakuti zibeela zyakabikkwa kuchesya penzi muchiindi chakubelesya.

9.1 Kulanga-langa magesi

• DRC kunyina kulubizya kupati.
• Kukozyanya kwabulamfu bwachitondezyo, impedance, kwaandaana.
• Nguzu zyakubelesya kwiinda mukubala anguzu zyamazubaano.
• Kweezyanisya kusyomeka kwachitondezyo mpindu zilazuzikizya ziyandikana mufanikisyo wameso.

9.2 DFM Check

• Bupati bwapadi kweendelana a IPC-7351.
• Kusiyana kwazibeela kulazuzikizya ziyandikana zyakubweza akubikka.
• Kusoda chisinkilizyo, silika, chitondezyo cha polarity chisalala.
• Kuvwunguluka kwa stencil kulaswaangana abwaanda bwabusena.
• Kubikka antoomwe lubo nzila yakubelesya zibelesyo lino.

9.3 DFT Check

• Kuvwumbililwa kwamapointi aakusunka aama neti mapati.
• Twaambo twakusunkwa tatukasinkilidwe pe.
• Kukonzyeka kwakubelesya ICT.

9.4 Kulanga-langa Kubungana

• Inzila yakubelesya zibelesyo azitondezyo zya fiducial ziliwo.
• Nzila yakubamba bantu ililuzi.
• Kulampa kwacibeela kuzwa ku V-cut ≥0.5 mm.

9.5 Kuzula kwamalembe

• Kupa zina lya Gerber kwakazumizyigwa.
• BOM namba zyazibeela, mapakeji, mweelwe uliluzi.
• Kobweza akubikka fayela zyeendelana a BOM.
• Fayela lya stencil lileendelana abubambe bwa PCB.

Kuzintu zyakale naakuti zitabeleki Mabboodi aa PCBA, PCBA reverse engineering ulakonzya kupanga alimwi ma schematics, BOM, antoomwe ama fayila aa Gerber kuzwa kumabboodi aamubili mpawo waswaanizya data yakabwezegwa kuli mpya Bupange bwa PCB lubo PCBA assembly kweenda kwamulimu.

Nzila yesu yakujokela musyule ibikkilizya:

• Kufotozya bboodi akulanga-langa X-ray kubamba zibeela zyamukati.
• Kuziba zibeela akugwisya BOM kubikkilizya akucinca zibeela zitabeleki.
• Kujata kwachikozyano kuzwa kukuyakulula kwa netlist.
• Kubamba PCB zyakulikondelezya antoomwe akusumpuka kwa DFM.
• Chitondeezyo cha PCBA assembly akusunkwa kwakubeleka.

Imwi milimu iiyungizya mpindu:

• Kuvwumba kweendelana kubusena bukatazya.
• Kubika akubikka mubbokesi nkaambo kakukazya kuzungaana.
• Kuzuzya ansi zya BGA antoomwe a CSP.
• Kubeleka alimwi akubambulula kubelesya chiteshi chakubambulula BGA.
• Kupanga musunko uubeleka ya PCBA yachiyandisyo.